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1. 发明授权

US5638597A Manufacturing flexible circuit board assemblies with common heat spreaders 失效
标题翻译：制造具有普通散热器的柔性电路板组件
公开(公告)号：US5638597A
公开(公告)日：1997-06-17
申请号：US476759
申请日：1995-06-07
申请人： Lawrence R. Cutting , Michael A. Gaynes , Eric A. Johnson , Cynthia S. Milkovich , Jeffrey S. Perkins , Mark V. Pierson , Steven E. Poetzinger , Jerzy Zalesinski
发明人： Lawrence R. Cutting , Michael A. Gaynes , Eric A. Johnson , Cynthia S. Milkovich , Jeffrey S. Perkins , Mark V. Pierson , Steven E. Poetzinger , Jerzy Zalesinski
IPC分类号： H01L21/48 , H01L23/367 , H01L23/538 , H05K1/00 , H05K1/02 , H05K1/18 , H05K3/00 , H05K3/12 , H05K3/34 , H05K7/20 , H05K3/36
CPC分类号： H05K7/20454 , H01L21/4857 , H01L21/4867 , H01L23/3672 , H01L23/5387 , H05K1/021 , H05K1/189 , H05K3/0061 , H05K3/1216 , H05K3/4691 , H01L2224/16 , H01L2924/01078 , H01L2924/01322 , H05K1/0298 , H05K1/182 , H05K2201/0154 , H05K2201/09063 , H05K2201/096 , H05K2201/09745 , H05K2201/1056 , H05K2201/2009 , H05K2203/1394 , H05K3/3415 , H05K3/3452 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144
摘要： A multi-layer flexible circuit board has multiple thicker regions to which components are mounted and thinner, more flexible regions with fewer wiring layers through which the board can be bent about a line without bending thicker regions. Surface mount components such as QFP's and flip-chips are mounted on the front side, and surface mount and pin-in-hole components are mounted on the back side of the circuit board at the thick regions. Heat spreaders are laminated to the back sides of thicker regions. The thicker regions have windows in which wire bond chips are mounted on the heat spreader and wire bonded to the front side of the board. A thermally conductive adhesive or grease connects between the tops of the back side components and the bottoms of the cavities. The heat sinks are bolted together and/or to an enclosure frame to improve thermal performance.
摘要翻译：多层柔性电路板具有多个较厚的区域，组件安装在该较厚的区域上，较薄的，更柔性的区域具有较少的布线层，板可围绕线弯曲，而不会弯曲较厚的区域。表面安装部件如QFP和倒装芯片安装在前侧，表面安装和销孔组件安装在电路板的背面，在较厚的区域。散热器层压到较厚区域的背面。较厚的区域具有窗口，其中引线接合芯片安装在散热器上，并且引线键合到板的前侧。导热粘合剂或油脂连接在后侧部件的顶部和空腔的底部之间。散热器螺栓连接在一起和/或连接到外壳框架以改善热性能。

2. 发明授权

US5969945A Electronic package assembly 失效
标题翻译：电子封装组装
公开(公告)号：US5969945A
公开(公告)日：1999-10-19
申请号：US808829
申请日：1997-02-27
申请人： Lawrence R. Cutting , Michael A. Gaynes , Eric A. Johnson , Cynthia S. Milkovich , Jeffrey S. Perkins , Mark V. Pierson , Steven E. Poetzinger , Jerzy Zalesinski
发明人： Lawrence R. Cutting , Michael A. Gaynes , Eric A. Johnson , Cynthia S. Milkovich , Jeffrey S. Perkins , Mark V. Pierson , Steven E. Poetzinger , Jerzy Zalesinski
IPC分类号： H01L21/48 , H01L23/367 , H01L23/538 , H05K1/00 , H05K1/02 , H05K1/18 , H05K3/00 , H05K3/12 , H05K3/34 , H05K7/20
CPC分类号： H05K7/20454 , H01L21/4857 , H01L21/4867 , H01L23/3672 , H01L23/5387 , H05K1/021 , H05K1/189 , H05K3/0061 , H05K3/1216 , H05K3/4691 , H01L2224/16 , H01L2924/01078 , H01L2924/01322 , H05K1/0298 , H05K1/182 , H05K2201/0154 , H05K2201/09063 , H05K2201/096 , H05K2201/09745 , H05K2201/1056 , H05K2201/2009 , H05K2203/1394 , H05K3/3415 , H05K3/3452 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144
摘要： A screen printing fixture holds a flexible circuit board having components attached to one side, to allow screening a pattern of solder paste onto the second side for subsequent attachment of components to that side. In an electronic package assembly a flexible circuit board with components is wound about a heat spreader assembly having a cavity so that at least one component on the flexible circuit board is positioned within the cavity and in thermal connection to the heat spreader.
摘要翻译：丝网印刷夹具具有安装在一侧的部件的柔性电路板，以允许将焊膏的图案屏蔽到第二侧上，以便随后将部件附接到该侧。在电子封装组件中，具有部件的柔性电路板围绕具有空腔的散热器组件缠绕，使得柔性电路板上的至少一个部件位于腔内并与散热器热连接。

3. 发明授权

US5831828A Flexible circuit board and common heat spreader assembly 失效
标题翻译：柔性电路板和普通散热器总成
公开(公告)号：US5831828A
公开(公告)日：1998-11-03
申请号：US71630
申请日：1993-06-03
申请人： Lawrence R. Cutting , Michael A. Gaynes , Eric A. Johnson , Cynthia S. Milkovich , Jeffrey S. Perkins , Mark V. Pierson , Steven E. Poetzinger , Jerzy Zalesinski
发明人： Lawrence R. Cutting , Michael A. Gaynes , Eric A. Johnson , Cynthia S. Milkovich , Jeffrey S. Perkins , Mark V. Pierson , Steven E. Poetzinger , Jerzy Zalesinski
IPC分类号： H01L21/48 , H01L23/367 , H01L23/538 , H05K1/00 , H05K1/02 , H05K1/18 , H05K3/00 , H05K3/12 , H05K3/34 , H05K7/20
CPC分类号： H05K7/20454 , H01L21/4857 , H01L21/4867 , H01L23/3672 , H01L23/5387 , H05K1/021 , H05K1/189 , H05K3/0061 , H05K3/1216 , H05K3/4691 , H01L2224/16 , H01L2924/01078 , H01L2924/01322 , H05K1/0298 , H05K1/182 , H05K2201/0154 , H05K2201/09063 , H05K2201/096 , H05K2201/09745 , H05K2201/1056 , H05K2201/2009 , H05K2203/1394 , H05K3/3415 , H05K3/3452 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144
摘要： A multi-layer flexible circuit board has thicker regions to which surface-mount-technology (SMT) components (such as flip chips and QFPs) and pin-in-hole (PIH) components are mounted on both sides and which contains conductive through vias between wiring layers. After the SMT components have been mounted to the first side, a screening fixture with a support surface that has cavities conforming the components on the first side, is used to screen solder paste to the other side of the board. The thicker regions are surrounded by thinner regions of the board with fewer wiring layers and preferably fewer or thinner dielectric layers, and which can be bent along a line without bending the thicker regions. A common heat spreader plate with cavities or holes for multiple components is laminated to the thicker regions on one side of the board. The thicker regions have windows in which wire-bond chips are mounted to the heat spreader and the chips are wirebonded to the other side of the board. A thermally conductive adhesive or grease connects between the components and the bottoms of the cavities. Two heat sink plates are bolted together and along with other such heat sink plates are bolted to an enclosure frame to improve thermal performance.
摘要翻译：多层柔性电路板具有较厚的区域，表面贴装技术（SMT）部件（例如倒装芯片和QFP）和销钉（PIH）部件安装在两侧并且包含导电通孔布线层之间。在SMT部件已经安装到第一侧之后，使用具有与第一面上的部件相符合的空腔的支撑表面的屏蔽夹具将焊膏屏蔽到板的另一侧。较厚的区域由较薄的区域围绕，具有更少的布线层，优选更少或更薄的介电层，并且可以沿着线弯曲而不弯曲较厚的区域。具有用于多个部件的空腔或孔的普通散热板被层压到板的一侧上较厚的区域。较厚的区域具有将引线键合芯片安装到散热器的窗口，并且芯片被引线键合到板的另一侧。导热粘合剂或油脂在部件和空腔的底部之间连接。两个散热板被螺栓连接在一起，并且与其它这样的散热板一起用螺栓连接到外壳框架以改善热性能。

4. 发明授权

US5759269A Manufacturing flexible circuit board assemblies and printer for screening solder paste in such manufacture 失效
标题翻译：制造柔性电路板组件和打印机，用于在这种制造中筛选焊膏
公开(公告)号：US5759269A
公开(公告)日：1998-06-02
申请号：US470507
申请日：1995-06-06
申请人： Lawrence R. Cutting , Michael A. Gaynes , Eric A. Johnson , Cynthia S. Milkovich , Jeffrey S. Perkins , Mark V. Pierson , Steven E. Poetzinger , Jerzy Zalesinski
发明人： Lawrence R. Cutting , Michael A. Gaynes , Eric A. Johnson , Cynthia S. Milkovich , Jeffrey S. Perkins , Mark V. Pierson , Steven E. Poetzinger , Jerzy Zalesinski
IPC分类号： H01L21/48 , H01L23/367 , H01L23/538 , H05K1/00 , H05K1/02 , H05K1/18 , H05K3/00 , H05K3/12 , H05K3/34 , H05K7/20 , B05C13/00
CPC分类号： H05K7/20454 , H01L21/4857 , H01L21/4867 , H01L23/3672 , H01L23/5387 , H05K1/021 , H05K1/189 , H05K3/0061 , H05K3/1216 , H05K3/4691 , H01L2224/16 , H01L2924/01078 , H01L2924/01322 , H05K1/0298 , H05K1/182 , H05K2201/0154 , H05K2201/09063 , H05K2201/096 , H05K2201/09745 , H05K2201/1056 , H05K2201/2009 , H05K2203/1394 , H05K3/3415 , H05K3/3452 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144
摘要： A screen printing machine comprising a backing plate with holes conforming to components attached to the surface of a flexible circuit board. The machine includes a screen which patterns solder paste on the surface of the circuit board while the circuit board is on the backing plate. Also included is a spring loaded element disposed adjacent to the backing plate which applies a predetermined continuous force to the four corners of the circuit board. This force is applied in a diagonal direction to the corners to stretch the circuit board so that the circuit board is parallel to the backing plate during screening.
摘要翻译：一种丝网印刷机，其包括具有与附接到柔性电路板的表面的部件相符的孔的背板。该机器包括在电路板位于背板上时在电路板表面上形成焊膏的屏幕。还包括弹簧加载元件，其布置成与背板相邻，其向电路板的四个角施加预定的连续力。该力沿对角方向施加到角部以拉伸电路板，使得电路板在屏蔽期间平行于背板。

5. 发明授权

US06545869B2 Adjusting fillet geometry to couple a heat spreader to a chip carrier 有权
标题翻译：调整圆角几何以将散热器连接到芯片载体
公开(公告)号：US06545869B2
公开(公告)日：2003-04-08
申请号：US09764048
申请日：2001-01-17
申请人： Barry A. Bonitz , Eric Duchesne , Michael A. Gaynes , Eric A. Johnson
发明人： Barry A. Bonitz , Eric Duchesne , Michael A. Gaynes , Eric A. Johnson
IPC分类号： H05K720
CPC分类号： H01L23/4334 , H01L21/4882 , H01L21/563 , H01L23/3735 , H01L24/32 , H01L2224/73203 , H01L2224/83951 , H01L2924/01006 , H01L2924/01033 , H01L2924/351 , Y10T29/4913 , H01L2924/3512 , H01L2924/00
摘要： An electronic structure, and associated method of fabrication, for coupling a heat spreader above a chip to a chip carrier below the chip. Initially provided is a substrate, a chip on a surface of the substrate and coupled to the substrate, and the heat spreader. Then a fillet of at least one adhesive material is formed on the chip and around a periphery of the chip. Additionally, the heat spreader is placed on a portion of the fillet and over a top surface of the chip. The fillet couples the heat spreader to the substrate. An outer surface of the fillet makes a to contact angle of about 25 degrees with the surface of the substrate. The small contact angle not exceeding about 25 degrees prevents cracking of the substrate that would otherwise result from thermal cycling.
摘要翻译：一种用于将芯片上方的散热器与芯片下方的芯片载体耦合的电子结构及其制造方法。最初提供的是衬底，衬底的表面上的芯片并且耦合到衬底和散热器。然后在芯片上和芯片的周围形成至少一种粘合剂材料的圆角。此外，散热器放置在圆角的一部分上并且在芯片的顶表面上。圆角将散热器耦合到基板。圆角的外表面与衬底的表面形成约25度的接触角。小的接触角不超过约25度可以防止由于热循环而导致的基体的破裂。

6. 发明授权

US06410988B1 Thermally enhanced and mechanically balanced flip chip package and method of forming 失效
标题翻译：热增强和机械平衡倒装芯片封装和成型方法
公开(公告)号：US06410988B1
公开(公告)日：2002-06-25
申请号：US09570895
申请日：2000-05-15
申请人： David V. Caletka , Jean Dery , Eric Duchesne , Michael A. Gaynes , Eric A. Johnson , Luis J. Matienzo , James R. Wilcox
发明人： David V. Caletka , Jean Dery , Eric Duchesne , Michael A. Gaynes , Eric A. Johnson , Luis J. Matienzo , James R. Wilcox
IPC分类号： H01L2348
CPC分类号： H01L23/4334 , H01L23/3128 , H01L24/29 , H01L24/32 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01024 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/10253 , H01L2924/15311 , H01L2924/00012 , H01L2924/00 , H01L2924/3512
摘要： A method of making a flip chip package that maintains flatness over a wide temperature range and provides good heat dissipation is described. A laminate substrate is electrically connected to electrical contacts disposed on a chip and underfill material is applied between the soldered connections. A body, for example an uncured dielectric material, is applied to the chip, the laminate substrate, a thermally conductive member or combinations thereof, and thermally conductive member is disposed adjacent to the surface of the chip that is opposite the surface connected to the laminate substrate. The body is extruded between the chip and the thermally conductive member. The thickness of the thermally conductive member is determined by balancing the stiffness and the CTE of both the thermally conductive member and the laminate substrate, and the length and width of the thermally conductive member may vary but are at least the size of the corresponding length and width of the chip.
摘要翻译：描述了制造在宽温度范围内保持平坦度并提供良好散热的倒装芯片封装的方法。层压基板电连接到设置在芯片上的电触头，底部填充材料被施加在焊接连接之间。例如未固化介电材料的主体被施加到芯片，层压基板，导热构件或其组合，并且导热构件设置在与连接到层压板的表面相对的芯片的表面附近基质。主体在芯片和导热构件之间挤出。导热构件的厚度通过平衡导热构件和层压衬底的刚度和CTE来确定，并且导热构件的长度和宽度可以变化，但是至少为相应长度的尺寸，并且芯片的宽度。

7. 发明授权

US6104093A Thermally enhanced and mechanically balanced flip chip package and method of forming 失效
公开(公告)号：US6104093A
公开(公告)日：2000-08-15
申请号：US80117
申请日：1998-05-15
申请人： David V. Caletka , Jean Dery , Eric Duchesne , Michael A. Gaynes , Eric A. Johnson , Luis J. Matienzo , James R. Wilcox
发明人： David V. Caletka , Jean Dery , Eric Duchesne , Michael A. Gaynes , Eric A. Johnson , Luis J. Matienzo , James R. Wilcox
IPC分类号： H01L23/31 , H01L23/433 , H01L23/48
CPC分类号： H01L23/4334 , H01L23/3128 , H01L24/29 , H01L24/32 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01024 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/10253 , H01L2924/15311
摘要： A method of making a flip chip package that maintains flatness over a wide temperature range and provides good heat dissipation is described. A laminate substrate is electrically connected to electrical contacts disposed on a chip and underfill material is applied between the soldered connections. A body, for example an uncured dielectric material, is applied to the chip, the laminate substrate, a thermally conductive member or combinations thereof, and thermally conductive member is disposed adjacent to the surface of the chip that is opposite the surface connected to the laminate substrate. The body is extruded between the chip and the thermally conductive member. The thickness of the thermally conductive member is determined by balancing the stiffness and the CTE of both the thermally conductive member and the laminate substrate, and the length and width of the thermally conductive member may vary but are at least the size of the corresponding length and width of the chip.

8. 发明授权

US06984286B2 Adjusting fillet geometry to couple a heat spreader to a chip carrier 失效
公开(公告)号：US06984286B2
公开(公告)日：2006-01-10
申请号：US10338963
申请日：2003-01-08
申请人： Barry A. Bonitz , Eric Duchesne , Michael A. Gaynes , Eric A. Johnson
发明人： Barry A. Bonitz , Eric Duchesne , Michael A. Gaynes , Eric A. Johnson
IPC分类号： B32B31/20
CPC分类号： H01L23/4334 , H01L21/4882 , H01L21/563 , H01L23/3735 , H01L24/32 , H01L2224/73203 , H01L2224/83951 , H01L2924/01006 , H01L2924/01033 , H01L2924/351 , Y10T29/4913 , H01L2924/3512 , H01L2924/00
摘要： An electronic structure, and associated method of fabrication, for coupling a heat spreader above a chip to a chip carrier below the chip. Initially provided is a substrate, a chip on a surface of the substrate and coupled to the substrate, and the heat spreader. Then a fillet of at least one adhesive material is formed on the chip and around a periphery of the chip. Additionally, the heat spreader is placed on a portion of the fillet and over a top surface of the chip. The fillet couples the heat spreader to the substrate. An outer surface of the fillet makes a contact angle of about 25 degrees with the surface of the substrate. The small contact angle not exceeding about 25 degrees prevents cracking of the substrate that would otherwise result from thermal cycling.

9. 发明申请

US20140255376A1 Regulation of Specific Spinal Neurons Regulating Pain Transmission 有权
标题翻译：调节特定脊髓神经元调节疼痛传播
公开(公告)号：US20140255376A1
公开(公告)日：2014-09-11
申请号：US14181241
申请日：2014-02-14
申请人： Eric A. Johnson , Sabine Pellett , William H. Tepp , Tony L. Yaksh , Marc Marino , Qinghao Xu
发明人： Eric A. Johnson , Sabine Pellett , William H. Tepp , Tony L. Yaksh , Marc Marino , Qinghao Xu
IPC分类号： A61K47/48 , C12N9/96
CPC分类号： A61K47/62 , A61K9/0085 , A61K38/164 , A61K38/4893 , C07K7/22 , C07K14/33 , C07K14/57545 , C07K14/70 , C07K14/72 , C07K2319/01 , C07K2319/33 , C07K2319/55 , C12N9/96 , C12Y304/24069
摘要： A chimeric toxin is disclosed comprising a peptide ligand specifically targeting neurons involved in pain processing; and a clostridial neurotoxin light chain, wherein the ligand is linked to the light chain. The methods of preparing such chimeric toxin and the method of using the chimeric toxin to regulate pain transmission are also disclosed.
摘要翻译：公开了一种嵌合毒素，其包含特异性靶向涉及疼痛加工的神经元的肽配体; 和梭菌神经毒素轻链，其中所述配体与轻链连接。还公开了制备这种嵌合毒素的方法和使用嵌合毒素调节疼痛传递的方法。

10. 发明授权

US08435759B2 Plasmid-encoded neurotoxin genes in Clostridium botulinum serotype A subtypes 有权
标题翻译：肉毒毒素肉毒杆菌血清型A亚型中的质粒编码的神经毒素基因
公开(公告)号：US08435759B2
公开(公告)日：2013-05-07
申请号：US12664800
申请日：2008-06-27
申请人： Eric A. Johnson , Kristin M. Marshall , Sabine Pellett , Marite Bradshaw
发明人： Eric A. Johnson , Kristin M. Marshall , Sabine Pellett , Marite Bradshaw
IPC分类号： C12P21/00 , C12N15/74
CPC分类号： C12N9/52 , C07K14/33 , C12N15/74 , C12Y304/24069
摘要： The present invention provides a novel isolated plasmid, wherein the plasmid is a native plasmid found in unique C. botulinum type A strains and encode either BoNT/A3 or BoNT/A4 and BoNT/B. The present invention also provides a method of obtaining a plasmid-encoded botulinum neurotoxin and botulinum neurotoxin complex comprising the step of isolating a plasmid encoding the cntA/A or cntA/B neurotoxin gene and genes encoding protein components of the toxin complex from a C. botulinum type A strain. The inventors performed comparative analyzes of representative BoNT/A subtype strains by pulsed-field gel electrophoresis (PFGE) and Southern hybridizations with probes specific for the BoNT/A and B genes, cntA/A and cntA/B. Unexpectedly, the inventors determined that the genes encoding BoNT/A3 in the A3 strain, and BoNT/A4 and BoNT/B in the A4 strain, are on plasmids.
摘要翻译：本发明提供了一种新的分离质粒，其中质粒是在独特的A型肉毒杆菌中发现的天然质粒，并且编码BoNT / A3或BoNT / A4和BoNT / B。本发明还提供了获得质粒编码的肉毒杆菌神经毒素和肉毒杆菌神经毒素复合物的方法，包括分离编码cntA / A或cntA / B神经毒素基因的质粒和编码来自C的毒素复合物的蛋白质组分的基因的步骤。 A型肉毒杆菌。本发明人通过脉冲场凝胶电泳（PFGE）和针对BoNT / A和B基因cntA / A和cntA / B特异性探针的Southern杂交进行了代表性的BoNT / A亚型菌株的比较分析。出人意料的是，本发明人确定了A3菌株中编码BoNT / A3的基因以及A4菌株中的BoNT / A4和BoNT / B在质粒上。

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