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21. 发明申请

US20110217794A1 MICROELECTRONIC WORKPIECE PROCESSING SYSTEMS AND ASSOCIATED METHODS OF COLOR CORRECTION 有权
标题翻译：微电子工件加工系统及相关的颜色校正方法
公开(公告)号：US20110217794A1
公开(公告)日：2011-09-08
申请号：US12715820
申请日：2010-03-02
申请人： Kevin Tetz , Charles M. Watkins
发明人： Kevin Tetz , Charles M. Watkins
IPC分类号： H01L21/66 , B05C11/00
CPC分类号： H01L33/005 , B05C11/00
摘要： Several embodiments of semiconductor systems and associated methods of color corrections are disclosed herein. In one embodiment, a method for producing a light emitting diode (LED) includes forming an (LED) on a substrate, measuring a base emission characteristic of the formed LED, and selecting a phosphor based on the measured base emission characteristic of the formed LED such that a combined emission from the LED and the phosphor at least approximates white light. The method further includes introducing the selected phosphor onto the LED via, for example, inkjet printing.
摘要翻译：本文公开了半导体系统的几个实施例和颜色校正的相关联的方法。在一个实施例中，一种制造发光二极管（LED）的方法包括在衬底上形成（LED），测量形成的LED的基极发射特性，并且基于所形成的LED的测量的基极发射特性来选择荧光体使得来自LED和磷光体的组合发射至少近似于白光。该方法还包括通过例如喷墨印刷将所选择的荧光体引入到LED上。

22. 发明授权

US07442643B2 Methods of forming conductive elements using organometallic layers and flowable, curable conductive materials 有权
标题翻译：使用有机金属层和可流动的可固化导电材料形成导电元件的方法
公开(公告)号：US07442643B2
公开(公告)日：2008-10-28
申请号：US11336540
申请日：2006-01-20
申请人： Alan G. Wood , Warren M. Farnworth , Charles M. Watkins , Peter A. Benson
发明人： Alan G. Wood , Warren M. Farnworth , Charles M. Watkins , Peter A. Benson
IPC分类号： H01L21/44 , H01L23/58
CPC分类号： H01L27/14685 , B33Y10/00 , B33Y80/00 , H01L21/56 , H01L23/3128 , H01L27/14618 , H01L27/14627 , H01L2224/04105 , H01L2224/20 , H01L2924/01005 , H01L2924/01027 , H01L2924/01046 , H01L2924/12041
摘要： A conductive element is formed on a substrate by forming an organometallic layer on at least a portion of a surface of the substrate, heating a portion of the organometallic layer, and removing an unheated portion of the organometallic layer. In other methods, a flowable, uncured conductive material may be deposited on a surface of the substrate, the flowable, uncured conductive material may be selectively cured over at least a portion of the surface of the substrate, and a portion of the cured conductive material may be removed. A conductive via is formed by forming a hole at least partially through a thickness of a substrate, depositing an organometallic material within at least a portion of the hole, and selectively heating at least a portion of the organometallic material.
摘要翻译：通过在基板表面的至少一部分上形成有机金属层，加热部分有机金属层，去除有机金属层的未加热部分，在基板上形成导电元件。在其他方法中，可流动的未固化的导电材料可以沉积在基底的表面上，可流动的未固化的导电材料可以选择性地固化在基底表面的至少一部分上，并且一部分固化的导电材料可能被删除。通过至少部分地穿过衬底的厚度形成孔，在孔的至少一部分内沉积有机金属材料并选择性地加热至少一部分有机金属材料来形成导电通孔。

23. 发明授权

US07439169B2 Integrated circuit and methods of redistributing bondpad locations 失效
标题翻译：集成电路和重新分配键盘位置的方法
公开(公告)号：US07439169B2
公开(公告)日：2008-10-21
申请号：US11445813
申请日：2006-06-02
申请人： Charles M. Watkins
发明人： Charles M. Watkins
IPC分类号： H01L21/00
CPC分类号： H01L23/525 , H01L23/3114 , H01L2924/0002 , H01L2924/00
摘要： Integrated circuits and methods of redistributing bondpad locations are disclosed. In one implementation, a method of redistributing a bondpad location of an integrated circuit includes providing an integrated circuit comprising an inner lead bondpad. A first insulative passivation layer is formed over the integrated circuit. A bondpad-redistribution line is formed over the first insulative passivation layer and in electrical connection with the inner lead bondpad through the first insulative passivation layer. The bondpad-redistribution line includes an outer lead bondpad area. A second insulative passivation layer is formed over the integrated circuit and the bondpad-redistribution line. The second insulative passivation layer is formed to have a sidewall outline at least a portion of which is proximate to and conforms to at least a portion of the bondpad-redistribution line. Other aspects and implementations are contemplated.
摘要翻译：公开了重新分配焊盘位置的集成电路和方法。在一个实现中，重新分配集成电路的接合板位置的方法包括提供包括内部引线接合板的集成电路。在集成电路上形成第一绝缘钝化层。在第一绝缘钝化层上形成键合 - 再分配线，并通过第一绝缘钝化层与内部引线键合电连接。键盘 - 再分配线包括外部引线键合区域。第二绝缘钝化层形成在集成电路和键合 - 再分配线上。第二绝缘钝化层形成为具有侧壁轮廓，其侧面轮廓的至少一部分接近并符合键合 - 再分配线的至少一部分。考虑了其他方面和实现。

24. 发明授权

US07265330B2 Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers 有权
标题翻译：具有光学器件的微电子成像器和制造这种微电子成像器的方法
公开(公告)号：US07265330B2
公开(公告)日：2007-09-04
申请号：US11476015
申请日：2006-06-28
申请人： Warren M. Farnworth , Sidney B. Rigg , William Mark Hiatt , Alan G. Wood , Peter A. Benson , James M. Wark , David R. Hembree , Kyle K. Kirby , Charles M. Watkins , Salman Akram
发明人： Warren M. Farnworth , Sidney B. Rigg , William Mark Hiatt , Alan G. Wood , Peter A. Benson , James M. Wark , David R. Hembree , Kyle K. Kirby , Charles M. Watkins , Salman Akram
IPC分类号： H01L27/00 , H01L31/0232
CPC分类号： H01L27/00 , B33Y80/00 , H01L27/14618 , H01L27/14625 , H01L27/14683 , H01L27/14687 , H01L2224/48091 , H01L2224/48227 , H01L2924/01077 , H01L2924/01078 , H01L2924/00014
摘要： Microelectronic imager assemblies comprising a workpiece including a substrate and a plurality of imaging dies on and/or in the substrate. The substrate includes a front side and a back side, and the imaging dies comprise imaging sensors at the front side of the substrate and external contacts operatively coupled to the image sensors. The microelectronic imager assembly further comprises optics supports superimposed relative to the imaging dies. The optics supports can be directly on the substrate or on a cover over the substrate. Individual optics supports can have (a) an opening aligned with one of the image sensors, and (b) a bearing element at a reference distance from the image sensor. The microelectronic imager assembly can further include optical devices mounted or otherwise carried by the optics supports.
摘要翻译：微电子成像器组件包括包括衬底的工件和在衬底上和/或衬底中的多个成像管芯。基板包括前侧和后侧，并且成像管芯包括在基板的前侧的成像传感器和可操作地耦合到图像传感器的外部触点。微电子成像器组件还包括相对于成像管芯叠加的光学支架。光学支撑件可以直接在基板上或衬底上的盖上。单个光学支撑件可以具有（a）与图像传感器中的一个对准的开口，以及（b）与图像传感器相距一定距离处的轴承元件。微电子成像器组件还可以包括由光学器件支撑件安装或以其它方式承载的光学器件。

25. 发明授权

US07021982B2 Manufacturing of field emission display screens by application of phosphor particles and conductive binders 失效
标题翻译：通过应用荧光体颗粒和导电粘合剂制造场致发射显示屏
公开(公告)号：US07021982B2
公开(公告)日：2006-04-04
申请号：US10042749
申请日：2002-12-04
申请人： Surjit S. Chadha , Charles M. Watkins
发明人： Surjit S. Chadha , Charles M. Watkins
IPC分类号： H01J9/20 , H01J9/22
CPC分类号： C09K11/02 , C09K11/08 , H01J2329/00
摘要： Conductive or semiconductive binders, both inorganic and organic, are used for providing sufficient binding action to hold powder phosphor particles together, as well as to the glass screen of a field emission display device.
摘要翻译：无机和有机的导电或半导体粘合剂用于提供足够的结合作用以将粉末荧光体颗粒保持在一起，以及场发射显示装置的玻璃屏幕。

26. 发明授权

US06429582B1 Display device with grille having getter material 有权
标题翻译：带格栅的显示装置具有吸气材料
公开(公告)号：US06429582B1
公开(公告)日：2002-08-06
申请号：US09535704
申请日：2000-03-27
申请人： Charles M. Watkins , David A. Cathey
发明人： Charles M. Watkins , David A. Cathey
IPC分类号： H01J172
CPC分类号： H01J9/20 , H01J29/085 , H01J29/94
摘要： A field emission display has an anode with a grille made at least in part of a getter material. The grille defines regions that are coated with phosphor to form pixels, and also getters free molecules within a sealed display. The getter material can alternatively be formed directly on at least a part of the grille, or over the grille on an intermediate layer.
摘要翻译：场致发射显示器具有至少部分吸气材料制成的格栅的阳极。格栅限定了用磷光体涂覆以形成像素的区域，并且还在密封显示器内吸收自由分子。吸气材料可替代地直接形成在格栅的至少一部分上，或者形成在中间层上的格栅上。

27. 发明授权

US06361391B1 Fiber spacers in large area vacuum displays and method for manufacture of same 有权
公开(公告)号：US06361391B1
公开(公告)日：2002-03-26
申请号：US09775457
申请日：2001-02-02
申请人： David A. Cathey , Charles M. Watkins , Darryl M. Stansbury , James J. Hofman , Robert T. Rasmussen , Surjit S. Chadha
发明人： David A. Cathey , Charles M. Watkins , Darryl M. Stansbury , James J. Hofman , Robert T. Rasmussen , Surjit S. Chadha
IPC分类号： H01J924
摘要： A process is provided for forming spacers useful in large area displays. The process comprises steps of : forming bundles or boules comprising fiber strands which are held together with a binder; slicing the bundles or boules into slices; adhering the slices on an electrode plate of the display; and removing the binder. In the step of forming bundles or boules comprising fiber strands, the function of the binder is initially or fully performed by glass tubings surrounding the glass fibers. The clad glass of the envelopes etches more readily than the core glass.

28. 发明授权

US6037711A Flat panel display anode that reduces the reflectance of ambient light 失效
标题翻译：平板显示器阳极，降低环境光的反射率
公开(公告)号：US6037711A
公开(公告)日：2000-03-14
申请号：US781830
申请日：1997-01-10
申请人： David A. Cathey , Charles M. Watkins , James J. Hofmann
发明人： David A. Cathey , Charles M. Watkins , James J. Hofmann
IPC分类号： H01J9/22 , H01J29/08 , H01J29/18 , H01J29/89 , H01J31/12 , H01J19/24
CPC分类号： H01J29/896 , H01J29/085 , H01J31/127 , H01J2329/08 , H01J2329/892
摘要： An anode of a flat panel display has a glass substrate, a patterned black grille on the substrate, a conductive layer covering the grille and the substrate, a phosphor layer covering, and one or more additional transparent layers that reduce the reflectance of the flat panel display from 14% down to 1%-4%. These additional layers are placed between the black matrix grille and the substrate, and between the conductive layer and phosphor layer. The two additional layers are selected and designed to reduce the reflectance that occurs at these respective interfaces.
摘要翻译：平板显示器的阳极具有玻璃基板，基板上的图案化黑格栅，覆盖格栅和基板的导电层，覆盖的荧光体层和降低平板的反射率的一个或多个附加透明层从14％下降到1％-4％。这些附加层被放置在黑矩阵格栅和基板之间以及导电层和荧光体层之间。选择和设计两个附加层以减少在这些各个界面处发生的反射率。

29. 发明授权

US5900273A Method for coating a substrate covered with a plurality of spacer members 失效
标题翻译：涂覆有多个间隔件的衬底的方法
公开(公告)号：US5900273A
公开(公告)日：1999-05-04
申请号：US588871
申请日：1996-01-19
申请人： Robert T. Rasmussen , Charles M. Watkins
发明人： Robert T. Rasmussen , Charles M. Watkins
IPC分类号： B05C5/02 , B05C9/02 , B05D1/28 , H01J29/88 , B05D1/26
CPC分类号： H01J29/88 , B05C5/0254 , B05C9/02 , B05D1/28 , H01J2209/015 , H01J2329/8625
摘要： The object to be coated is exposed to a controlled rate of dispensing of liquid coating material and the rate of movement of the object is controlled with respect to the dispensing so that it is possible to control the coating thickness and rate of deposit with negligible damage to objects projecting from the surface of the object to be coated. Thus, it is possible to control production speed required to achieve the desired coating thickness with a meniscus coating system.
摘要翻译：待涂覆的物体暴露于液体涂覆材料的控制速度，并且相对于分配物体控制物体的移动速度，使得可以将涂层厚度和沉积速率控制在可忽略的损伤之上物体从待涂覆物体的表面突出。因此，可以通过弯液面涂覆系统控制实现所需涂层厚度所需的生产速度。

30. 发明授权

US5635110A Specialized phosphors prepared by a multi-stage grinding and firing sequence 失效
标题翻译：通过多级研磨和烧制顺序制备的专用荧光粉
公开(公告)号：US5635110A
公开(公告)日：1997-06-03
申请号：US548088
申请日：1995-10-25
申请人： Surjit S. Chadha , Charles M. Watkins
发明人： Surjit S. Chadha , Charles M. Watkins
IPC分类号： C09K11/77 , F21K2/00 , H05B33/14 , C09K11/54 , C09K11/00
CPC分类号： F21K2/00 , C09K11/773 , C09K11/7731 , C09K11/7734 , C09K11/7785 , C09K11/7787 , C09K11/7792 , H05B33/14
摘要： A multi-stage process for preparing a phosphor product includes the stages of selecting precursors of a dopant and a host lattice as the phosphor starting materials, grinding the starting materials in an initial grinding stage for an initial grinding time period to produce an initial ground material having a smaller particle size distribution than the starting materials, firing the initial ground material in an initial firing stage at an initial firing temperature for an initial firing time period to produce an initial fired material, grinding the initial fired material in an intermediate grinding stage for an intermediate grinding time period to produce an intermediate ground material having a smaller particle size than the initial fired material, wherein the intermediate grinding time period is substantially less than the initial grinding time period, firing the intermediate ground material in an intermediate firing stage at an intermediate firing temperature for an intermediate firing time to produce an intermediate fired material, wherein the intermediate firing temperature is substantially greater than the initial firing temperature, grinding the intermediate fired material in a final grinding stage for a final grinding time period to produce a final ground material having a smaller particle size than the intermediate fired material, and firing the final ground material in a final firing stage at a final firing temperature for a final firing time to produce a phosphor product, wherein the final firing time is substantially less than the intermediate firing time.

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