专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

21. 发明授权

US06219238B1 Structure for removably attaching a heat sink to surface mount packages 失效
标题翻译：用于将散热器可拆卸地连接到表面安装封装的结构
公开(公告)号：US06219238B1
公开(公告)日：2001-04-17
申请号：US09307890
申请日：1999-05-10
申请人： Frank E. Andros , Michael A. Gaynes , Hussain Shaukatullah , Wayne R. Storr
发明人： Frank E. Andros , Michael A. Gaynes , Hussain Shaukatullah , Wayne R. Storr
IPC分类号： H05K720
CPC分类号： H01L23/4093 , H01L2224/16 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2924/15311 , Y10T24/45581 , H01L2924/00014
摘要： A structure for removably attaching a heat sink to an electronic package. At least one heat sink engaging member engages a surface of the heat sink opposite a surface of the heat sink engaging the electronic package. At least two heat sink retaining clips extend from opposite sides of the at least one heat sink engaging member. Each retaining clip includes a first arm for extending past a side of the heat sink and a portion of the electronic package and a second arm extending from the first member for engaging the electronic package.
摘要翻译：一种用于将散热器可拆卸地附接到电子封装的结构。至少一个散热器接合构件与散热器的与电子封装件接合的表面相对的表面接合。至少两个散热器保持夹从至少一个散热器接合构件的相对侧延伸。每个固定夹包括一个第一臂，用于延伸穿过散热片的一侧和电子封装的一部分;以及第二臂，从该第一构件延伸以接合该电子封装。

22. 发明授权

US6129804A TFT panel alignment and attachment method and apparatus 失效
标题翻译： TFT面板对准和附接方法和装置
公开(公告)号：US6129804A
公开(公告)日：2000-10-10
申请号：US71675
申请日：1998-05-01
申请人： Michael A. Gaynes , Allan O. Johnson , Ramesh R. Kodnani , Mark V. Pierson , Edward J. Tasillo
发明人： Michael A. Gaynes , Allan O. Johnson , Ramesh R. Kodnani , Mark V. Pierson , Edward J. Tasillo
IPC分类号： B32B37/12 , G02F1/1333 , B32B31/00
CPC分类号： B32B38/18 , G02F1/13336 , B32B37/12 , Y10S345/903 , Y10T156/1089 , Y10T156/109 , Y10T156/1092 , Y10T156/1093 , Y10T156/1754 , Y10T156/1756 , Y10T156/1759
摘要： A system for aligning and attaching together a plurality of thin film transistor tiles for constructing a flat panel display. A coverplate loading station where a coverplate that the tiles are to be attached to is arranged on a coverplate support. A coverplate bonding material dispensing station where a bonding material for bonding the tiles to the coverplate is applied to a surface of the coverplate. A tile placement station where the tiles are arranged on the coverplate. A tile aligning and securing station where the tiles are aligned relative to each other and the coverplate by the tile aligner and where the tiles are at least partially bonded to the coverplate. A tile assembly bonding material dispensing station where a bonding material is applied to a surface of the tiles opposite the side that the coverplate is bonded to. A backplate placement station where a backplate is arranged on the tiles. A backplate aligning and securing station where the backplate is aligned with the tiles and the coverplate and at least partially secured to the tiles A full bonding station where the tiles are fully bonded to the coverplate and the backplate.
摘要翻译：一种用于对准和连接在一起的多个薄膜晶体管瓦片用于构建平板显示器的系统。一个盖板加载站，其中瓦片要附着的盖板布置在盖板支架上。一种覆盖板接合材料分配站，其中用于将瓦片粘合到盖板上的粘合材料施加到盖板的表面。瓦片布置台，其中瓦片布置在盖板上。瓦片对准和固定台，其中瓦片通过瓦片对准器相对于彼此并且盖板对准，并且瓦片至少部分地结合到盖板。一种瓦片组合接合材料分配站，其中粘合材料施加到瓦片与盖板粘合的一侧相反的表面。背板放置台，其中背板设置在瓦片上。背板对准和固定台，其中背板与瓦片和盖板对准并且至少部分地固定到瓦片完全粘合台，其中瓦片完全结合到盖板和背板。

23. 发明授权

US5798050A Process for fabrication of a selectively filled flexible adhesive device for solderless connection of electronic modules to a substrate 失效
标题翻译：用于制造用于将电子模块无焊接连接到基板的选择性填充的柔性粘合装置的工艺
公开(公告)号：US5798050A
公开(公告)日：1998-08-25
申请号：US895536
申请日：1997-07-17
申请人： Michael A. Gaynes , Jaynal A. Molla
发明人： Michael A. Gaynes , Jaynal A. Molla
IPC分类号： H01L21/60 , H01L23/373 , H05K3/20 , H05K3/32 , H05K3/42 , B44C1/22
CPC分类号： H01L24/83 , H01L23/3733 , H01L24/29 , H05K3/323 , H05K3/423 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29386 , H01L2224/29499 , H01L2224/8319 , H01L2224/838 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H05K2201/10378 , H05K2203/0307 , H05K2203/0726 , H05K3/205
摘要： A process for fabrication of an electrically conductive adhesive film having a pattern of microscopic elongate metal particles which extend from one surface to the other to provide an interconnection between confronting conductive metal pads abutting the surface. The particles have sharp ends to penetrate the oxide coating on the conductive metal pads of an electronic module when force is applied to press the module against the film.
摘要翻译：一种用于制造导电粘合剂膜的方法，其具有从一个表面延伸到另一个表面的微观细长金属颗粒的图案，以提供邻接表面的相对的导电金属垫之间的互连。当施加力以将模块压靠在膜上时，颗粒具有尖端以穿透电子模块的导电金属焊盘上的氧化物涂层。

24. 发明授权

US5638597A Manufacturing flexible circuit board assemblies with common heat spreaders 失效
标题翻译：制造具有普通散热器的柔性电路板组件
公开(公告)号：US5638597A
公开(公告)日：1997-06-17
申请号：US476759
申请日：1995-06-07
申请人： Lawrence R. Cutting , Michael A. Gaynes , Eric A. Johnson , Cynthia S. Milkovich , Jeffrey S. Perkins , Mark V. Pierson , Steven E. Poetzinger , Jerzy Zalesinski
发明人： Lawrence R. Cutting , Michael A. Gaynes , Eric A. Johnson , Cynthia S. Milkovich , Jeffrey S. Perkins , Mark V. Pierson , Steven E. Poetzinger , Jerzy Zalesinski
IPC分类号： H01L21/48 , H01L23/367 , H01L23/538 , H05K1/00 , H05K1/02 , H05K1/18 , H05K3/00 , H05K3/12 , H05K3/34 , H05K7/20 , H05K3/36
CPC分类号： H05K7/20454 , H01L21/4857 , H01L21/4867 , H01L23/3672 , H01L23/5387 , H05K1/021 , H05K1/189 , H05K3/0061 , H05K3/1216 , H05K3/4691 , H01L2224/16 , H01L2924/01078 , H01L2924/01322 , H05K1/0298 , H05K1/182 , H05K2201/0154 , H05K2201/09063 , H05K2201/096 , H05K2201/09745 , H05K2201/1056 , H05K2201/2009 , H05K2203/1394 , H05K3/3415 , H05K3/3452 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144
摘要： A multi-layer flexible circuit board has multiple thicker regions to which components are mounted and thinner, more flexible regions with fewer wiring layers through which the board can be bent about a line without bending thicker regions. Surface mount components such as QFP's and flip-chips are mounted on the front side, and surface mount and pin-in-hole components are mounted on the back side of the circuit board at the thick regions. Heat spreaders are laminated to the back sides of thicker regions. The thicker regions have windows in which wire bond chips are mounted on the heat spreader and wire bonded to the front side of the board. A thermally conductive adhesive or grease connects between the tops of the back side components and the bottoms of the cavities. The heat sinks are bolted together and/or to an enclosure frame to improve thermal performance.
摘要翻译：多层柔性电路板具有多个较厚的区域，组件安装在该较厚的区域上，较薄的，更柔性的区域具有较少的布线层，板可围绕线弯曲，而不会弯曲较厚的区域。表面安装部件如QFP和倒装芯片安装在前侧，表面安装和销孔组件安装在电路板的背面，在较厚的区域。散热器层压到较厚区域的背面。较厚的区域具有窗口，其中引线接合芯片安装在散热器上，并且引线键合到板的前侧。导热粘合剂或油脂连接在后侧部件的顶部和空腔的底部之间。散热器螺栓连接在一起和/或连接到外壳框架以改善热性能。

25. 发明授权

US5545465A Circuit board having a defined volume of solder or conductive adhesive deposited at interconnection sites for electrical circuits 失效
标题翻译：具有限定体积的焊料或导电粘合剂的电路板沉积在用于电路的互连位置处
公开(公告)号：US5545465A
公开(公告)日：1996-08-13
申请号：US449029
申请日：1995-05-24
申请人： Michael A. Gaynes , George D. Oxx , Mark V. Pierson , Jerzy Zalesinski
发明人： Michael A. Gaynes , George D. Oxx , Mark V. Pierson , Jerzy Zalesinski
IPC分类号： B05C5/02 , B23K3/06 , H01L21/48 , H01L21/60 , H05K3/12 , H05K3/32 , H05K3/34 , B32B9/00
CPC分类号： H01L24/27 , B23K3/0692 , H01L21/4853 , H01L21/4867 , H01L24/83 , H05K3/1233 , H05K3/3484 , B23K2201/36 , H01L2224/2919 , H01L2224/8319 , H01L2224/838 , H01L2924/01029 , H01L2924/01033 , H01L2924/01077 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/14 , H01L2924/3025 , H05K2201/0989 , H05K2203/0126 , H05K2203/043 , H05K2203/0568 , H05K2203/0577 , H05K3/321 , H05K3/3452 , Y10T29/49165 , Y10T428/24917
摘要： A method of applying bonding agents, such as solder pastes and conductive adhesives, to pad sites in the manufacture of electronic circuits uses a paste injection head. A permanent mask with cavity openings is applied around conductive pads on a carrier. The conductive pads correspond to chip attachment sites. The injection head is brought into contact with a surface of the mask, and pressure is applied to a bonding agent in the injection head. The injection head is then moved over the surface of the mask, filling cavity openings with the bonding agent. The injection head is then removed from the surface of the mask. If a solder paste is used, infrared radiation is applied to filled cavity openings to evaporate a paste flux and reflow solder to form solder balls within the cavity openings projecting above the mask. If a conductive adhesive is used, a stencil is applied to the surface of the mask prior to contacting the mask with said injection head. When the cavity openings are filled, stencil is removed from the mask and the conductive adhesive filling the cavity openings is dried.
摘要翻译：在电子电路的制造中将焊接剂和导电粘合剂等粘合剂施加到焊盘部位的方法使用糊剂注入头。具有腔体开口的永久性掩模施加在载体上的导电焊盘周围。导电垫对应于芯片附接位置。使注射头与掩模的表面接触，并且将压力施加到注射头中的粘合剂。然后将注射头移动到掩模的表面上，用粘合剂填充空腔开口。然后将注射头从掩模的表面去除。如果使用焊膏，则将红外线辐射施加到填充的空腔开口，以蒸发浆料焊剂并回流焊料，以在突出在掩模上方的空腔开口内形成焊球。如果使用导电粘合剂，则在将掩模与所述注射头接触之前，将模板施加到掩模的表面。当腔开口被填充时，将模板从掩模中取出，并且填充空腔开口的导电粘合剂被干燥。

26. 发明授权

US08823164B2 Heatsink attachment module 有权
标题翻译：散热器附件模块
公开(公告)号：US08823164B2
公开(公告)日：2014-09-02
申请号：US13284522
申请日：2011-10-28
申请人： Evan G. Colgan , Michael A. Gaynes , Jeffrey A. Zitz
发明人： Evan G. Colgan , Michael A. Gaynes , Jeffrey A. Zitz
IPC分类号： H01L23/34
CPC分类号： H01L21/50 , H01L23/3128 , H01L23/433 , H01L24/16 , H01L24/32 , H01L24/72 , H01L24/73 , H01L24/90 , H01L24/92 , H01L2224/131 , H01L2224/16225 , H01L2224/32225 , H01L2224/73253 , H01L2224/81815 , H01L2224/83104 , H01L2224/83901 , H01L2224/921 , H01L2924/10253 , H01L2924/15787 , H01L2924/00 , H01L2924/00014 , H01L2924/00012 , H01L2224/83 , H01L2224/90 , H01L2924/014
摘要： A chip packaging apparatus includes a substrate, a load frame attached to the substrate by an adhesive material, the load frame being formed to define an aperture and a semiconductor chip mounted on the substrate within the aperture. A thickness of the adhesive material between the load frame and the substrate is varied and adjusted such that a surface of the load frame opposite the substrate is disposed substantially in parallel to a surface of the chip opposite the substrate.
摘要翻译：芯片封装设备包括基板，通过粘合剂材料附接到基板的负载框架，所述负载框架形成为限定孔和安装在孔内的基板上的半导体芯片。负载框架和基板之间的粘合材料的厚度被改变和调节，使得与基板相对的负载框架的表面基本上平行于与基板相对的芯片的表面平行。

27. 发明申请

US20130199752A1 SEMICONDUCTOR DEVICE COOLING MODULE 有权
标题翻译：半导体器件冷却模块
公开(公告)号：US20130199752A1
公开(公告)日：2013-08-08
申请号：US13368031
申请日：2012-02-07
申请人： Evan G. Colgan , Michael A. Gaynes , Jeffrey A. Zitz
发明人： Evan G. Colgan , Michael A. Gaynes , Jeffrey A. Zitz
IPC分类号： F28F9/007
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A cooling module for cooling a semiconductor is provided and includes a land grid array (LGA) interposer, a substrate with an LGA side and a chip side, a cooler, a load frame attached to the substrate and formed to define an aperture in which the cooler is removably disposable, a spring clamp removably attachable to the load frame and configured to apply force from the load frame to the cooler such that the substrate and the cooler are urged together about the semiconductor and a load assembly device configured to urge the load frame and the LGA interposer together.
摘要翻译：提供了一种用于冷却半导体的冷却模块，其包括平台栅格阵列（LGA）插入器，具有LGA侧和芯片侧的衬底，冷却器，附接到衬底并形成以限定孔径的负载框架冷却器可拆卸地是一次性的，弹簧夹可移除地附接到负载框架并且构造成将力从负载框架施加到冷却器，使得衬底和冷却器围绕半导体被一起被推动在一起;以及负载组件装置，其构造成推动负载框架和LGA插入器在一起。

28. 发明申请

US20130062740A1 TUNABLE RADIATION SOURCE 有权
标题翻译：可辐射源
公开(公告)号：US20130062740A1
公开(公告)日：2013-03-14
申请号：US13230798
申请日：2011-09-12
申请人： Michael A. Gaynes , Michael S. Gordon , Nancy C. LaBianca , Kenneth P. Rodbell
发明人： Michael A. Gaynes , Michael S. Gordon , Nancy C. LaBianca , Kenneth P. Rodbell
IPC分类号： H01L23/556 , G06F17/50 , G06F19/00 , G01R27/28 , H01L21/66
CPC分类号： H01L23/556 , G01R31/2881 , G06F17/5036 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00
摘要： An energy distribution of soft error-inducing radiation likely to be encountered by an electronic circuit during operation is determined. A tuned radiation source having a source energy distribution similar to the determined energy distribution is prepared. The electronic circuit is tested using the tuned radiation source.
摘要翻译：确定在操作期间可能由电子电路遇到的软误差诱发辐射的能量分布。制备具有与所确定的能量分布相似的源能分布的调谐辐射源。使用调谐的辐射源测试电子电路。

29. 发明申请

US20120309132A1 CURVILINEAR HEAT SPREADER/LID WITH IMPROVED HEAT DISSIPATION 审中-公开
标题翻译： CURVILINEAR热传播器/带有改进的散热器
公开(公告)号：US20120309132A1
公开(公告)日：2012-12-06
申请号：US13586421
申请日：2012-08-15
申请人： Michael A. Gaynes , Maurice McGlashan-Powell , Soojae Park , Edward Yarmchuk
发明人： Michael A. Gaynes , Maurice McGlashan-Powell , Soojae Park , Edward Yarmchuk
IPC分类号： B65D51/00 , H01L21/50
CPC分类号： H01L23/42 , H01L2224/05573 , H01L2224/16 , H01L2224/73253 , H01L2924/10253 , H01L2924/3511 , H01L2924/00
摘要： A heat spreader or lid for a microelectronic package, in which the heat spreader has an underside surface that includes at least one curvilinear contour, in which the curvilinear contour is selected from at least one positive or protruding curvilinear feature, at least one negative or recessed curvilinear feature, and a combination thereof. A microelectronic package that includes the heat spreader/lid, in which there is improved heat dissipation or reduced mechanical stress in an interface between the heat spreader/lid and a circuit chip.
摘要翻译：一种用于微电子封装的散热器或盖，其中散热器具有包括至少一个曲线轮廓的下表面，其中曲线轮廓选自至少一个正或突出的曲线特征，至少一个负或凹入曲线特征及其组合。包括散热器/盖的微电子封装，其中在散热器/盖和电路芯片之间的界面中改善了散热或降低了机械应力。

30. 发明申请

US20120119353A1 UNDERFILL METHOD AND CHIP PACKAGE 失效
标题翻译： UNDERFILL方法和芯片包
公开(公告)号：US20120119353A1
公开(公告)日：2012-05-17
申请号：US13358910
申请日：2012-01-26
申请人： Michael A. Gaynes , Rajneesh Kumar , Thomas E. Lombardi , Steve Ostrander
发明人： Michael A. Gaynes , Rajneesh Kumar , Thomas E. Lombardi , Steve Ostrander
IPC分类号： H01L23/28
CPC分类号： H01L21/563 , H01L23/562 , H01L24/32 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/01019 , H01L2924/09701 , H01L2924/00 , H01L2924/3512
摘要： A method of fabricating a chip package is provided. The chip package includes a laminate, a chip and conductive elements interposed between the chip and the laminate by which signals are transmitted among the chip and the laminate. The method includes dispensing a first underfill in a space defined between opposing faces of the chip and the laminate and dispensing a second underfill at least at a portion of an edge of the chip, the second underfill including a high aspect ratio material.
摘要翻译：提供一种制造芯片封装的方法。芯片封装包括层叠体，芯片和介于芯片和层压体之间的导电元件，信号在芯片和层压体之间传输。该方法包括将第一底部填充物分配到在芯片的相对面和层压体之间限定的空间中，并且至少在芯片的边缘的一部分处分配第二底部填充物，第二底部填充物包括高纵横比材料。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式