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21. 发明授权

US5407557A Wiring boards and manufacturing methods thereof 失效
标题翻译：接线板及其制造方法
公开(公告)号：US5407557A
公开(公告)日：1995-04-18
申请号：US201325
申请日：1994-02-24
申请人： Atsuko Iida , Hiroshi Odaira , Yoshizumi Sato , Yuichi Yamamoto
发明人： Atsuko Iida , Hiroshi Odaira , Yoshizumi Sato , Yuichi Yamamoto
IPC分类号： H01L21/48 , H01L23/498 , H01L23/538 , H05K1/00 , H05K1/05 , H05K3/02 , H05K3/20 , H05K3/24 , H05K3/38 , H05K3/40 , H05K3/42 , H05K3/44 , H05K3/46 , C25D5/02
CPC分类号： H01L21/4857 , H01L23/49866 , H01L23/5387 , H05K1/056 , H05K3/027 , H05K3/242 , H05K3/388 , H01L2924/0002 , H05K1/0393 , H05K2201/0112 , H05K2201/0326 , H05K2201/0347 , H05K2201/09554 , H05K2201/09563 , H05K2203/107 , H05K3/205 , H05K3/423 , H05K3/4614 , H05K3/4635 , Y10S205/917
摘要： A multi-layer wiring board where a plurality of wiring boards are laminated. The wiring board comprises a flexible insulating layer having a through hole and a wiring pattern formed on the flexible insulating layer. The wiring pattern is composed at least of two conductive layers. The first conductive layer formed on the insulating layer is made of a non-metallic conductor and the first wiring pattern is formed by a laser beam. The second conductive layer is an electroplated layer formed on the first wiring pattern. The first and second conductive layers have different reflectance for a beam. The wiring board is manufactured by integrally laminating a plastic conductive supporting plate wound in a roll shape and an insulating film similarly wound in a roll shape; forming a through hole in a predetermined position of the insulating film; forming the first conductive layer on the laminated body provided with the through hole; forming the first wiring pattern by a laser beam; and forming the electroplated layer on the first wiring pattern.
摘要翻译：叠层有多个布线基板的多层布线基板。布线板包括具有通孔的柔性绝缘层和形成在柔性绝缘层上的布线图案。布线图案至少由两个导电层组成。形成在绝缘层上的第一导电层由非金属导体制成，并且第一布线图案由激光束形成。第二导电层是形成在第一布线图案上的电镀层。第一和第二导电层对于束具有不同的反射率。通过将卷绕成卷状的塑料导电支撑板和类似地卷绕成卷状的绝缘膜整体地层叠而制造布线板; 在绝缘膜的预定位置形成通孔; 在设置有通孔的层叠体上形成第一导电层; 通过激光束形成第一布线图案; 以及在所述第一布线图案上形成所述电镀层。

22. 发明授权

US5310966A Wiring boards and manufacturing methods thereof 失效
标题翻译：接线板及其制造方法
公开(公告)号：US5310966A
公开(公告)日：1994-05-10
申请号：US724
申请日：1993-01-05
申请人： Atsuko Iida , Hiroshi Odaira , Yoshizumi Sato , Yuichi Yamamoto
发明人： Atsuko Iida , Hiroshi Odaira , Yoshizumi Sato , Yuichi Yamamoto
IPC分类号： H01L21/48 , H01L23/498 , H01L23/538 , H05K1/00 , H05K1/05 , H05K3/02 , H05K3/20 , H05K3/24 , H05K3/38 , H05K3/40 , H05K3/42 , H05K3/44 , H05K3/46
CPC分类号： H01L21/4857 , H01L23/49866 , H01L23/5387 , H05K1/056 , H05K3/027 , H05K3/242 , H05K3/388 , H01L2924/0002 , H05K1/0393 , H05K2201/0112 , H05K2201/0326 , H05K2201/0347 , H05K2201/09554 , H05K2201/09563 , H05K2203/107 , H05K3/205 , H05K3/423 , H05K3/4614 , H05K3/4635 , Y10S205/917
摘要： A multi-layer wiring board where a plurality of wiring boards are laminated. The wiring board comprises a flexible insulating layer having a through hole and a wiring pattern formed on the flexible insulating layer. The wiring pattern is composed at least of two conductive layers. The first conductive layer formed on the insulating layer is made of a non-metallic conductor and the first wiring pattern is formed by a laser beam. The second conductive layer is an electroplated layer formed on the first wiring pattern. The first and second conductive layers have different reflectance for a beam. The wiring board is manufactured by integrally laminating a plastic conductive supporting plate wound in a roll shape and an insulating film similarly wound in a roll shape; forming a through hole in a predetermined position of the insulating film; forming the first conductive layer on the laminated body provided with the through hole; forming the first wiring pattern by a laser beam; and forming the electroplated layer on the first wiring pattern.
摘要翻译：叠层有多个布线基板的多层布线基板。布线板包括具有通孔的柔性绝缘层和形成在柔性绝缘层上的布线图案。布线图案至少由两个导电层组成。形成在绝缘层上的第一导电层由非金属导体制成，并且第一布线图案由激光束形成。第二导电层是形成在第一布线图案上的电镀层。第一和第二导电层对于束具有不同的反射率。通过将卷绕成卷状的塑料导电支撑板和类似地卷绕成卷状的绝缘膜整体地层叠而制造布线板; 在所述绝缘膜的预定位置形成通孔; 在设置有通孔的层叠体上形成第一导电层; 通过激光束形成第一布线图案; 以及在所述第一布线图案上形成所述电镀层。

23. 发明授权

US08648431B2 Acoustic semiconductor device 失效
标题翻译：声学半导体器件
公开(公告)号：US08648431B2
公开(公告)日：2014-02-11
申请号：US13220116
申请日：2011-08-29
申请人： Kazuhide Abe , Tadahiro Sasaki , Atsuko Iida , Kazuhiko Itaya , Takashi Kawakubo
发明人： Kazuhide Abe , Tadahiro Sasaki , Atsuko Iida , Kazuhiko Itaya , Takashi Kawakubo
IPC分类号： H01L29/84
CPC分类号： H03J3/20 , H03B5/326 , H03H9/02566
摘要： According to one embodiment, an acoustic semiconductor device includes an element unit, and a first terminal. The element unit includes an acoustic resonance unit. The acoustic resonance unit includes a semiconductor crystal. An acoustic standing wave is excitable in the acoustic resonance unit and is configured to be synchronously coupled with electric charge density within at least one portion of the semiconductor crystal via deformation-potential coupling effect. The first terminal is electrically connected to the element unit. At least one selected from outputting and inputting an electrical signal is implementable via the first terminal. The electrical signal is coupled with the electric charge density. The outputting the electrical signal is from the acoustic resonance unit, and the inputting the electrical signal is into the acoustic resonance unit.
摘要翻译：根据一个实施例，声学半导体器件包括元件单元和第一端子。元件单元包括声共振单元。声共振单元包括半导体晶体。声驻波在声共振单元中是可兴奋的，并且被配置为通过变形电势耦合效应与半导体晶体的至少一部分内的电荷密度同步耦合。第一端子电连接到元件单元。从输出和输入电信号中选出的至少一个可经由第一终端实现。电信号与电荷密度耦合。输出电信号来自声共振单元，并且输入电信号进入声共振单元。

24. 发明授权

US08324707B2 Power amplifier 失效
标题翻译：功率放大器
公开(公告)号：US08324707B2
公开(公告)日：2012-12-04
申请号：US13050545
申请日：2011-03-17
申请人： Tadahiro Sasaki , Kazuhide Abe , Atsuko Iida , Kazuhiko Itaya
发明人： Tadahiro Sasaki , Kazuhide Abe , Atsuko Iida , Kazuhiko Itaya
IPC分类号： H01L27/105
CPC分类号： H01L27/088 , H01L21/823493 , H01L27/0207 , H01L27/0922 , H01L29/41758 , H01L29/4238 , H01L29/78
摘要： According to an embodiment, a power amplifier is provided with at least one first growth ring gate structure and multiple second growth ring gate structures. The first growth ring gate structure is bounded by a semiconductor layer and performs a power amplification operation. The multiple second growth ring gate structures are bounded by the semiconductor layer and are arranged adjacently around the first growth ring gate structure in a surrounding manner. When the first growth ring gate structure performs a power amplification operation, the multiple second growth ring gate structures are depleted by applying a reverse bias to the multiple second growth ring gate structures whereby the depleted multiple second growth ring gate structures isolate the first growth ring gate structure from a surrounding portion.
摘要翻译：根据实施例，功率放大器设置有至少一个第一增长环栅极结构和多个第二增长环栅极结构。第一生长环栅极结构由半导体层限制并进行功率放大操作。多个第二生长环形栅极结构由半导体层限制，并且以周围的方式围绕第一生长环栅极结构相邻布置。当第一生长环栅极结构执行功率放大操作时，通过向多个第二生长环栅极结构施加反向偏压来耗尽多个第二生长环栅结构，由此耗尽的多个第二生长环栅极结构将第一生长环栅极隔离结构从周围部分。

25. 发明授权

US07893525B2 Semiconductor device having an adhesive portion with a stacked structure and method for manufacturing the same 有权
标题翻译：具有层叠结构的粘合部的半导体装置及其制造方法
公开(公告)号：US07893525B2
公开(公告)日：2011-02-22
申请号：US12350727
申请日：2009-01-08
申请人： Atsuko Iida , Yutaka Onozuka , Kazuhiko Itaya
发明人： Atsuko Iida , Yutaka Onozuka , Kazuhiko Itaya
IPC分类号： H01L21/98
CPC分类号： B81C1/00253 , B81C1/00238 , H01L21/568 , H01L23/295 , H01L23/3135 , H01L24/19 , H01L24/96 , H01L2224/04105 , H01L2224/24137 , H01L2224/24195 , H01L2924/10253 , H01L2924/1461 , H01L2924/15788 , H01L2924/18162 , H01L2924/19105 , H01L2924/3511 , H01L2924/00
摘要： It is made possible to restrict warpage at the time of resin cure and achieve a smaller thickness. A semiconductor device includes: a first chip including a MEMS device and a first pad formed on an upper face of the MEMS device, the first pad being electrically connected to the MEMS device; a second chip including a semiconductor device and a second pad formed on an upper face of the semiconductor device, the second pad being electrically connected to the semiconductor device; and an adhesive portion having a stacked structure, and bonding a side face of the first chip and a side face of the second chip, the stacked structure including a first adhesive film formed by adding a first material constant modifier to a first resin, and a second adhesive film formed by adding a second material constant modifier to a second resin.
摘要翻译：可以在树脂固化时限制翘曲并实现更小的厚度。半导体器件包括：第一芯片，其包括MEMS器件和形成在MEMS器件的上表面上的第一焊盘，第一焊盘电连接到MEMS器件; 包括半导体器件的第二芯片和形成在所述半导体器件的上表面上的第二焊盘，所述第二焊盘电连接到所述半导体器件; 以及具有堆叠结构的粘合部分，并且将第一芯片的侧面和第二芯片的侧面接合，所述堆叠结构包括通过将第一材料常数改性剂添加到第一树脂而形成的第一粘合膜，以及通过将第二材料常数改性剂加入到第二树脂中形成的第二粘合剂膜。

26. 发明申请

US20090179317A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20090179317A1
公开(公告)日：2009-07-16
申请号：US12350727
申请日：2009-01-08
申请人： Atsuko Iida , Yutaka Onozuka , Kazuhiko Itaya
发明人： Atsuko Iida , Yutaka Onozuka , Kazuhiko Itaya
IPC分类号： H01L23/00 , H01L21/98
CPC分类号： B81C1/00253 , B81C1/00238 , H01L21/568 , H01L23/295 , H01L23/3135 , H01L24/19 , H01L24/96 , H01L2224/04105 , H01L2224/24137 , H01L2224/24195 , H01L2924/10253 , H01L2924/1461 , H01L2924/15788 , H01L2924/18162 , H01L2924/19105 , H01L2924/3511 , H01L2924/00
摘要： It is made possible to restrict warpage at the time of resin cure and achieve a smaller thickness. A semiconductor device includes: a first chip including a MEMS device and a first pad formed on an upper face of the MEMS device, the first pad being electrically connected to the MEMS device; a second chip including a semiconductor device and a second pad formed on an upper face of the semiconductor device, the second pad being electrically connected to the semiconductor device; and an adhesive portion having a stacked structure, and bonding a side face of the first chip and a side face of the second chip, the stacked structure including a first adhesive film formed by adding a first material constant modifier to a first resin, and a second adhesive film formed by adding a second material constant modifier to a second resin.
摘要翻译：可以在树脂固化时限制翘曲并实现更小的厚度。半导体器件包括：第一芯片，其包括MEMS器件和形成在MEMS器件的上表面上的第一焊盘，第一焊盘电连接到MEMS器件; 包括半导体器件的第二芯片和形成在所述半导体器件的上表面上的第二焊盘，所述第二焊盘电连接到所述半导体器件; 以及具有堆叠结构的粘合部分，并且将第一芯片的侧面和第二芯片的侧面接合，所述堆叠结构包括通过将第一材料常数改性剂添加到第一树脂而形成的第一粘合膜，以及通过将第二材料常数改性剂加入到第二树脂中形成的第二粘合剂膜。

27. 发明申请

US20090056741A1 Cleaning apparatus, cleaning method, pattern formation apparatus, and pattern formation method 审中-公开
标题翻译：清洁装置，清洁方法，图案形成装置和图案形成方法
公开(公告)号：US20090056741A1
公开(公告)日：2009-03-05
申请号：US12230607
申请日：2008-09-02
申请人： Atsuko Iida , Mitsunaga Saito , Koichi Ishii , Ken Takahashi , Yoshihiro Tajima , Yasushi Shinjiyo , Shigeyuki Tashiro , Daiji Hirosawa
发明人： Atsuko Iida , Mitsunaga Saito , Koichi Ishii , Ken Takahashi , Yoshihiro Tajima , Yasushi Shinjiyo , Shigeyuki Tashiro , Daiji Hirosawa
IPC分类号： B08B3/10 , G03G13/16 , B08B3/12 , A47L9/00 , B08B3/04
CPC分类号： B41F35/02 , B41M1/10 , B41P2235/26 , G03G21/0088 , G03G21/10
摘要： A pattern formation apparatus has a drum-like intaglio rolling along a transferred medium. After the intaglio is charged by a charger, a pattern of toner particles is formed by supplying a liquid developer of each color to the intaglio via a developing machine and an electric field is formed between the intaglio and the transferred medium by rolling the intaglio along the transferred medium to transfer charged toner particles to the transferred medium. A cleaning apparatus which cleans the intaglio after the pattern in each color being transferred to the transferred medium has nozzles at an angle for blowing a cleaning liquid against recesses and removal rollers for removing toner particles liberated from the recesses together with the cleaning liquid.
摘要翻译：图案形成装置具有沿转印介质的滚筒凹版卷轴。在凹版被充电器充电之后，通过经由显影机将各种颜色的液体显影剂供应到凹版而形成调色剂颗粒的图案，并且通过沿凹凸形状滚动凹版而在凹版和转印介质之间形成电场转移的介质将带电的调色剂颗粒转移到转印的介质中。在将每种颜色的图案转印到转印介质之后，清洁凹版的清洁装置具有用于将清洁液吹入凹部的一定角度的喷嘴和用于从清洗液中除去从凹部排出的调色剂颗粒的去除辊。

28. 发明申请

US20070065639A1 Circuit board and manufacturing method of the circuit board 审中-公开
标题翻译：电路板和电路板的制造方法
公开(公告)号：US20070065639A1
公开(公告)日：2007-03-22
申请号：US11443282
申请日：2006-05-31
申请人： Atsuko Iida , Koichi Ishii , Yasushi Shinjiyo , Takaaki Yasumoto , Naoko Yanase
发明人： Atsuko Iida , Koichi Ishii , Yasushi Shinjiyo , Takaaki Yasumoto , Naoko Yanase
IPC分类号： G11B5/64
CPC分类号： H05K3/246 , G03G15/224 , G03G15/6585 , G03G15/6591 , H05K1/095 , H05K3/1266 , H05K3/182 , H05K2201/0212 , H05K2201/0347 , H05K2203/0517 , H05K2203/095 , Y10T428/24355
摘要： A circuit board includes a substrate, a nonconductive resin layer selectively formed on the substrate and containing fine metal particles, and a conductive metal layer formed on the resin layer, in contact with the fine metal particles which are exposed from the resin layer. A surface of the resin layer has irregularities, in an interface between the resin layer and the conductive metal layer. In a roughness curve of a section of the resin layer, in a case of an wavelength (λc) at the boundary of a roughness component and a waviness component is 1 μm, a maximum height (Rz) per reference length (1r) of 1 μm is 20 nm to 500 nm.
摘要翻译：电路板包括基板，选择性地形成在基板上并且含有金属微粒的非导电树脂层，以及形成在树脂层上的与从树脂层露出的金属微粒接触的导电金属层。在树脂层和导电金属层之间的界面处，树脂层的表面具有凹凸。在树脂层的一部分的粗糙度曲线中，在粗糙度成分的边界处的波长（lambdac）和波纹成分为1μm的情况下，每个参考长度（1 r）的最大高度（Rz） 1μm为20nm〜500nm。

29. 发明授权

US5801797A Image display apparatus includes an opposite board sandwiched by array boards with end portions of the array boards being offset 失效
标题翻译：图像显示装置包括夹在阵列板之间的相对板，排列的板的端部被偏移
公开(公告)号：US5801797A
公开(公告)日：1998-09-01
申请号：US816725
申请日：1997-03-13
申请人： Atsuko Iida , Tatsuro Uchida , Akira Kinno , Masayuki Saito , Yukio Kizaki , Takeshi Miyagi , Miki Mori , Yumi Fukuda
发明人： Atsuko Iida , Tatsuro Uchida , Akira Kinno , Masayuki Saito , Yukio Kizaki , Takeshi Miyagi , Miki Mori , Yumi Fukuda
IPC分类号： G02F1/1333 , G02F1/1347 , G02F1/1362 , G02F1/133 , G02F1/1339 , G02F1/1343
CPC分类号： G02F1/13336 , G02F1/13452 , G02F1/1347
摘要： The image display apparatus is capable of displaying an image on a large screen in which non-display regions are completely eliminated or minimized. The image display apparatus comprises an opposite board in which common electrodes made of transparent conductive resin are respectively formed on both surfaces of a transparent substrate. A plurality of array boards in each of which semiconductor element and a signal line are formed on a transparent substrate are arranged on both surfaces of the opposite board, such that display regions of end portions of the array boards face each other a sandwich of the opposite board inserted therebetween. Frame-like sealing members made of transparent resin are respectively inserted in clearances between the opposite board and the array boards. Liquid crystal is enclosed in each of spaces surrounded by the frame-like sealing members between the opposite board and the array boards.
摘要翻译：图像显示装置能够在大屏幕上显示图像，其中非显示区域被完全消除或最小化。图像显示装置包括在透明基板的两个表面上分别形成由透明导电树脂制成的公共电极的相对板。在透明基板上形成有多个阵列基板的半导体元件和信号线形成在对置基板的两面上，使得阵列板的端部的显示区域彼此面对相反的三明治板插入其间。由透明树脂制成的框状密封件分别插入相对的板和阵列板之间的间隙中。液晶被封闭在由相对板和阵列板之间的框状密封构件包围的每个空间中。

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