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11. 发明申请

US20110278739A1 Semiconductor Package 审中-公开
标题翻译：半导体封装
公开(公告)号：US20110278739A1
公开(公告)日：2011-11-17
申请号：US12777442
申请日：2010-05-11
申请人： Yi-Shao Lai , Tsung-Yueh Tsai , Ming-Kun Chen , Hsiao-Chuan Chang , Ming-Hsiang Cheng
发明人： Yi-Shao Lai , Tsung-Yueh Tsai , Ming-Kun Chen , Hsiao-Chuan Chang , Ming-Hsiang Cheng
IPC分类号： H01L23/52
CPC分类号： H01L23/49827 , H01L23/147 , H01L23/48 , H01L23/481 , H01L24/48 , H01L25/0657 , H01L2224/05571 , H01L2224/05573 , H01L2224/16146 , H01L2224/16225 , H01L2224/16227 , H01L2224/48227 , H01L2225/0651 , H01L2225/06513 , H01L2225/06531 , H01L2225/06541 , H01L2225/06548 , H01L2225/06568 , H01L2225/06572 , H01L2924/00014 , H01L2924/10253 , H01L2924/1815 , H01L2924/19104 , H01L2924/19105 , H01L2924/00 , H01L2224/05599 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The present invention relates to a semiconductor package. The semiconductor package includes a substrate, a first chip and an interposer. The first chip is mechanically and electrically connected to the substrate. Some signal pads of the interposer are capacitively coupled to some signal pads of the first chip, so as to provide proximity communication between the first chip and the interposer. Whereby, the capacitively coupled signal pads can be made in fine pitch, and therefore the size of the semiconductor package is reduced and the density of the signal pads is increased.
摘要翻译：本发明涉及半导体封装。半导体封装包括衬底，第一芯片和插入器。第一芯片机械地和电连接到基板。插入器的一些信号焊盘电容耦合到第一芯片的一些信号焊盘，以便在第一芯片和插入器之间提供接近通信。由此，电容耦合的信号焊盘可以以细间距制成，因此半导体封装的尺寸减小，信号焊盘的密度增加。

12. 发明授权

US07980757B2 Bonding strength measuring device 有权
标题翻译：接合强度测量装置
公开(公告)号：US07980757B2
公开(公告)日：2011-07-19
申请号：US12350643
申请日：2009-01-08
申请人： Yi-Shao Lai , Tsung-Yueh Tsai , Hsiao-Chuan Chang
发明人： Yi-Shao Lai , Tsung-Yueh Tsai , Hsiao-Chuan Chang
IPC分类号： G01K1/00 , G01N25/00
CPC分类号： G01N19/04
摘要： A bonding strength measuring device for measuring the bonding strength between a substrate and a molding compound disposed on the substrate is provided. The measuring device includes a heating platform, a heating slide plate, and a fixing bracket. The heating platform has a first heating area and a first replaceable fixture. The substrate is disposed on the first heating area, and the first replaceable fixture is used to fix the substrate and has an opening exposing the molding compound. The heating slide plate has a second heating area and a second replaceable fixture. The second heating area is used to heat the molding compound, and the second replaceable fixture has a cavity for accommodating the molding compound. The fixing bracket is used to fix the heating slide plate above the heating platform.
摘要翻译：提供了用于测量基板和设置在基板上的模塑料之间的接合强度的接合强度测量装置。测量装置包括加热平台，加热滑板和固定支架。加热平台具有第一加热区域和第一可更换夹具。基板设置在第一加热区域上，并且第一可更换夹具用于固定基板，并具有露出模塑料的开口。加热滑板具有第二加热区域和第二可更换夹具。第二加热区域用于加热模塑料，第二可更换夹具具有容纳模塑料的空腔。固定支架用于将加热滑板固定在加热平台上。

13. 发明授权

US07969559B2 Laser distance measuring apparatus and control method thereof 有权
标题翻译：激光距离测量装置及其控制方法
公开(公告)号：US07969559B2
公开(公告)日：2011-06-28
申请号：US12575569
申请日：2009-10-08
申请人： Yin-Long Luo , Tsung-Yueh Tsai
发明人： Yin-Long Luo , Tsung-Yueh Tsai
IPC分类号： G01C3/08
CPC分类号： G01C3/08 , G01S7/481 , G01S7/497 , G01S17/36
摘要： A laser distance measuring apparatus and control method thereof includes an emitter, a first and second liquid crystal display module, a receiver, a condensing lens, and a control unit. The emitter emits measuring light. The control unit sets the first liquid crystal display module to a second state and the second liquid crystal display module to a first state to receive the reflected light. When the reflected light is larger than a predetermined value, the control unit adjusts a transmittance of the first liquid crystal display module until the reflected light is lower than the predetermined value, and calculates a distance value based on phase difference between the reference light and the reflected light.
摘要翻译：激光测距装置及其控制方法包括发射器，第一和第二液晶显示模块，接收器，聚光透镜和控制单元。发射器发射测量光。控制单元将第一液晶显示模块设置为第二状态，将第二液晶显示模块设置为接收反射光的第一状态。当反射光大于预定值时，控制单元调节第一液晶显示模块的透射率，直到反射光低于预定值，并且基于参考光和第一液晶显示模块之间的相位差来计算距离值反射光。

14. 发明授权

US07773203B2 Laser distance-measuring apparatus and control methods thereof 有权
标题翻译：激光测距装置及其控制方法
公开(公告)号：US07773203B2
公开(公告)日：2010-08-10
申请号：US12367629
申请日：2009-02-09
申请人： Tsung-Yueh Tsai
发明人： Tsung-Yueh Tsai
IPC分类号： G01C3/08
CPC分类号： G01C15/002 , G01S7/4811 , G01S7/4972
摘要： A distance-measuring apparatus is disclosed. The distance-measuring apparatus includes: an emitter, emitting a light to be measured toward a target, a receiver, receiving a reflected emitted light; a reflector, reflecting the emitted light to the receiver; a condensing lens, condensing the reflected emitted light, reflected by the target to the reflector; a driving module, adjusting the inclination angle of the reflector; and a control unit, controlling the driving module to rotate according to a result of comparing the intensity of the emitted light received by the receiver and a predetermined value.
摘要翻译：公开了一种测距装置。测距装置包括：发射器，朝向目标发射待测光，接收器，接收反射的发射光; 将发射的光反射到接收器的反射器; 聚光透镜，将反射的发射光聚焦，由目标反射到反射器; 驱动模块，调整反射器的倾斜角度; 以及控制单元，根据将接收机接收到的发射光的强度与预定值进行比较的结果来控制驱动模块的旋转。

15. 发明申请

US20090175312A1 BONDING STRENGTH MEASURING DEVICE 有权
标题翻译：粘结强度测量装置
公开(公告)号：US20090175312A1
公开(公告)日：2009-07-09
申请号：US12350643
申请日：2009-01-08
申请人： Yi-Shao Lai , Tsung-Yueh Tsai , Hsiao-Chuan Chang
发明人： Yi-Shao Lai , Tsung-Yueh Tsai , Hsiao-Chuan Chang
IPC分类号： G01N3/00
CPC分类号： G01N19/04
摘要： A bonding strength measuring device for measuring the bonding strength between a substrate and a molding compound disposed on the substrate is provided. The measuring device includes a heating platform, a heating slide plate, and a fixing bracket. The heating platform has a first heating area and a first replaceable fixture. The substrate is disposed on the first heating area, and the first replaceable fixture is used to fix the substrate and has an opening exposing the molding compound. The heating slide plate has a second heating area and a second replaceable fixture. The second heating area is used to heat the molding compound, and the second replaceable fixture has a cavity for accommodating the molding compound. The fixing bracket is used to fix the heating slide plate above the heating platform.
摘要翻译：提供了用于测量基板和设置在基板上的模塑料之间的接合强度的接合强度测量装置。测量装置包括加热平台，加热滑板和固定支架。加热平台具有第一加热区域和第一可更换夹具。基板设置在第一加热区域上，并且第一可更换夹具用于固定基板，并具有露出模塑料的开口。加热滑板具有第二加热区域和第二可更换夹具。第二加热区域用于加热模塑料，第二可更换夹具具有用于容纳模塑料的空腔。固定支架用于将加热滑板固定在加热平台上。

16. 发明申请

US20090051031A1 Package structure and manufacturing method thereof 审中-公开
标题翻译：包装结构及其制造方法
公开(公告)号：US20090051031A1
公开(公告)日：2009-02-26
申请号：US12219955
申请日：2008-07-31
申请人： Yi-Shao Lai , Tsung-Yueh Tsai
发明人： Yi-Shao Lai , Tsung-Yueh Tsai
IPC分类号： H01L23/488 , H01L21/56
CPC分类号： H01L21/6835 , H01L21/568 , H01L23/3107 , H01L24/48 , H01L2224/48091 , H01L2224/73257 , H01L2224/85005 , H01L2224/9222 , H01L2924/00014 , H01L2924/01079 , H01L2924/15311 , H01L2924/181 , H01L2924/18165 , H01L2224/85 , H01L2224/11 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A package structure and a manufacturing method thereof are provided. The package structure comprises a carrier, a chip, at least one wire, a molding compound, at least one first solder ball and at least one second solder ball. The carrier has a chip chamber passing through the first surface and the second surface. The chip is disposed in the chip chamber, and an active surface of the chip is coplanar with the first surface. During packaging, the first surface and the active surface are both tightly pasted on a carrier tape to facilitate the subsequent wire bonding and sealing process. Afterwards, the carrier tape is removed for exposing the active surface and the first surface, and the active surface of the chip is coplanar with the first surface of the carrier, hence simplifying the packaging process and reducing the thickness of the package structure.
摘要翻译：提供一种封装结构及其制造方法。封装结构包括载体，芯片，至少一个线，模制化合物，至少一个第一焊球和至少一个第二焊球。载体具有通过第一表面和第二表面的芯片室。芯片设置在芯片室中，芯片的有源表面与第一表面共面。在包装过程中，第一表面和活性表面都紧密地粘贴在载带上，以便随后的引线接合和密封过程。之后，移除载带以使活性表面和第一表面露出，并且芯片的活性表面与载体的第一表面共面，从而简化封装工艺并减小封装结构的厚度。

17. 发明授权

US06854900B2 Method of fabricating a wavelength division multiplexed (WDM) unit 失效
标题翻译：制造波分复用（WDM）单元的方法
公开(公告)号：US06854900B2
公开(公告)日：2005-02-15
申请号：US10195497
申请日：2002-07-16
申请人： I-Jen Lai , Pie-Yau Chien , Chin-Hsiang Wang , Yu-Ting Lee , Tsung-Yueh Tsai , Chih-Hsien Lin
发明人： I-Jen Lai , Pie-Yau Chien , Chin-Hsiang Wang , Yu-Ting Lee , Tsung-Yueh Tsai , Chih-Hsien Lin
IPC分类号： G02B6/293 , G02B6/32 , G02B6/34 , G02B6/42 , G02B6/36 , H04J14/02
CPC分类号： G02B6/2938 , G02B6/2937 , G02B6/327 , G02B6/4233 , G02B6/4239
摘要： A method of fabricating a WDM unit consists of attaching a first and a second GRIN lenses to opposite faces of a WDM filter. A dual fiber pigtail and a single fiber pigtail are mounted in corresponding glass tubes. The glass tube with the dual fiber pigtail and the glass tube with the single fiber pigtail are mounted on the second GRIN lens and the first GRIN lens respectively. The position of the dual fiber pigtail and the single fiber pigtail are adjusted with respect to the second GRIN lens and the first GRIN lens respectively to obtain the best optical property. The invention prevents the WDM filter from tilting during temperature variation by sandwiching the WDM filter in between the two GRIN lenses, and further prevents the WDM unit from increasing the reflection loss and insertion loss.
摘要翻译：制造WDM单元的方法包括将第一和第二GRIN透镜附接到WDM滤光器的相对面。双纤尾纤和单纤尾纤安装在相应的玻璃管中。具有双纤维尾纤的玻璃管和带有单纤维尾纤的玻璃管分别安装在第二GRIN透镜和第一GRIN透镜上。相对于第二GRIN透镜和第一GRIN透镜分别调整双光纤尾纤和单纤尾纤的位置，以获得最佳的光学性能。本发明通过将WDM滤光片夹在两个GRIN透镜之间来防止WDM滤光器在温度变化期间倾斜，并且进一步防止WDM单元增加反射损耗和插入损耗。

18. 发明授权

US06801429B2 Package structure compatible with cooling system 有权
标题翻译：封装结构兼容冷却系统
公开(公告)号：US06801429B2
公开(公告)日：2004-10-05
申请号：US10605081
申请日：2003-09-08
申请人： Tsung-Yueh Tsai , Sheng-Yang Peng
发明人： Tsung-Yueh Tsai , Sheng-Yang Peng
IPC分类号： H05K720
CPC分类号： G06F1/20 , G06F2200/201 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/15311 , H01L2924/00014 , H01L2924/00
摘要： The present invention relates to a package structure compatible with a cooling system, the package structure comprising a carrier, a chip, a mold compound and a cooling tubule that can be connected to a cooling system. The chip is arranged on the carrier and electrically connected to the carrier, while the mold compound covers the chip and one surface of the carrier. The cooling tubule is disposed either within the mold compound or on an outer surface of the mold compound. The cooling tubule is connected to a cooling tubing of the cooling system and a fluid driven by a pump circulates in the cooling tubing and the cooling tubule for heat dissipation.
摘要翻译：本发明涉及一种与冷却系统兼容的封装结构，该封装结构包括可连接到冷却系统的载体，芯片，模具化合物和冷却小管。芯片布置在载体上并电连接到载体上，而模具化合物覆盖芯片和载体的一个表面。冷却管被设置在模具化合物内或模具化合物的外表面上。冷却管与冷却系统的冷却管连接，由泵驱动的流体在冷却管和冷却管中循环，用于散热。

19. 发明申请

US20120119342A1 ADVANCED QUAD FLAT NON-LEADED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：先进的四边平面非引线封装结构及其制造方法
公开(公告)号：US20120119342A1
公开(公告)日：2012-05-17
申请号：US12944695
申请日：2010-11-11
申请人： Pao-Huei Chang Chien , Ping-Cheng Hu , Po-Shing Chiang , Wei-Lun Cheng , Hsueh-Te Wang , Hsiao-Chuan Chang , Tsung-Yueh Tsai , Yi-Shao Lai , Ping-Feng Yang
发明人： Pao-Huei Chang Chien , Ping-Cheng Hu , Po-Shing Chiang , Wei-Lun Cheng , Hsueh-Te Wang , Hsiao-Chuan Chang , Tsung-Yueh Tsai , Yi-Shao Lai , Ping-Feng Yang
IPC分类号： H01L23/495 , H01L21/58 , H01L21/56
CPC分类号： H01L21/4832 , H01L21/561 , H01L23/3107 , H01L23/49503 , H01L23/49548 , H01L23/49582 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/4911 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/078 , H01L2924/181 , H01L2924/19107 , H01L2924/30107 , H01L2224/83 , H01L2224/85 , H01L2924/00 , H01L2224/45099 , H01L2924/00012
摘要： The advanced quad flat non-leaded package structure includes a carrier, a chip, a plurality of wires, and a molding compound. The carrier includes a die pad and a plurality of leads. The inner leads of the leads are designed to possess incurved sidewalls for enhancing the adhesion between the inner leads and the surrounding molding compound.
摘要翻译：先进的四边形扁平无铅封装结构包括载体，芯片，多根导线和模塑料。载体包括管芯焊盘和多个引线。引线的内引线被设计成具有弯曲的侧壁，用于增强内引线和周围模塑料之间的粘附。

20. 发明申请

US20120091575A1 Semiconductor Package And Method For Making The Same 审中-公开
标题翻译：半导体封装及其制作方法
公开(公告)号：US20120091575A1
公开(公告)日：2012-04-19
申请号：US12905756
申请日：2010-10-15
申请人： Yi-Shao Lai , Tsung-Yueh Tsai , Ming-Kun Chen , Hsiao-Chuan Chang , Ming-Hsiang Cheng
发明人： Yi-Shao Lai , Tsung-Yueh Tsai , Ming-Kun Chen , Hsiao-Chuan Chang , Ming-Hsiang Cheng
IPC分类号： H01L23/48 , H01L21/50
CPC分类号： H01L23/48 , H01L24/02 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/73 , H01L24/81 , H01L24/83 , H01L25/0657 , H01L2224/02371 , H01L2224/02381 , H01L2224/0401 , H01L2224/14155 , H01L2224/16225 , H01L2224/2919 , H01L2224/2929 , H01L2224/29294 , H01L2224/293 , H01L2224/32105 , H01L2224/32145 , H01L2224/32225 , H01L2224/33183 , H01L2224/73103 , H01L2224/73203 , H01L2224/81191 , H01L2224/83192 , H01L2224/83815 , H01L2224/83851 , H01L2224/83903 , H01L2225/06517 , H01L2225/06531 , H01L2225/06551 , H01L2225/06555 , H01L2924/014 , H01L2924/00012
摘要： The present invention relates to a semiconductor package and a method for making the same. The semiconductor package includes a substrate, at least one first chip, a dielectric layer and at least one second chip. The first chip is attached and electrically connected to the substrate. The first chip includes a first active surface and a plurality of first signal coupling pads. The first signal coupling pads are disposed adjacent to the first active surface. The dielectric layer is disposed on the first active surface. The second chip is attached and electrically connected to the substrate by metal bumps. The second chip includes a second active surface and a plurality of second signal coupling pads. The second active surface contacts the dielectric layer. The second signal coupling pads are disposed adjacent to the second active surface, and capacitively coupled to the first signal coupling pads of the first chip, so as to provide proximity communication between the first chip and the second chip. Whereby, the gap between the first signal coupling pads of the first chip and the second signal coupling pads of the second chip is controlled by the thickness of the dielectric layer. Therefore, the mass-production yield of the semiconductor package is increased.
摘要翻译：半导体封装及其制造方法技术领域本发明涉及半导体封装及其制造方法。半导体封装包括衬底，至少一个第一芯片，电介质层和至少一个第二芯片。第一芯片被附接并电连接到基板。第一芯片包括第一有源表面和多个第一信号耦合焊盘。第一信号耦合焊盘设置成与第一有源表面相邻。电介质层设置在第一有源表面上。第二芯片通过金属凸块附接和电连接到基板。第二芯片包括第二有源表面和多个第二信号耦合焊盘。第二活性表面接触电介质层。第二信号耦合焊盘设置成与第二有源表面相邻，并且电容耦合到第一芯片的第一信号耦合焊盘，以便提供第一芯片和第二芯片之间的接近通信。由此，第一芯片的第一信号耦合焊盘与第二芯片的第二信号耦合焊盘之间的间隙由电介质层的厚度来控制。因此，半导体封装的批量生产量增加。

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