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21. 发明申请

US20080278873A1 IN PACKAGE ESD PROTECTIONS OF IC USING A THIN FILM POLYMER 有权
标题翻译：使用薄膜聚合物的IC封装ESD保护
公开(公告)号：US20080278873A1
公开(公告)日：2008-11-13
申请号：US12049726
申请日：2008-03-17
申请人： Yves Leduc , Nathalie Messina , Charvaka Duvvury , Kurt P. Wachtler
发明人： Yves Leduc , Nathalie Messina , Charvaka Duvvury , Kurt P. Wachtler
IPC分类号： H02H9/04 , H01H11/00
CPC分类号： H01L23/62 , H01L23/60 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/056 , H01L2224/16225 , H01L2924/00014 , H01L2924/13034 , H01L2924/15311 , H05K1/0259 , H05K2201/0738 , Y10T29/49105 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A packaged semiconductor device (200) with a substrate (220) having, sandwiched in an insulator (221), a flat sheet-like sieve member (240) made of a non-linear material switching from insulator to conductor mode at a preset voltage. Both member surfaces are free of indentations; the member is perforated by through-holes, which are grouped into a first set (241) and a second set (242). Metal traces (251) over one member surface are positioned across the first set through-holes (241); each trace is connected to a terminal on the substrate top and, through the hole, to a terminal on the substrate bottom. Analogous for metal traces (252) over the opposite member surface and second set through-holes (242). Traces (252) overlap with a portion of traces (252) to form the locations for the conductivity switches, creating local ultra-low resistance bypasses to ground for discharging overstress events.
摘要翻译：一种封装半导体器件（200），其具有夹在绝缘体（221）中的基板（220），由预定电压从绝缘体切换到导体模式的非线性材料制成的平板状筛构件（240）。两个构件表面都没有压痕; 所述构件穿过通孔，所述通孔被分组成第一组（241）和第二组（242）。一个构件表面上的金属迹线（251）跨过第一组通孔（241）定位; 每个迹线连接到基板顶部上的端子，并且通过孔连接到基板底部上的端子。类似于相对构件表面上的金属迹线（252）和第二组通孔（242）。轨迹（252）与轨迹（252）的一部分重叠以形成用于导电开关的位置，从而产生局部超低电阻旁路到地以释放过应力事件。

22. 发明授权

US06686225B2 Method of separating semiconductor dies from a wafer 有权
公开(公告)号：US06686225B2
公开(公告)日：2004-02-03
申请号：US09917534
申请日：2001-07-27
申请人： Kurt P. Wachtler
发明人： Kurt P. Wachtler
IPC分类号： H01L2144
CPC分类号： H01L21/568 , H01L21/6835 , H01L21/78 , H01L24/96 , H01L24/97 , H01L29/0657 , H01L2221/68377 , H01L2224/16 , H01L2224/45144 , H01L2224/94 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/1815 , H01L2924/19041 , H01L2924/19043 , Y10S438/964 , Y10S438/977 , H01L2924/00 , H01L2224/11
摘要： Methods are disclosed for manufacturing semiconductor device dies and for separating dies from a semiconductor wafer, wherein one or more channels are etched in the top of the wafer between individual die areas. Material is then removed from the bottom side of the wafer in order to separate the individual dies. Methods are also disclosed for removing material from the bottom side of the wafer dies, wherein a contoured surface is provided on the die bottom, such as through an etching process. In addition, methods are disclosed for removing material from the bottom side of a wafer, and for securing a semiconductor device to a surface. Semiconductor wafers and dies are also disclosed having contoured bottom surfaces.

23. 发明授权

US06374481B1 Method for making microactuator for use in mass data storage devices 有权
标题翻译：微型制动器用于大容量数据存储装置的方法
公开(公告)号：US06374481B1
公开(公告)日：2002-04-23
申请号：US09607087
申请日：2000-06-28
申请人： Kurt P. Wachtler , Mark W. Heaton
发明人： Kurt P. Wachtler , Mark W. Heaton
IPC分类号： H01F706
CPC分类号： G11B5/5552 , Y10T29/4902 , Y10T29/49025 , Y10T29/49073
摘要： A piece-part microactuator (220), or micromotor, manufacturing approach is presented. In this approach, two of the NiFe parts (221,223) and dielectric and copper (225) piece-parts are manufactured separately. This allows the NiFe parts (221,223) to be designed in a manner to maximize the thickness of the metal, which in turn increases the magnetic properties of the motor. The dielectric and copper coils piece-part (225) may be based upon a thin film interconnect (222) or some derivative of a standard flex circuit printed wiring board. These piece-parts (221,223,225) may be tested individually, defective parts discarded, and only functional units assembled. This not only produces a mechanically balanced construction, but has lower cost due to non-sequential manufacturing steps. The dielectric and copper coils piece-part (225) also provides the path for electrical connections to the movable platform (234) and a relatively easy method for electrical connection off the microactuator and onto the hard disk drive system.
摘要翻译：提出了一种零件微型致动器（220）或微电机的制造方法。在这种方法中，分别制造两个NiFe部件（221,223）和电介质和铜（225）件。这允许以使金属的厚度最大化的方式设计NiFe部件（221,223），这又增加了电动机的磁性能。电介质和铜线圈片部分（225）可以基于薄膜互连（222）或标准柔性电路印刷线路板的一些衍生物。这些零件（221,223,225）可以单独测试，丢弃有缺陷的零件，并且只能组装功能单元。这不仅产生机械平衡的结构，而且由于非顺序的制造步骤而具有较低的成本。电介质和铜线圈片（225）还提供用于与可移动平台（234）的电连接的路径以及用于从微致动器和硬盘驱动系统电连接的相对简便的方法。

24. 发明授权

US6071801A Method and apparatus for the attachment of particles to a substrate 有权
标题翻译：用于将颗粒附着到基底的方法和装置
公开(公告)号：US6071801A
公开(公告)日：2000-06-06
申请号：US253837
申请日：1999-02-19
申请人： Kurt P. Wachtler , Gregory B. Hotchkiss
发明人： Kurt P. Wachtler , Gregory B. Hotchkiss
IPC分类号： H01L21/48 , H01L23/498 , H05K3/34 , H01L21/44
CPC分类号： H01L23/49811 , H01L21/4846 , H05K3/3478 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00014 , H01L2924/15311 , H05K2203/041 , H05K2203/0522 , H05K2203/0525
摘要： A method for populating an substrate (14) with particles (12, 16), comprising the steps of applying an adhesive coating (22) to both surfaces of a substrate (14) and loading the particles (12, 16) to the adhesive areas (30) of the adhesive coating (22), such that each surface of the substrate (14) is fully populated with the particles (12, 16) which may thereafter be reflowed simultaneously. The particles may be composed of a variety of compositions, including copper, other metals, alloys, and synthetic resin compounds, such as conductive plastics.
摘要翻译：一种用于用颗粒（12,16）填充衬底（14）的方法，包括以下步骤：将粘合剂涂层（22）施加到衬底（14）的两个表面上，并将颗粒（12,16）装载到粘合剂区域（22）的所述表面（30），使得所述基底（14）的每个表面完全填充有随后可以同时回流的颗粒（12,16）。颗粒可以由各种组合物组成，包括铜，其他金属，合金和合成树脂化合物，例如导电塑料。

25. 发明授权

US5628662A Method of fabricating a color field emission flat panel display tetrode 失效
标题翻译：制造彩色场发射平板显示器四极杆的方法
公开(公告)号：US5628662A
公开(公告)日：1997-05-13
申请号：US521510
申请日：1995-08-30
申请人： Kenneth G. Vickers , Henry S. Yan , Kurt P. Wachtler
发明人： Kenneth G. Vickers , Henry S. Yan , Kurt P. Wachtler
IPC分类号： H01J29/08 , H01J9/227
CPC分类号： H01J29/085 , H01J2201/304 , H01J2329/00
摘要： An anode plate 40, suitable for use in a field emission display tetrode, includes a transparent planar substrate 42 having thereon a layer 46 of a transparent, electrically conductive material, which comprises the anode electrode of the display tetrode. Barrier structures 48 comprising an electrically insulating, preferably opaque material, are formed on anode electrode 46 as a series of parallel ridges. Atop each barrier structure 48 are a series of electrically conductive stripes 50, which function as deflection electrodes. Luminescent material 52 overlies anode electrode 46 in the channels between barrier structures 48. Conductive stripes 50 are termed into three series such that every third stripe 50 is electrically interconnected. Deflection voltage controller 70 permits selective deflection of electrons toward the proper luminescent material 52. By applying a positive voltage on two of the three series of stripes 50, and applying a negative voltage on the third series of stripes 50, electrons are deflected between pairs of stripes 50 biased to the positive voltage. Deflection electrodes 50 may advantageously be formed of a conductive material having getting qualifies, such as zirconium-vanadium-iron. Also disclosed is a method for fabricating anode plate 40.
摘要翻译：适用于场致发射显示四极管的阳极板40包括透明平面基板42，透明平面基板42上具有透明导电材料层46，其包括显示器四极的阳极电极。阻挡结构48包括电绝缘的，优选不透明的材料，在阳极电极46上形成一系列平行的脊。每个阻挡结构48的顶部是一系列作为偏转电极的导电条50。发光材料52覆盖在阻挡结构48之间的通道中的阳极电极46.导电条50被称为三个系列，使得每三分之一条50电互连。偏转电压控制器70允许电子向适当的发光材料52的选择性偏转。通过在三个系列条带50中的两个上施加正电压，并在第三系列条带50上施加负电压，电子在成对条带50偏压到正电压。偏转电极50可有利地由具有合格性的导电材料形成，例如锆 - 钒 - 铁。还公开了一种用于制造阳极板40的方法。

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