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    • 14. 发明申请
    • HIGH DYNAMIC RANGE CMOS IMAGE SENSOR HAVING ANTI-BLOOMING PROPERTIES AND ASSOCIATED METHODS
    • 具有抗起泡特性的高动态范围CMOS图像传感器及相关方法
    • WO2014127376A2
    • 2014-08-21
    • PCT/US2014/016979
    • 2014-02-18
    • SIONYX, INC.
    • JUTAO, JiangBORG, Matt
    • H04N5/374H01L27/14654H04N5/35581H04N5/3591
    • A method of providing blooming protection to a CMOS imager having a pixel array of a plurality of pixels arranged in rows and columns, where the CMOS imager is operable to capture high dynamic range images using a rolling shutter, is provided. Such a method can include reading out charge accumulated by the pixels in a readout row of a first integration time, applying a reset to the readout row for a reset time sufficient to allow readout and reset to occur in at least one subsequent row, and starting a second integration time of the pixels in the readout row, wherein the second integration time is shorter than the first integration time, and wherein the at least one subsequent row is a sufficient number of rows to have a combined reset to preclude blooming effects from the pixel array during the second integration time.
    • 向具有以行和列排列的多个像素的像素阵列的CMOS成像器提供防溢保护的方法,其中CMOS成像器可操作以使用卷帘快门捕获高动态范围图像, 被提供。 这样的方法可以包括:读出第一积分时间的读出行中的像素所累积的电荷,将复位施加到读出行达足够的复位时间以允许在至少一个后续行中进行读出和复位,并且开始 所述读出行中的所述像素的第二积分时间,其中所述第二积分时间短于所述第一积分时间,并且其中所述至少一个后续行是足够数量的行以具有组合的重置以排除来自 像素阵列在第二次积分时间。
    • 15. 发明申请
    • LOW DAMAGE LASER-TEXTURED DEVICES AND ASSOCIATED METHODS
    • 低损耗激光设备和相关方法
    • WO2013120093A1
    • 2013-08-15
    • PCT/US2013/025616
    • 2013-02-11
    • SIONYX, INC.
    • SICKLER, JasonVINEIS, ChristopherCAREY, James, E.
    • H01L21/268H01L31/042H01L31/10
    • H01L31/02363B23K26/0084B23K26/0624H01L21/268Y02E10/50
    • Methods for laser processing semiconductor materials for use in optoelectronic and other devices, including materials, devices, and systems associated therewith are provided. In one aspect, a method of minimizing laser-induced material damage while laser-texturing a semiconductor material can include delivering short pulse duration laser radiation to a target region of a semiconductor material to form a textured region having a reorganized surface layer, wherein the laser radiation has a wavelength from about 200 nm to about 600 nm and a pulse duration of from about 10 femtoseconds to about 400 picoseconds, and wherein defect density of the semiconductor material from beneath the reorganized surface layer up to a depth of about 1 micron is less than or equal to about 10 12 /cm 3 .
    • 提供了用于激光处理用于光电子器件和其他器件的半导体材料的方法,包括与其相关的材料,器件和系统。 在一个方面,一种在半导体材料的激光纹理化过程中最小化激光诱导的材料损伤的方法可以包括将短脉冲持续时间的激光辐射传送到半导体材料的目标区域,以形成具有重新组织的表面层的纹理区域,其中激光 辐射具有约200nm至约600nm的波长和约10飞秒至约400皮秒的脉冲持续时间,并且其中重组表面层下方的半导体材料的缺陷密度低至约1微米的深度较小 大于或等于约1012 / cm3。