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    • 21. 发明授权
    • Semiconductor device having multi-gate insulating layers and methods of fabricating the same
    • US06642105B2
    • 2003-11-04
    • US10131010
    • 2002-04-24
    • Kyung-Hyun KimChang-Ki HongU-In ChungBum-Soo KimYoo-Cheol ShinKyu-Chan Park
    • Kyung-Hyun KimChang-Ki HongU-In ChungBum-Soo KimYoo-Cheol ShinKyu-Chan Park
    • H01L21336
    • H01L21/823462H01L27/105H01L27/11526H01L27/11541
    • A semiconductor device having multi-gate insulating layers and methods of fabricating the same are provided. The semiconductor device includes an isolation region disposed at a predetermined region of a semiconductor substrate. The isolation region defines at least one first active region and at least one second active region. The first active region is covered with a first gate insulating layer, and the second active region is covered with a second gate insulating layer which is thinner than the first gate insulating layer. Preferably, the top surface of the first gate insulating layer has the same height as the that of the second gate insulating layer. The isolation region is filled with an isolation layer which preferably covers the entire sidewalls of the first and second gate insulating layers. A typical method includes the step of selectively forming a first gate insulating layer at a predetermined region of a semiconductor substrate. A second gate insulating layer which is thinner than the first insulating layer is selectively formed at the surface of the semiconductor substrate adjacent to the first gate insulating layer. Preferably, the bottom surface of the first gate insulating layer is lower than that of the second gate insulating layer. The first and second gate insulating layers are covered with a conductive layer. The conductive layer, the first and second gate insulating layers, and the substrate are etched to form an isolation region, for example, a trench region, defining a first active region under the first gate insulating layer and a second active region under the second gate insulating. An isolation layer is formed in the trench region. The isolation layer preferably covers the entire sidewalls of the first and second gate insulating layers.
    • 22. 发明授权
    • Method for forming conductive line of semiconductor device
    • 形成半导体器件导线的方法
    • US5629238A
    • 1997-05-13
    • US557534
    • 1995-11-14
    • Ji-hyun ChoiHong-jae ShinByung-keun HwangU-in Chung
    • Ji-hyun ChoiHong-jae ShinByung-keun HwangU-in Chung
    • H01L21/3205H01L21/316H01L21/768H01L23/522H01L21/283
    • H01L21/76831H01L21/76877
    • A method for forming a conductive line uses a fluorine doped oxide layer as an insulating layer between conductive lines. The method comprises the steps of: (a) forming a fluorine doped oxide layer on a semiconductor substrate on which a lower structure is formed; (b) etching the oxide layer of the region where a conductive line is to be formed, thereby forming a trench; (c) forming an insulating layer on the overall surface of the resultant substrate; depositing conductive material on the resultant substrate; and (e) etching back the conductive material so that the conductive material is left on the trench only, thereby forming a conductive line. In this method, the conductive line is formed of aluminum-containing material and the insulating layer is formed of silicon dioxide. In the present invention, the insulating layer is interposed between the fluorine doped oxide layer and the aluminum-containing conductive line and thus the conductive line is free from corrosion.
    • 形成导线的方法使用氟掺杂氧化物层作为导线之间的绝缘层。 该方法包括以下步骤:(a)在形成下部结构的半导体衬底上形成氟掺杂氧化物层; (b)蚀刻要形成导电线的区域的氧化物层,从而形成沟槽; (c)在所得基板的整个表面上形成绝缘层; 在所得基板上沉积导电材料; 和(e)蚀刻导电材料,使得导电材料仅留在沟槽上,从而形成导电线。 在该方法中,导电线由含铝材料形成,绝缘层由二氧化硅形成。 在本发明中,绝缘层介于氟掺杂氧化物层和含铝导电线之间,因此导电线无腐蚀。