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11. 发明申请

US20130105954A1 SEMICONDUCTOR PACKAGE 失效
标题翻译：半导体封装
公开(公告)号：US20130105954A1
公开(公告)日：2013-05-02
申请号：US13352146
申请日：2012-01-17
申请人： Chang Hyun Lim , Chang Jae Heo , Young Ki Lee , Sung Keun Park
发明人： Chang Hyun Lim , Chang Jae Heo , Young Ki Lee , Sung Keun Park
IPC分类号： H01L23/495
CPC分类号： H01L23/36 , H01L23/49531 , H01L23/49537 , H01L23/49811 , H01L2224/48091 , H01L2924/1305 , H01L2924/13055 , H01L2924/00 , H01L2924/00014
摘要： Disclosed herein is a semiconductor package, including: a substrate having a first surface and a second surface; at least one semiconductor device formed on the first surface of the substrate; first lead frames respectively formed at both sides of the first surface of the substrate; and second lead frames respectively formed at both sides of the second surface of the substrate, wherein the first lead frame and the second lead frame are spaced apart from each other by an isolation distance base.
摘要翻译：本文公开了一种半导体封装，包括：具有第一表面和第二表面的基板; 形成在所述基板的第一表面上的至少一个半导体器件; 分别形成在基板的第一表面的两侧的第一引线框架; 以及分别形成在所述基板的第二表面的两侧的第二引线框架，其中所述第一引线框架和所述第二引线框架通过隔离距离基座间隔开。

12. 发明授权

US08134077B2 Heat dissipating circuit board and method of manufacturing the same 有权
公开(公告)号：US08134077B2
公开(公告)日：2012-03-13
申请号：US12614405
申请日：2009-11-07
申请人： Hye Sook Shin , Seog Moon Choi , Shan Gao , Chang Hyun Lim , Tae Hyun Kim , Young Ki Lee
发明人： Hye Sook Shin , Seog Moon Choi , Shan Gao , Chang Hyun Lim , Tae Hyun Kim , Young Ki Lee
IPC分类号： H05K7/20 , H05K1/00
摘要： Disclosed is a heat dissipating circuit board, which includes a metal core including an insulating layer formed on the surface thereof, a circuit layer formed on the insulating layer and including a seed layer and a first circuit pattern, and a heat dissipating frame layer bonded onto the circuit layer using solder and having a second circuit pattern, and in which the heat dissipating frame layer is bonded onto the circuit layer not by a plating process but by using solder, thus reducing the cost and time of the plating process and relieving stress applied to the heat dissipating circuit board due to the plating process. A method of manufacturing the heat dissipating circuit board is also provided.

13. 发明授权

US08198543B2 Rigid-flexible circuit board and method of manufacturing the same 失效
标题翻译：刚性柔性电路板及其制造方法
公开(公告)号：US08198543B2
公开(公告)日：2012-06-12
申请号：US12618726
申请日：2009-11-14
申请人： Jung Eun Kang , Seog Moon Choi , Tae Hoon Kim , Young Ki Lee , Hye Sook Shin , Chang Hyun Lim
发明人： Jung Eun Kang , Seog Moon Choi , Tae Hoon Kim , Young Ki Lee , Hye Sook Shin , Chang Hyun Lim
IPC分类号： H05K1/00
CPC分类号： H05K3/4641 , H05K1/0203 , H05K1/053 , H05K1/189 , H05K3/462 , H05K3/4691 , H05K2203/0315 , Y10T29/49124 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165
摘要： Disclosed is a rigid-flexible circuit board, which includes a rigid region and a flexible region, the rigid region including a flexible substrate having a first circuit layer on both surfaces thereof, a metal core substrate formed on the flexible substrate and having a second circuit layer on both surfaces thereof, and an adhesive layer disposed between the flexible substrate and the metal core substrate, wherein the metal core substrate includes a metal core having a through hole, and an insulating layer formed on a surface of the metal core, so that the rigid region and the flexible region are thermally separated from each other and heat dissipation properties of the rigid region are improved. A method of manufacturing the rigid-flexible circuit board is also provided.
摘要翻译：公开了一种刚性柔性电路板，其包括刚性区域和柔性区域，所述刚性区域包括在其两个表面上具有第一电路层的柔性基板，形成在柔性基板上的金属芯基板，并具有第二电路并且设置在柔性基板和金属芯基板之间的粘合层，其中金属芯基板包括具有通孔的金属芯和形成在金属芯的表面上的绝缘层，使得刚性区域和柔性区域彼此热分离，改善了刚性区域的散热性能。还提供了制造刚性柔性电路板的方法。

14. 发明申请

US20110042130A1 Multilayered wiring substrate and manufacturing method thereof 审中-公开
标题翻译：多层布线基板及其制造方法
公开(公告)号：US20110042130A1
公开(公告)日：2011-02-24
申请号：US12654529
申请日：2009-12-22
申请人： Chang Hyun Lim , Tae Hoon Kim , Young Ki Lee , Tae Hyun Kim , Ki Ho Seo
发明人： Chang Hyun Lim , Tae Hoon Kim , Young Ki Lee , Tae Hyun Kim , Ki Ho Seo
IPC分类号： H05K1/11 , H01K3/10 , H05K3/36
CPC分类号： H05K3/4641 , H05K1/053 , H05K3/445 , H05K3/4623 , H05K2203/0315 , Y10T29/49126 , Y10T29/49162
摘要： A multilayered wiring substrate and a manufacturing method thereof are disclosed. The multilayered wiring substrate includes: a stacked body including an insulating member and first and second metal cores stacked with the insulating member interposed therebetween, and having a through hole penetrating the first and second metal cores; first and second insulation layers formed on an external surface, excluding an inner wall of the through hole, of the first and second metal cores, respectively; first and second inner layer circuit patterns and first and second outer layer circuit patterns formed on the first and second insulation layers, respectively; first and second via electrodes electrically connecting the first and second inner layer circuit patterns and the first and second outer layer circuit patterns; a third insulation layer formed on the inner wall of the through hole; and a through electrode made of a conductive material filled in the through hole and electrically connecting the first and second outer layer circuit patterns.
摘要翻译：公开了一种多层布线基板及其制造方法。所述多层布线基板包括：堆叠体，其包括绝缘部件和被插入其间的所述绝缘部件堆叠的第一和第二金属芯体，并且具有穿过所述第一和第二金属芯体的通孔; 第一和第二绝缘层分别形成在第一和第二金属芯的外表面上，不包括通孔的内壁; 分别形成在第一绝缘层和第二绝缘层上的第一和第二内层电路图案和第一和第二外层电路图案; 第一和第二通孔电极，电连接第一和第二内层电路图案以及第一和第二外层电路图案; 形成在所述通孔的内壁上的第三绝缘层; 以及由填充在所述通孔中的导电材料制成的电连接电连接所述第一外层电路图案和所述第二外层电路图案的贯通电极。

15. 发明授权

US08603842B2 Method of manufacturing package substrate for optical element 有权
标题翻译：制造光学元件封装基板的方法
公开(公告)号：US08603842B2
公开(公告)日：2013-12-10
申请号：US13418241
申请日：2012-03-12
申请人： Chang Hyun Lim , Seog Moon Choi , Sang Hyun Shin , Sung Keun Park , Young Ki Lee
发明人： Chang Hyun Lim , Seog Moon Choi , Sang Hyun Shin , Sung Keun Park , Young Ki Lee
IPC分类号： H01L33/62
CPC分类号： H01L33/54 , H01L33/505 , H01L33/62 , H01L2224/32225 , H01L2224/73265 , H01L2224/48091 , H01L2924/00014
摘要： Disclosed is a package substrate for an optical element, which includes a base substrate, a first circuit layer formed on the base substrate and including a mounting portion, an optical element mounted on the mounting portion, one or more trenches formed into a predetermined pattern around the mounting portion by removing portions of the first circuit layer so that the first circuit layer and the optical element are electrically connected to each other, and a fluorescent resin material applied on an area defined by the trenches so as to cover the optical element, and in which such trenches are formed on the first circuit layer so that the optical element and the first circuit layer are electrically connected to each other, thus maintaining the shape of the fluorescent resin material and obviating the need to form a via under the optical element. A method of manufacturing the package substrate for an optical element is also provided.
摘要翻译：公开了一种用于光学元件的封装基板，其包括基底基板，形成在基底基板上并包括安装部分的第一电路层，安装在安装部分上的光学元件，形成为预定图案的一个或多个沟槽通过去除第一电路层的部分使得第一电路层和光学元件彼此电连接的安装部分和施加在由沟槽限定的区域以覆盖光学元件的荧光树脂材料，以及其中这种沟槽形成在第一电路层上，使得光学元件和第一电路层彼此电连接，从而保持荧光树脂材料的形状，并且消除了在光学元件下形成通孔的需要。还提供了一种制造用于光学元件的封装衬底的方法。

16. 发明授权

US08242371B2 Heat dissipating circuit board and method of manufacturing the same 有权
标题翻译：散热电路板及其制造方法
公开(公告)号：US08242371B2
公开(公告)日：2012-08-14
申请号：US12614405
申请日：2009-11-07
申请人： Hye Sook Shin , Seog Moon Choi , Shan Gao , Chang Hyun Lim , Tae Hyun Kim , Young Ki Lee
发明人： Hye Sook Shin , Seog Moon Choi , Shan Gao , Chang Hyun Lim , Tae Hyun Kim , Young Ki Lee
IPC分类号： H05K7/20 , H05K1/00
CPC分类号： H05K7/205 , H05K1/0209 , H05K1/0263 , H05K1/053 , H05K3/202 , H05K3/24 , H05K3/341 , H05K2201/066 , Y10T29/49124 , Y10T29/49126 , Y10T29/49155
摘要： Disclosed is a heat dissipating circuit board, which includes a metal core including an insulating layer formed on the surface thereof, a circuit layer formed on the insulating layer and including a seed layer and a first circuit pattern, and a heat dissipating frame layer bonded onto the circuit layer using solder and having a second circuit pattern, and in which the heat dissipating frame layer is bonded onto the circuit layer not by a plating process but by using solder, thus reducing the cost and time of the plating process and relieving stress applied to the heat dissipating circuit board due to the plating process. A method of manufacturing the heat dissipating circuit board is also provided.
摘要翻译：公开了一种散热电路板，其包括金属芯，该金属芯包括在其表面上形成的绝缘层，形成在绝缘层上的电路层，包括种子层和第一电路图案，以及散热框架层，使用焊料并具有第二电路图案的电路层，其中散热框架层不是通过电镀工艺而是通过使用焊料结合到电路层上，因此降低了电镀工艺的成本和时间并减轻了施加的应力由于电镀过程而导致散热电路板。还提供了制造散热电路板的方法。

17. 发明申请

US20110140144A1 PACKAGE SUBSTRATE FOR OPTICAL ELEMENT AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：用于光学元件的封装基板及其制造方法
公开(公告)号：US20110140144A1
公开(公告)日：2011-06-16
申请号：US12721539
申请日：2010-03-10
申请人： Chang Hyun Lim , Seog Moon Choi , Sang Hyun Shin , Sung Keun Park , Young Ki Lee
发明人： Chang Hyun Lim , Seog Moon Choi , Sang Hyun Shin , Sung Keun Park , Young Ki Lee
IPC分类号： H01L33/00 , H01L31/00
CPC分类号： H01L33/54 , H01L33/505 , H01L33/62 , H01L2224/32225 , H01L2224/73265 , H01L2224/48091 , H01L2924/00014
摘要： Disclosed is a package substrate for an optical element, which includes a base substrate, a first circuit layer formed on the base substrate and including a mounting portion, an optical element mounted on the mounting portion, one or more trenches formed into a predetermined pattern around the mounting portion by removing portions of the first circuit layer so that the first circuit layer and the optical element are electrically connected to each other, and a fluorescent resin material applied on an area defined by the trenches so as to cover the optical element, and in which such trenches are formed on the first circuit layer so that the optical element and the first circuit layer are electrically connected to each other, thus maintaining the shape of the fluorescent resin material and obviating the need to form a via under the optical element. A method of manufacturing the package substrate for an optical element is also provided.
摘要翻译：公开了一种用于光学元件的封装基板，其包括基底基板，形成在基底基板上并包括安装部分的第一电路层，安装在安装部分上的光学元件，形成为预定图案的一个或多个沟槽通过去除第一电路层的部分使得第一电路层和光学元件彼此电连接的安装部分和施加在由沟槽限定的区域以覆盖光学元件的荧光树脂材料，以及其中这种沟槽形成在第一电路层上，使得光学元件和第一电路层彼此电连接，从而保持荧光树脂材料的形状，并且消除了在光学元件下形成通孔的需要。还提供了一种制造用于光学元件的封装衬底的方法。

18. 发明申请

US20110101392A1 PACKAGE SUBSTRATE FOR OPTICAL ELEMENT AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：用于光学元件的封装基板及其制造方法
公开(公告)号：US20110101392A1
公开(公告)日：2011-05-05
申请号：US12642326
申请日：2009-12-18
申请人： Sung Keun Park , Seog Moon Choi , Young Ki Lee , Chang Hyun Lim
发明人： Sung Keun Park , Seog Moon Choi , Young Ki Lee , Chang Hyun Lim
IPC分类号： H01L33/00 , H01L21/56
CPC分类号： H01L33/50 , H01L33/486 , H01L33/64 , H01L2224/48091 , H01L2224/48227 , H01L2224/8592 , H01L2924/01322 , H01L2924/181 , H01L2933/0041 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： Disclosed is a package substrate for an optical element, which includes a metal core having a hole formed therein, an insulating layer formed on the surface of the metal core, a first metal layer formed to a predetermined thickness on the surface of the insulating layer so as to include therein the metal core insulated by the insulating layer, an optical element mounted on the first metal layer, and a fluorescent resin material applied on the optical element in order to protect the optical element, thereby simplifying a package substrate process and improving light uniformity, light reflectivity and heat dissipating properties compared to a conventional configuration. A method of manufacturing the package substrate is also provided.
摘要翻译：公开了一种用于光学元件的封装基板，其包括其中形成有孔的金属芯，形成在金属芯的表面上的绝缘层，在绝缘层的表面上形成为预定厚度的第一金属层，在其中包括由绝缘层绝缘的金属芯，安装在第一金属层上的光学元件和施加在光学元件上的荧光树脂材料，以保护光学元件，从而简化了封装衬底处理和改善光均匀性，光反射率和散热特性。还提供了制造封装基板的方法。

19. 发明申请

US20120225508A1 PACKAGE SUBSTRATE FOR PTICAL ELEMENT AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：用于塑料元件的包装基材及其制造方法
公开(公告)号：US20120225508A1
公开(公告)日：2012-09-06
申请号：US13418241
申请日：2012-03-12
申请人： Chang Hyun Lim , Seog Moon Choi , Sang Hyun Shin , Sung Keun Park , Young Ki Lee
发明人： Chang Hyun Lim , Seog Moon Choi , Sang Hyun Shin , Sung Keun Park , Young Ki Lee
IPC分类号： H01L33/48
CPC分类号： H01L33/54 , H01L33/505 , H01L33/62 , H01L2224/32225 , H01L2224/73265 , H01L2224/48091 , H01L2924/00014
摘要： Disclosed is a package substrate for an optical element, which includes a base substrate, a first circuit layer formed on the base substrate and including a mounting portion, an optical element mounted on the mounting portion, one or more trenches formed into a predetermined pattern around the mounting portion by removing portions of the first circuit layer so that the first circuit layer and the optical element are electrically connected to each other, and a fluorescent resin material applied on an area defined by the trenches so as to cover the optical element, and in which such trenches are formed on the first circuit layer so that the optical element and the first circuit layer are electrically connected to each other, thus maintaining the shape of the fluorescent resin material and obviating the need to form a via under the optical element. A method of manufacturing the package substrate for an optical element is also provided.
摘要翻译：公开了一种用于光学元件的封装基板，其包括基底基板，形成在基底基板上并包括安装部分的第一电路层，安装在安装部分上的光学元件，形成为预定图案的一个或多个沟槽通过去除第一电路层的部分使得第一电路层和光学元件彼此电连接的安装部分和施加在由沟槽限定的区域以覆盖光学元件的荧光树脂材料，以及其中这种沟槽形成在第一电路层上，使得光学元件和第一电路层彼此电连接，从而保持荧光树脂材料的形状，并且消除了在光学元件下形成通孔的需要。还提供了一种制造用于光学元件的封装衬底的方法。

20. 发明授权

US08220826B2 Ramp bracket for curtain airbag of vehicle 有权
标题翻译：车辆帘式气囊斜坡支架
公开(公告)号：US08220826B2
公开(公告)日：2012-07-17
申请号：US12832744
申请日：2010-07-08
申请人： Sung Yong Park , Chang Jin Oh , Dae Young Kwak , Chang Hyun Lim , Woo Hyun Lim , Tae Woo Kim , Hee Sang An , Gyeong Won Jeong
发明人： Sung Yong Park , Chang Jin Oh , Dae Young Kwak , Chang Hyun Lim , Woo Hyun Lim , Tae Woo Kim , Hee Sang An , Gyeong Won Jeong
IPC分类号： B60R21/201 , B60R21/213 , B60R21/215 , B60R21/232
CPC分类号： B60R21/055 , B60R21/213
摘要： A ramp bracket for a curtain airbag cushion of a vehicle may include a cushion storage portion storing the curtain airbag cushion therein, the cushion storage portion having an opening on a first sidewall thereof such that the curtain airbag cushion is deployed through the opening, wherein the first sidewall includes upper and lower surfaces to define the opening, and a shock absorption portion formed under a lower surface of the cushion storage portion and absorbing a shock generated when a passenger collides to the shock absorption portion.
摘要翻译：用于车辆的帘式气囊垫的斜撑支架可以包括在其中存储帘式气囊垫的缓冲存储部分，缓冲存储部分在其第一侧壁上具有开口，使得帘式气囊垫通过开口展开，其中第一侧壁包括限定开口的上表面和下表面，以及形成在缓冲存储部分的下表面下方的吸震部分，并且吸收当乘客与减震部分碰撞时产生的冲击。

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