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11. 发明申请

WO2005096495A1 TEMPERTURE CONTROLLED MEMS RESONATOR AND METHOD FOR CONTROLLING RESONATOR FREQUENCY 审中-公开
标题翻译：温度控制MEMS谐振器和控制谐振频率的方法
公开(公告)号：WO2005096495A1
公开(公告)日：2005-10-13
申请号：PCT/US2004/034657
申请日：2004-10-20
申请人： ROBERT BOSCH GMBH , MARKUS, Lutz , Aaron, Partridge
发明人： MARKUS, Lutz , Aaron, Partridge
IPC分类号： H03H9/54
CPC分类号： H03H9/2463 , H01L2224/48091 , H01L2224/48227 , H01L2924/01019 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H03H9/02338 , H03H9/02401 , H03H9/02448 , H03H9/2426 , H03H9/2473 , H03H9/2478 , H03H2009/02496 , H03H2009/02511 , H03H2009/02527 , H01L2924/00014
摘要： There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a temperature compensated microelectromechanical resonator as well as fabricating, manufacturing, providing and/or controlling microelectromechanical resonators having mechanical structures that include integrated heating and/or temperature sensing elements. In another aspect, the present invention is directed to fabricate, manufacture, provide and/or control microelectromechanical resonators having mechanical structures that are encapsulated using thin film or wafer level encapsulation techniques in a chamber, and including heating and/or temperature sensing elements disposed in the chamber, on the chamber and/or integrated within the mechanical structures. Other aspects of the inventions will be apparent from the detailed description and claims herein.
摘要翻译：这里描述和说明了许多发明。一方面，本发明涉及一种温度补偿微机电谐振器，以及制造，制造，提供和/或控制具有包括集成的加热和/或温度感测元件的机械结构的微机电谐振器。在另一方面，本发明涉及制造，制造，提供和/或控制具有机械结构的微机电谐振器，其机械结构使用薄膜或晶片级封装技术在腔室中进行封装，并且包括设置在腔室中的加热和/或温度感测元件室，在室上和/或整合在机械结构内。本发明的其它方面将从本文的详细描述和权利要求中变得显而易见。

12. 发明申请

WO2009092846A1 A MICROMECHANICAL RESONATOR 审中-公开
标题翻译：微机械谐振器
公开(公告)号：WO2009092846A1
公开(公告)日：2009-07-30
申请号：PCT/FI2009/000020
申请日：2009-01-23
申请人： VTI TECHNOLOGIES, Ville , KAAJAKARI, Ville
发明人： KAAJAKARI, Ville
IPC分类号： H03H9/02 , H03H9/24 , B81B3/00
CPC分类号： H03H9/2463 , H02N1/008 , H03H3/0076 , H03H9/02275 , H03H9/02338 , H03H9/2478 , H03H9/2484 , H03H2009/02299
摘要： The invention relates to design of micromechanical resonators and, more precisely, to the design of microelectro- mechanical systems (MEMS) resonators. The invention provides an improved design structure for a microelectromechanical systems (MEMS) resonator in which the width of the spring elements (3), (23-24), (27- 30) is greater than the width of the electrode fingers (5-9), (25-26), (31-34), said widths specifically dimensioned so that the sensitivity of the resonant frequency change with respect to dimensional manufacturing variations Formula approaches zero. The improved structure is frequency robust to manufacturing variations and enables reliable frequency referencing with good performance, particularly in small size solutions.
摘要翻译：本发明涉及微机械谐振器的设计，并且更具体地涉及微电子机械系统（MEMS）谐振器的设计。本发明为微机电系统（MEMS）谐振器提供了改进的设计结构，其中弹簧元件（3），（23-24），（27-30）的宽度大于电极指（5- 9），（25-26），（31-34），所述宽度的具体尺寸被设计为使得谐振频率相对于尺寸制造变化公式的灵敏度变化公式接近零。改进的结构对于制造变化具有频率稳健性，并且具有良好性能的可靠频率参考，尤其是在小尺寸解决方案中。

13. 发明申请

WO2009092846A8 A MICROMECHANICAL RESONATOR 审中-公开
标题翻译：微机电谐振器
公开(公告)号：WO2009092846A8
公开(公告)日：2009-09-17
申请号：PCT/FI2009000020
申请日：2009-01-23
申请人： VTI TECHNOLOGIES OY , KAAJAKARI VILLE
发明人： KAAJAKARI VILLE
IPC分类号： H03H9/02 , B81B3/00 , H03H9/24
CPC分类号： H03H9/2463 , H02N1/008 , H03H3/0076 , H03H9/02275 , H03H9/02338 , H03H9/2478 , H03H9/2484 , H03H2009/02299
摘要： The invention relates to design of micromechanical resonators and, more precisely, to the design of microelectro- mechanical systems (MEMS) resonators. The invention provides an improved design structure for a microelectromechanical systems (MEMS) resonator in which the width of the spring elements (3), (23-24), (27- 30) is greater than the width of the electrode fingers (5-9), (25-26), (31-34), said widths specifically dimensioned so that the sensitivity of the resonant frequency change with respect to dimensional manufacturing variations Formula approaches zero. The improved structure is frequency robust to manufacturing variations and enables reliable frequency referencing with good performance, particularly in small size solutions.
摘要翻译：本发明涉及微机电谐振器的设计，更确切地说，涉及微电子机械系统（MEMS）谐振器的设计。本发明提供了一种用于微机电系统（MEMS）谐振器的改进的设计结构，其中弹簧元件（3），（23-24），（27-30）的宽度大于电极指（5- 9），（25-26），（31-34），所述宽度具体地确定尺寸，使得谐振频率相对于尺寸制造变化公式的灵敏度接近零。改进的结构对于制造变化是稳定的，并且具有良好性能的可靠的频率参考，特别是在小尺寸解决方案中。

14. 发明授权

US08692632B2 Resonator element, resonator, oscillator, and electronic device 有权
标题翻译：谐振器元件，谐振器，振荡器和电子器件
公开(公告)号：US08692632B2
公开(公告)日：2014-04-08
申请号：US13040625
申请日：2011-03-04
申请人： Akinori Yamada
发明人： Akinori Yamada
IPC分类号： H03H9/21 , H03B5/32
CPC分类号： H03H9/21 , H03H9/0547 , H03H9/1014 , H03H9/215 , H03H9/2457 , H03H9/2478 , H03H2003/0492
摘要： A resonator element includes a base portion in which a pair of notches is formed, a pair of resonating arms which is extended in parallel from one end side of a first portion of the base portion. The resonating arm is provided with a bottomed elongated groove which has an opening along at least one principal surface of both principal surfaces and a weight portion which is formed at the tip end side of the resonating arm on the opposite side of a root of the resonating arm attached to the base portion and which has a larger width than on the root side. The weight portion is formed so that the proportion of the length of the weight portion to the length from the root to the tip end side in a longitudinal direction of the resonating arm is within a range of 35% to 41%.
摘要翻译：谐振器元件包括其中形成有一对凹口的基部，从基部的第一部分的一端侧平行延伸的一对谐振臂。谐振臂设置有有底的细长槽，其具有沿着两个主表面的至少一个主表面的开口和形成在谐振臂的顶端侧上的重合部分，该谐振臂在谐振臂的根部的相对侧上臂附接到基部并且具有比在根侧更大的宽度。重量部分形成为使得重量部分的长度与从根部到根据共振臂的纵向方向的前端侧的长度的比例在35％至41％的范围内。

15. 发明授权

US08102224B2 Micromechanical resonator 有权
标题翻译：微机械谐振器
公开(公告)号：US08102224B2
公开(公告)日：2012-01-24
申请号：US12320347
申请日：2009-01-23
申请人： Ville Kaajakari
发明人： Ville Kaajakari
IPC分类号： H03H9/00 , H03H9/05 , H03H9/125 , H03H9/24
CPC分类号： H03H9/2463 , H02N1/008 , H03H3/0076 , H03H9/02275 , H03H9/02338 , H03H9/2478 , H03H9/2484 , H03H2009/02299
摘要： The invention relates to design of micromechanical resonators and, more precisely, to the design of microelectromechanical systems (MEMS) resonators. The invention provides an improved design structure for a microelectromechanical systems (MEMS) resonator in which the width of the spring elements (3), (23-24), (27-30) is greater than the width of the electrode fingers (5-9), (25-26), (31-34), said widths specifically dimensioned so that the sensitivity of the resonant frequency change with respect to dimensional manufacturing variations d(Δω0/ω0)/dδ approaches zero. The improved structure is frequency robust to manufacturing variations and enables reliable frequency referencing with good performance, particularly in small size solutions.
摘要翻译：本发明涉及微机械谐振器的设计，更确切地说，涉及微机电系统（MEMS）谐振器的设计。本发明提供了一种用于微机电系统（MEMS）谐振器的改进的设计结构，其中弹簧元件（3），（23-24），（27-30）的宽度大于电极指（5- （25-26），（31-34），所述宽度具体尺寸设定成使谐振频率相对于尺寸制造变化d（＆Dgr;ω0/ω0）/dδ变化的灵敏度接近零。改进的结构对于制造变化是稳定的，并且具有良好性能的可靠的频率参考，特别是在小尺寸解决方案中。

16. 发明申请

US20060033594A1 Temperature controlled MEMS resonator and method for controlling resonator frequency 有权
公开(公告)号：US20060033594A1
公开(公告)日：2006-02-16
申请号：US11252349
申请日：2005-10-17
申请人： Markus Lutz , Aaron Partridge
发明人： Markus Lutz , Aaron Partridge
IPC分类号： H03H9/00
CPC分类号： H03H9/2463 , H01L2224/48091 , H01L2224/48227 , H01L2924/01019 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H03H9/02338 , H03H9/02401 , H03H9/02448 , H03H9/2426 , H03H9/2473 , H03H9/2478 , H03H2009/02496 , H03H2009/02511 , H03H2009/02527 , H01L2924/00014
摘要： There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a temperature compensated microelectromechanical resonator as well as fabricating, manufacturing, providing and/or controlling microelectromechanical resonators having mechanical structures that include integrated heating and/or temperature sensing elements. In another aspect, the present invention is directed to fabricate, manufacture, provide and/or control microelectromechanical resonators having mechanical structures that are encapsulated using thin film or wafer level encapsulation techniques in a chamber, and including heating and/or temperature sensing elements disposed in the chamber, on the chamber and/or integrated within the mechanical structures. Other aspects of the inventions will be apparent from the detailed description and claims herein.

17. 发明申请

US20050195050A1 TEMPERATURE CONTROLLED MEMS RESONATOR AND METHOD FOR CONTROLLING RESONATOR FREQUENCY 有权
标题翻译：温度控制MEMS谐振器和控制谐振频率的方法
公开(公告)号：US20050195050A1
公开(公告)日：2005-09-08
申请号：US10794976
申请日：2004-03-04
申请人： Markus Lutz , Aaron Partridge
发明人： Markus Lutz , Aaron Partridge
IPC分类号： H03H9/02 , H03H9/24 , H03H9/54
CPC分类号： H03H9/2463 , H01L2224/48091 , H01L2224/48227 , H01L2924/01019 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H03H9/02338 , H03H9/02401 , H03H9/02448 , H03H9/2426 , H03H9/2473 , H03H9/2478 , H03H2009/02496 , H03H2009/02511 , H03H2009/02527 , H01L2924/00014
摘要： There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a temperature compensated microelectromechanical resonator as well as fabricating, manufacturing, providing and/or controlling microelectromechanical resonators having mechanical structures that include integrated heating and/or temperature sensing elements. In another aspect, the present invention is directed to fabricate, manufacture, provide and/or control microelectromechanical resonators having mechanical structures that are encapsulated using thin film or wafer level encapsulation techniques in a chamber, and including heating and/or temperature sensing elements disposed in the chamber, on the chamber and/or integrated within the mechanical structures. Other aspects of the inventions will be apparent from the detailed description and claims herein.
摘要翻译：这里描述和说明了许多发明。一方面，本发明涉及一种温度补偿微机电谐振器，以及制造，制造，提供和/或控制具有包括集成的加热和/或温度感测元件的机械结构的微机电谐振器。在另一方面，本发明涉及制造，制造，提供和/或控制具有机械结构的微机电谐振器，其机械结构使用薄膜或晶片级封装技术在腔室中进行封装，并且包括设置在腔室中的加热和/或温度感测元件室，在室上和/或整合在机械结构内。本发明的其它方面将从本文的详细描述和权利要求中变得显而易见。

18. 发明公开

US20230308076A1 METHODS AND DEVICES FOR MICROELECTROMECHANICAL RESONATORS 审中-公开
公开(公告)号：US20230308076A1
公开(公告)日：2023-09-28
申请号：US18324902
申请日：2023-05-26
申请人： Stathera IP Holdings Inc.
发明人： Vamsy P. Chodavarapu , George Xereas
IPC分类号： H03H9/10 , B81C1/00 , H03H9/24 , H03H3/007 , B81B7/00 , G01L9/12 , H03H9/05 , G01L9/00
CPC分类号： H03H9/1057 , B81C1/00182 , H03H9/2426 , H03H3/0072 , H03H3/0073 , B81B7/007 , G01L9/12 , H03H9/0561 , G01L9/0042 , G01L9/0073 , B81C1/00269 , B81C1/00301 , H03H9/2405 , H03H9/2436 , H03H9/2431 , H03H9/2478 , H03H2009/2442 , B81B2203/0307 , H03H9/2452 , H03H9/2463 , H03H9/2473
摘要： A MEMS device may include: (i) a lower cavity, including a first island, formed within a first layer of the MEMS device; (ii) an upper cavity, including a second island, formed within a second layer of the MEMS device; (iii) a MEMS resonating element arranged in a device layer of the MEMS device and anchored via the first and second islands; (iv) a first set of electrodes for electrostatic actuation and sensing of the MEMS resonating element in an in-plane mode that is arranged in the device layer of the MEMS device; and (v) a second set of electrodes for electrostatic actuation and sensing of the MEMS resonating element in an out-of-plane mode that is electrically isolated from the first set of electrodes and located in the first or second layer of the MEMS device, and wherein the out-of-plane mode is a torsional mode or a saddle mode.

19. 发明申请

US20160002026A1 METHODS AND DEVICES FOR MICROELECTROMECHANICAL PRESSURE SENSORS 审中-公开
标题翻译：微电子压力传感器的方法和装置
公开(公告)号：US20160002026A1
公开(公告)日：2016-01-07
申请号：US14790225
申请日：2015-07-02
申请人： The Royal Institution for the Advancement of Learning / McGill University
发明人： Vamsy Chodavarapu , Adel Merdassi , Charles Allan
IPC分类号： B81B7/00
CPC分类号： B81C1/00182 , B81B7/007 , B81B2203/0307 , B81C1/00269 , B81C1/00301 , G01L9/0042 , G01L9/0073 , G01L9/12 , H03H3/0072 , H03H3/0073 , H03H9/0561 , H03H9/1057 , H03H9/2405 , H03H9/2426 , H03H9/2431 , H03H9/2436 , H03H9/2452 , H03H9/2463 , H03H9/2473 , H03H9/2478 , H03H2009/2442
摘要： MEMS based sensors, particularly capacitive sensors, potentially can address critical considerations for users including accuracy, repeatability, long-term stability, ease of calibration, resistance to chemical and physical contaminants, size, packaging, and cost effectiveness. Accordingly, it would be beneficial to exploit MEMS processes that allow for manufacturability and integration of resonator elements into cavities within the MEMS sensor that are at low pressure allowing high quality factor resonators and absolute pressure sensors to be implemented. Embodiments of the invention provide capacitive sensors and MEMS elements that can be implemented directly above silicon CMOS electronics.
摘要翻译：基于MEMS的传感器，特别是电容传感器，潜在地可以解决用户的关键考虑因素，包括精度，重复性，长期稳定性，校准容易性，对化学和物理污染物的抵抗力，尺寸，包装和成本效益。因此，利用允许谐振器元件可制造性和集成在MEMS传感器内的空腔中的MEMS工艺将是有利的，该传感器处于低压，允许实施高质量因子谐振器和绝对压力传感器。本发明的实施例提供可以直接在硅CMOS电子器件上方实现的电容传感器和MEMS元件。

20. 发明申请

US20120091854A1 MICROMECHANICAL RESONATOR 有权
标题翻译：微生物共振器
公开(公告)号：US20120091854A1
公开(公告)日：2012-04-19
申请号：US13284196
申请日：2011-10-28
申请人： Ville KAAJAKARI
发明人： Ville KAAJAKARI
IPC分类号： H02N1/00
CPC分类号： H03H9/2463 , H02N1/008 , H03H3/0076 , H03H9/02275 , H03H9/02338 , H03H9/2478 , H03H9/2484 , H03H2009/02299
摘要： The invention relates to design of micromechanical resonators and, more precisely, to the design of microelectromechanical systems (MEMS) resonators. The invention provides an improved design structure for a microelectromechanical systems (MEMS) resonator including a movable mass structure and a spring structure. The spring structure includes a spring element. The spring element is anchored from one end and connected to a plurality of electrode fingers on another end. The plurality of electrode fingers are operatively connected together at the other end of the spring element. The improved structure is frequency robust to manufacturing variations and enables reliable frequency referencing with good performance, particularly in small size solutions.
摘要翻译：本发明涉及微机械谐振器的设计，更确切地说，涉及微机电系统（MEMS）谐振器的设计。本发明提供了一种用于包括可移动质量结构和弹簧结构的微机电系统（MEMS）谐振器的改进的设计结构。弹簧结构包括弹簧元件。弹簧元件从一端锚定并在另一端连接到多个电极指。多个电极指在弹簧元件的另一端可操作地连接在一起。改进的结构对于制造变化是稳定的，并且具有良好性能的可靠的频率参考，特别是在小尺寸解决方案中。

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