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    • 12. 发明申请
    • Supercapacitor with Hexacyanometallate Cathode, Activated Carbone Anode, and Aqueous Electrolyte
    • 超级电容器与六氰基金属阴极,活性炭骨阳极和水电解质
    • US20130257389A1
    • 2013-10-03
    • US13603322
    • 2012-09-04
    • Yuhao LuSean Andrew VailHidayat KisdarjonoJong-Jan Lee
    • Yuhao LuSean Andrew VailHidayat KisdarjonoJong-Jan Lee
    • H01G9/155H01G9/00H02J7/00
    • H01G11/30Y02E60/13Y10T29/417
    • A supercapacitor is provided with a method for fabricating the supercapacitor. The method provides dried hexacyanometallate particles having a chemical formula AmM1xM2y(CN)6.pH2O with a Prussian Blue hexacyanometallate, crystal structure, where A is an alkali or alkaline-earth cation, and M1 and M2 are metals with 2+ or 3+ valance positions. The variable m is in the range of 0.5 to 2, x is in the range of 0.5 to 1.5, y is in the range of 0.5 to 1.5, and p is in the range of 0 to 6. The hexacyanometallate particles are mixed with a binder and electronic conductor powder, to form a cathode comprising AmM1xM2y(CN)6.pH2O. The method also forms an activated carbon anode and a membrane separating the cathode from the anode, permeable to A and A′ cations. Finally, an electrolyte is added with a metal salt including A′ cations. The electrolyte may be aqueous.
    • 超级电容器具有制造超级电容器的方法。 该方法提供具有化学式AmM1xM2y(CN)6.pH2O的干燥的六氰基金属盐颗粒与普鲁士蓝六氰基金属酸盐晶体结构,其中A是碱金属或碱土金属阳离子,M1和M2是具有2+或3+价态的金属 职位 变量m在0.5至2的范围内,x在0.5至1.5的范围内,y在0.5至1.5的范围内,p在0至6的范围内。六氰基金属盐颗粒与 粘合剂和电子导体粉末,以形成包含AmM1xM2y(CN )6pH2O的阴极。 该方法还形成活性炭阳极和将阴极与阳极分开的膜,其可透过A和A'阳离子。 最后,向电解质中加入包含A'阳离子的金属盐。 电解质可以是水性的。
    • 13. 发明申请
    • THREE-TERMINAL LIGHT EMITTING DEVICE (LED) WITH BUILT-IN ELECTROSTATIC DISCHARGE (ESD) PROTECTION DEVICE
    • 具有内置静电放电(ESD)保护装置的三端发光器件(LED)
    • US20140231832A1
    • 2014-08-21
    • US13773414
    • 2013-02-21
    • Jong-Jan Lee
    • Jong-Jan Lee
    • H01L27/15H01L33/42
    • H01L23/552H01L27/15H01L27/156H01L33/42H01L33/48H01L2924/0002H01L2924/00
    • A three-terminal light emitting device (LED) chip, associated fabrication method, and LED array are provided. The method forms an n-doped semiconductor layer overlying a substrate, an active semiconductor layer overlying the n-doped semiconductor layer, and a p-doped semiconductor layer overlying the active semiconductor layer. A trench is formed through the p-doped and active semiconductor layers, exposing the n-doped semiconductor layer. In one aspect, the trench is formed at least part way, but not completely, through the n-doped semiconductor layer. Then, an LED P electrode is formed overlying a first region of the p-doped semiconductor layer, a diode P electrode is formed overlying a second region of the p-doped semiconductor layer that is separated from the first region of the p-doped semiconductor layer by the trench, and an N electrode is formed overlying a top surface of the exposed n-doped semiconductor layer in the trench, shared by the LED and diode.
    • 提供三端子发光器件(LED)芯片,相关制造方法和LED阵列。 该方法形成覆盖衬底的n掺杂半导体层,覆盖n掺杂半导体层的有源半导体层和覆盖有源半导体层的p掺杂半导体层。 通过p掺杂和有源半导体层形成沟槽,暴露n掺杂半导体层。 在一个方面中,通过n掺杂半导体层至少部分地形成沟槽,但不完全形成沟槽。 然后,在p掺杂半导体层的第一区域上形成LED P电极,形成二极管P电极,覆盖从p掺杂半导体层的第一区域分离的p掺杂半导体层的第二区域 并且N沟道电极被形成在由LED和二极管共享的沟槽中的暴露的n掺杂半导体层的顶表面上。
    • 14. 发明申请
    • Integrated Infrared and Color CMOS Imager Sensor
    • 集成红外和彩色CMOS成像传感器
    • US20100102366A1
    • 2010-04-29
    • US12258347
    • 2008-10-24
    • Jong-Jan LeeDouglas J. TweetJon M. Speigle
    • Jong-Jan LeeDouglas J. TweetJon M. Speigle
    • H01L31/112H01L31/18
    • H01L27/14645H01L27/14609H01L27/14621H01L27/1463
    • An integrated infrared (IR) and full color complementary metal oxide semiconductor (CMOS) imager array is provided. The array is built upon a lightly doped p doped silicon (Si) substrate. Each pixel cell includes at least one visible light detection pixel and an IR pixel. Each visible light pixel includes a moderately p doped bowl with a bottom p doped layer and p doped sidewalls. An n doped layer is enclosed by the p doped bowl, and a moderately p doped surface region overlies the n doped layer. A transfer transistor has a gate electrode overlying the p doped sidewalls, a source formed from the n doped layer, and an n+ doped drain connected to a floating diffusion region. The IR pixel is the same, except that there is no bottom p doped layer. An optical wavelength filter overlies the visible light and IR pixels.
    • 提供集成红外(IR)和全色互补金属氧化物半导体(CMOS)成像器阵列。 阵列建立在轻掺杂的p掺杂硅(Si)衬底上。 每个像素单元包括至少一个可见光检测像素和IR像素。 每个可见光像素包括具有底部p掺杂层和p掺杂侧壁的中等P掺杂的碗。 n掺杂层被p掺杂的碗封闭,并且中等P掺杂的表面区域覆盖在n掺杂层上。 传输晶体管具有覆盖p掺杂侧壁的栅电极,由n掺杂层形成的源和连接到浮置扩散区的n +掺杂漏极。 IR像素是相同的,除了没有底部p掺杂层。 光学波长滤光器覆盖可见光和IR像素。
    • 15. 发明授权
    • Germanium phototransistor with floating body
    • 具有浮体的锗光电晶体管
    • US07675056B2
    • 2010-03-09
    • US11891574
    • 2007-08-10
    • Jong-Jan LeeSheng Teng HsuJer-Shen MaaDouglas J. Tweet
    • Jong-Jan LeeSheng Teng HsuJer-Shen MaaDouglas J. Tweet
    • H01L29/06H01L31/072H01L31/109H01L31/0328H01L31/062H01L31/113H01L31/0232
    • H01L31/1136H01L31/028H01L31/1808Y02E10/547
    • A floating body germanium (Ge) phototransistor and associated fabrication process are presented. The method includes: providing a silicon (Si) substrate; selectively forming an insulator layer overlying the Si substrate; forming an epitaxial Ge layer overlying the insulator layer using a liquid phase epitaxy (LPE) process; forming a channel region in the Ge layer; forming a gate dielectric, gate electrode, and gate spacers overlying the channel region; and, forming source/drain regions in the Ge layer. The LPE process involves encapsulating the Ge with materials having a melting temperature greater than a first temperature, and melting the Ge using a temperature lower than the first temperature. The LPE process includes: forming a dielectric layer overlying deposited Ge; melting the Ge; and, in response to cooling the Ge, laterally propagating an epitaxial growth front into the Ge from an underlying Si substrate surface.
    • 提出了一种浮体锗(Ge)光电晶体管及其制造工艺。 该方法包括:提供硅(Si)衬底; 选择性地形成覆盖Si衬底的绝缘体层; 使用液相外延(LPE)工艺形成覆盖绝缘体层的外延Ge层; 在Ge层中形成沟道区; 形成覆盖所述沟道区的栅极电介质,栅电极和栅极间隔; 并且在Ge层中形成源/漏区。 LPE工艺包括用具有大于第一温度的熔化温度的材料包封Ge,并且使用低于第一温度的温度来熔化Ge。 LPE工艺包括:形成覆盖沉积Ge的介电层; 融化Ge; 并且响应于冷却Ge,将外延生长前沿从下面的Si衬底表面横向传播到Ge中。
    • 16. 发明授权
    • Fully isolated photodiode stack
    • 全隔离光电二极管堆叠
    • US07608874B2
    • 2009-10-27
    • US11657152
    • 2007-01-24
    • Jong-Jan LeeDouglas J. TweetSheng Teng Hsu
    • Jong-Jan LeeDouglas J. TweetSheng Teng Hsu
    • H01L31/062H01L31/113
    • H01L27/14647H01L27/1463H01L27/14689
    • An array of fully isolated multi-junction complimentary metal-oxide-semiconductor (CMOS) filterless color imager cells is provided, together with an associated fabrication method. The method provides a bulk silicon (Si) substrate. A plurality of color imager cells are formed, either in the Si substrate, or in a single epitaxial Si layer formed over the substrate. Each color imager cell includes a photodiode set with a first, second, and third photodiode formed as a stacked multi-junction structure. A U-shaped (in cross-section) well liner, fully isolates the photodiode set from adjacent photodiode sets in the array. For example, each photodiode is formed from a p doped Si layer physically interfaced to a first wall. A well bottom physically interfaces to the first wall, and the p doped Si layer of the third, bottom-most, photodiode is part of the well bottom. Then, the photodiode sets may be formed from an n/p/n/p/n/p or n/p/p−/p/p−/p layered structure.
    • 提供了完全隔离的多结互补金属氧化物半导体(CMOS)无滤膜彩色成像器单元的阵列,以及相关的制造方法。 该方法提供体硅(Si)衬底。 在Si衬底中或在衬底上形成的单个外延Si层中形成多个彩色成像器单元。 每个彩色成像器单元包括具有形成为堆叠多结结构的第一,第二和第三光电二极管。 U形(横截面)井衬管,将阵列中的光电二极管组与相邻的光电二极管组完全隔离。 例如,每个光电二极管由物理上与第一壁物理连接的p掺杂Si层形成。 阱底部与第一壁物理接口,第三,最底部的光电二极管的p掺杂Si层是阱底部的一部分。 然后,光电二极管组可以由n / p / n / p / n / p或n / p / p / p / p / p层叠结构形成。
    • 18. 发明授权
    • Floating body germanium phototransistor having a photo absorption threshold bias region
    • 具有光吸收阈值偏置区域的浮体锗光电晶体管
    • US07351995B2
    • 2008-04-01
    • US11894938
    • 2007-08-22
    • Sheng Teng HsuJong-Jan LeeJer-Shen MaaDouglas J. Tweet
    • Sheng Teng HsuJong-Jan LeeJer-Shen MaaDouglas J. Tweet
    • H01L29/06H01L31/072H01L31/109H01L31/0328H01L31/062H01L31/113H01L31/0232
    • H01L31/1136
    • A floating body germanium (Ge) phototransistor with a photo absorption threshold bias region, and an associated fabrication process are presented. The method includes: providing a p-doped Silicon (Si) substrate; selectively forming an insulator layer overlying a first surface of the Si substrate; forming an epitaxial Ge layer overlying the insulator layer; forming a channel region in the Ge layer; forming a gate dielectric, gate electrode, and gate spacers; forming source/drain (S/D) regions in the Ge layer; and, forming a photo absorption threshold bias region in the Ge layer, adjacent the channel region. In one aspect, the second S/D region has a length, longer than the first S/D length. The photo absorption threshold bias region underlies the second S/D region. Alternately, the second S/D region is separated from the channel by an offset, and the photo absorption threshold bias region is the offset in the Ge layer, after a light p-doping.
    • 提出了具有光吸收阈值偏置区域的浮体锗(Ge)光电晶体管,以及相关的制造工艺。 该方法包括:提供p掺杂硅(Si)衬底; 选择性地形成覆盖在所述Si衬底的第一表面上的绝缘体层; 形成覆盖绝缘体层的外延Ge层; 在Ge层中形成沟道区; 形成栅极电介质,栅电极和栅极间隔物; 在Ge层中形成源极/漏极(S / D)区域; 并且在Ge层中形成邻近沟道区的光吸收阈值偏置区域。 在一个方面,第二S / D区域具有比第一S / D长度更长的长度。 光吸收阈值偏置区域位于第二S / D区域的下方。 或者,第二S / D区域与沟道分离偏移,光吸收阈值偏置区域是在光p掺杂之后的Ge层中的偏移。
    • 19. 发明申请
    • Floating body germanium phototransistor having a photo absorption threshold bias region
    • 具有光吸收阈值偏置区域的浮体锗光电晶体管
    • US20070290288A1
    • 2007-12-20
    • US11894938
    • 2007-08-22
    • Sheng HsuJong-Jan LeeJer-Shen MaaDouglas Tweet
    • Sheng HsuJong-Jan LeeJer-Shen MaaDouglas Tweet
    • H01L31/10
    • H01L31/1136
    • A floating body germanium (Ge) phototransistor with a photo absorption threshold bias region, and an associated fabrication process are presented. The method includes: providing a p-doped Silicon (Si) substrate; selectively forming an insulator layer overlying a first surface of the Si substrate; forming an epitaxial Ge layer overlying the insulator layer; forming a channel region in the Ge layer; forming a gate dielectric, gate electrode, and gate spacers; forming source/drain (S/D) regions in the Ge layer; and, forming a photo absorption threshold bias region in the Ge layer, adjacent the channel region. In one aspect, the second S/D region has a length, longer than the first S/D length. The photo absorption threshold bias region underlies the second S/D region. Alternately, the second S/D region is separated from the channel by an offset, and the photo absorption threshold bias region is the offset in the Ge layer, after a light p-doping.
    • 提出了具有光吸收阈值偏置区域的浮体锗(Ge)光电晶体管,以及相关的制造工艺。 该方法包括:提供p掺杂硅(Si)衬底; 选择性地形成覆盖在所述Si衬底的第一表面上的绝缘体层; 形成覆盖绝缘体层的外延Ge层; 在Ge层中形成沟道区; 形成栅极电介质,栅电极和栅极间隔物; 在Ge层中形成源极/漏极(S / D)区域; 并且在Ge层中形成邻近沟道区的光吸收阈值偏置区域。 在一个方面,第二S / D区域具有比第一S / D长度更长的长度。 光吸收阈值偏置区域位于第二S / D区域的下方。 或者,第二S / D区域与沟道分离偏移,光吸收阈值偏置区域是在光p掺杂之后的Ge层中的偏移。
    • 20. 发明申请
    • Wide output swing CMOS imager
    • 宽输出摆幅CMOS成像器
    • US20070218579A1
    • 2007-09-20
    • US11416742
    • 2006-05-03
    • Jong-Jan LeeSheng Hsu
    • Jong-Jan LeeSheng Hsu
    • H01L21/00
    • H01L27/14647H01L27/14603H01L27/14632H01L27/14645H01L27/14683H01L27/14689
    • A CMOS active pixel sensor (APS) imager cell is provided on a silicon-on-insulator (SOI) substrate. The APS imager cell is made from a SOI substrate including a silicon (Si) substrate, a silicon dioxide insulator overlying the substrate, and a Si top layer overlying the insulator. A pixel sensor cell including a photodiode is formed in the Si top layer of the SOI substrate. A pixel transistor set is formed in the SOI top Si layer and connected to the pixel sensor cell. The pixel transistor set includes at least one p-channel MOS (PMOS) transistor and at least one n-channel MOS (NMOS) transistor. In the case of a three-transistor (3T) pixel transistor set, the selected transistor is NMOS, the reset transistor is PMOS, and the source follower may be either NMOS or PMOS.
    • 在绝缘体上硅(SOI)衬底上提供CMOS有源像素传感器(APS)成像器单元。 APS成像器单元由包括硅(Si)衬底,覆盖衬底的二氧化硅绝缘体和覆盖绝缘体的Si顶层的SOI衬底制成。 在SOI衬底的Si顶层中形成包括光电二极管的像素传感器单元。 像素晶体管组形成在SOI顶部Si层中并连接到像素传感器单元。 像素晶体管组包括至少一个p沟道MOS(PMOS)晶体管和至少一个n沟道MOS(NMOS)晶体管。 在三晶体管(3T)像素晶体管组的情况下,所选择的晶体管是NMOS,复位晶体管是PMOS,源极跟随器可以是NMOS或PMOS。