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    • 26. 发明授权
    • Integrated circuit devices having dielectric regions protected with multi-layer insulation structures
    • 具有由多层绝缘结构保护的电介质区域的集成电路器件
    • US07023037B2
    • 2006-04-04
    • US10813335
    • 2004-03-30
    • Hag-ju ChoHyeong-geun An
    • Hag-ju ChoHyeong-geun An
    • H01L29/76
    • H01L27/11502H01L28/55
    • A dielectric region, such as a ferroelectric dielectric region of an integrated circuit capacitor, is protected by a multi-layer insulation structure including a first relatively thin insulation layer, e.g., an aluminum oxide or other metal oxide layer, and a second, thicker insulating layer, e.g., a second aluminum oxide or other metal oxide layer. Before formation of the second insulation layer, the first insulation layer and the dielectric preferably annealed, which can increase a remnant polarization of the dielectric region. The first insulation layer can serve as a hydrogen diffusion barrier during formation of the second insulation layer and other overlying structures. In this manner, degradation of the dielectric can be reduced. Devices and fabrication methods are discussed.
    • 诸如集成电路电容器的铁电电介质区域的电介质区域由包括第一相对薄的绝缘层(例如,氧化铝或其它金属氧化物层)的多层绝缘结构和第二较厚绝缘层 层,例如第二氧化铝或其它金属氧化物层。 在形成第二绝缘层之前,第一绝缘层和电介质优选退火,这可以增加电介质区域的剩余极化。 第一绝缘层可以在形成第二绝缘层和其它上覆结构期间用作氢扩散阻挡层。 以这种方式,可以降低电介质的劣化。 讨论了器件和制造方法。