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11. 发明授权

US5318651A Method of bonding circuit boards 失效
标题翻译：电路板接合方法
公开(公告)号：US5318651A
公开(公告)日：1994-06-07
申请号：US978720
申请日：1992-11-19
申请人： Koji Matsui , Mitsuru Kimura , Kazuaki Utsumi , Eiichi Ogawa , Hiroshi Komano , Toshimi Aoyama
发明人： Koji Matsui , Mitsuru Kimura , Kazuaki Utsumi , Eiichi Ogawa , Hiroshi Komano , Toshimi Aoyama
IPC分类号： H01L21/60 , H01L21/603 , H01L21/98 , H05K3/00 , H05K3/28 , H05K3/32 , H05K3/46 , B32B31/00
CPC分类号： H05K3/4617 , H01L24/81 , H01L25/50 , H01L2224/13111 , H01L2224/13144 , H01L2224/16 , H01L2224/2929 , H01L2224/293 , H01L2224/81193 , H01L2224/81801 , H01L2224/83101 , H01L2224/83851 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07811 , H01L2924/09701 , H01L2924/14 , H01L2924/3025 , H05K2203/0278 , H05K3/0023 , H05K3/28 , H05K3/328 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144
摘要： A method of bonding first and second circuit boards includes applying a light-sensitive adhesive over the first electrodes on a first circuit board and the areas where the first electrodes are not formed, and drying the applied adhesive to form a light-sensitive adhesive layer having the light-sensitive adhesive layer exposed selectively to active rays of light and performing development to remove only the light-sensitive adhesive layer on the first electrodes, and then performing a heat treatment to impart bonding quality to the light-sensitive adhesive layer remaining between adjacent first electrodes, placing the first and second circuit boards one on top of the other and thermocompressing the two circuit boards to have the first electrodes connected electrically to the second electrodes to form a single circuit board; and performing a heat treatment and/or exposure to active rays of light on the formed single circuit board.
摘要翻译：接合第一和第二电路板的方法包括在第一电路板上的第一电极上和不形成第一电极的区域上施加光敏粘合剂，并干燥所施加的粘合剂以形成具有光敏粘合剂层选择性地暴露于活性光线并进行显影以除去第一电极上的光敏粘合剂层，然后进行热处理以赋予残留在相邻的粘合剂层之间的粘合剂层的粘合质量第一电极，将第一和第二电路板放置在另一个之上，并且热压两个电路板，以使第一电极与第二电极电连接以形成单个电路板; 并且对所形成的单电路板进行热处理和/或对活性光线的曝光。

12. 发明授权

US4756808A Piezoelectric transducer and process for preparation thereof 失效
标题翻译：压电换能器及其制备方法
公开(公告)号：US4756808A
公开(公告)日：1988-07-12
申请号：US869633
申请日：1986-06-02
申请人： Kazuaki Utsumi , Takeshi Inoue , Sadayuki Takahashi
发明人： Kazuaki Utsumi , Takeshi Inoue , Sadayuki Takahashi
IPC分类号： B06B1/06 , G10K11/02 , C25D13/00 , C25D13/02 , C25D13/04 , H01L41/04
CPC分类号： B06B1/067 , G10K11/02
摘要： A piezoelelectric transducer usable preferably as a high-frequency ultrasonic probe for diagnostic inspection and the process for preparation thereof are disclosed.The piezoelectric transducer comprises a piezoelectric material layer, a pair of electrode layers formed respectively on the opposite surfaces of said piezoelectric material layer and for applying electric load across the piezoelectric material layer to thereby generate acoustic oscillation or for measuring electric energy generated due to the acoustic oscillation of the piezoelectric material layer, and an acoustic matching section containing at least one quarter-wave matching layer and formed on one of the electrode layers. The acoustic matching section includes an elelctric conductive layer therein.The acoustic matching section is formed by electro deposition, preferably by the electro painting method or electrophoretic method.The ultrasonic probe can be prepared of a frequency band higher than 7.5 MHz, even higher than 10 MHz and provides a clear image of a shallow portion from the surface of an object to be inspected such as a human body.
摘要翻译：可以优选使用可用作用于诊断检查的高频超声波探头及其制备方法的压电式换能器。压电换能器包括压电材料层，一对电极层，分别形成在所述压电材料层的相对表面上，并用于在压电材料层之间施加电负载，从而产生声振动或用于测量由于声学产生的电能压电材料层的振动，以及包含至少一个四分之一波长匹配层并形成在一个电极层上的声匹配部分。声匹配部分包括其中的电导电层。声匹配部分通过电沉积形成，优选通过电喷涂法或电泳方法形成。可以制备高于7.5MHz，甚至高于10MHz的频带的超声波探头，并从被检查物体（例如人体）的表面提供浅部分的清晰图像。

13. 发明授权

US4536435A Multilayer substrate including layers of an alumina and borosilicate-lead-glass ceramic material 失效
标题翻译：包括氧化铝和硼硅酸盐 - 铅 - 玻璃陶瓷材料层的多层衬底
公开(公告)号：US4536435A
公开(公告)日：1985-08-20
申请号：US434238
申请日：1982-10-14
申请人： Kazuaki Utsumi , Yuzo Shimada , Masanori Suzuki , Hideo Takamizawa
发明人： Kazuaki Utsumi , Yuzo Shimada , Masanori Suzuki , Hideo Takamizawa
IPC分类号： H05K3/28 , B32B9/00 , B32B15/04 , B32B18/00 , C03C10/00 , H01B3/12 , H01L23/15 , H05K1/00 , H05K1/03 , H05K3/46 , B32B3/00
CPC分类号： H01L23/15 , C03C10/0054 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K3/4629 , H05K3/4676 , Y10S428/901 , Y10T428/24917 , Y10T428/24926
摘要： A multilayer glass-ceramic substrate comprises insulator layers of a composition consisting essentially of, when components are expressed as oxides in percent by weight, 40-60 percent of aluminum oxide, 1-40 percent of lead oxide, 1-30 percent of boron oxide, 2-40 percent of silicon dioxide, 0.01-25 percent of at least one oxide of chemical element(s) of Group II of the periodic table, and 0.01-10 percent of at least one oxide of Group IV element(s) except carbon, silicon, and lead. Each insulator layer may be only from 190 microns down to 10 microns thick. The substrate has a flexural strength of 2,100 kg/cm.sup.2 or more. Preferably, the Group II element(s) is magnesium, calcium, strontium, barium, and/or zinc. The Group IV element(s) is zirconium, titanium, germanium, and/or tin. When the percentages are 40-60 for aluminum oxide, 4.1-16.6 for lead oxide, 1.0-10.0 for boron oxide, 14.0-39.1 for silicon dioxide, 0.1-4.8 for magnesium oxide, 2.0-10.0 for calcium oxide, 0.05-3.0 for barium oxide, 0.01-3.0 for zirconium oxide, and 0.01-2.5 for titanium oxide, the substrate has a flexural strength of 3,000 kg/cm.sup.2 or more and an interlayer leakage current of 8 microamperes or less. Each insulator layer has a structure of a vitreous network of borosilicate-lead series glass with the interstices occupied by crystals of aluminum oxide and microcrystalline structures which are obtained by reaction of aluminum oxide and glass of the borosilicate lead series.
摘要翻译：多层玻璃陶瓷基板包括绝缘体层，其组成基本上由组分按百分比表示为氧化物，40-60％的氧化铝，1-40％的氧化铅，1-30％的氧化硼，2-40％的二氧化硅，0.01-25％的至少一种元素周期表第II族化学元素的氧化物和0.01-10％的至少一种IV族元素的氧化物，除了碳，硅和铅。每个绝缘体层可以仅为190微米至10微米厚。基材的弯曲强度为2100公斤/厘米2以上。优选地，II族元素是镁，钙，锶，钡和/或锌。 IV族元素是锆，钛，锗和/或锡。当氧化铝的百分比为40-60，氧化铅为4.1-16.6，氧化硼为1.0-10.0，二氧化硅为14.0-39.1，氧化镁为0.1-4.8，氧化钙为2.0-10.0，氧化钙为0.05〜3.0 氧化钡，氧化锆为0.01-3.0，氧化钛为0.01〜2.5，基板的挠曲强度为3000kg / cm 2以上，层间漏电流为8微安以上。每个绝缘体层具有硼硅酸盐 - 铅系列玻璃的玻璃质网络的结构，其中通过氧化铝和硼硅酸铅系列的玻璃的反应获得氧化铝晶体和微晶结构所占据的空隙。

14. 发明授权

US4325763A Method of manufacturing ceramic capacitors 失效
标题翻译：制造陶瓷电容器的方法
公开(公告)号：US4325763A
公开(公告)日：1982-04-20
申请号：US203700
申请日：1980-11-03
申请人： Kazuaki Utsumi , Masatomo Yonezawa , Tomeji Ohno
发明人： Kazuaki Utsumi , Masatomo Yonezawa , Tomeji Ohno
IPC分类号： C04B41/51 , C04B41/88 , C22C32/00 , H01G4/008 , H01G4/30 , C03B29/00 , C04B33/34 , C04B43/00 , H01G4/10
CPC分类号： C04B41/88 , C04B41/009 , C04B41/5111 , C22C32/0015 , H01G4/0085 , H01G4/30 , Y10T156/1089
摘要： A ceramic capacitor is prepared by corting an electrode paste on the opposite surfaces of a green ceramic body. The electrode paste contains an inorganic binder having the same composition as the green ceramic body. Then the green ceramic body is sintered and at the same time the electrode paste is baked to form electrodes for attaching lead wires.
摘要翻译：陶瓷电容器是通过将电极浆料放在生坯陶瓷体的相对表面上来制备的。电极糊含有与生坯陶瓷体相同组成的无机粘结剂。然后将生坯陶瓷体烧结，同时烘烤电极糊以形成用于附接引线的电极。

15. 发明授权

US3969252A Dielectric ceramic compositions of BaTiO.sub.3 -BaZrO.sub.3 -CaTiO.sub.3 system 失效
标题翻译： BaTiO {HD 3 {B-BaZrO {HD 3 {B-CaTiO {HD 3 {B体系）的介电陶瓷组合物
公开(公告)号：US3969252A
公开(公告)日：1976-07-13
申请号：US506040
申请日：1974-09-16
申请人： Kazuaki Utsumi , Tomeji Ohno
发明人： Kazuaki Utsumi , Tomeji Ohno
IPC分类号： C04B35/46 , C04B35/468 , H01B3/02 , H01B3/12 , H01B3/00 , B61C11/00
CPC分类号： H01B3/025 , C04B35/4682
摘要： A dielectric material is provided consisting essentially of a composition based on the general formula:(BaTiO.sub.3).sub.x.(BaZrO.sub.3).sub.y.(CaTiO.sub.3).sub.z,Wherein x=y=z = 1.0 and in which x, y and z have the following ranges: 0.4 .ltoreq. x .ltoreq. 0.89, 0.1 .ltoreq. y .ltoreq. 0.3 and 0.01 .ltoreq. z .ltoreq. 0.3, respectively, said composition also containing between 0.001 wt% and 0.5 wt% SiO.sub.2 and between 0.01 mol% and 3 mol% TiO.sub.2.
摘要翻译：提供介电材料，其基本上由基于以下通式的组合物组成：

16. 发明授权

US09653715B2 Packaged battery, stacked battery assembly, and film-covered battery 有权
公开(公告)号：US09653715B2
公开(公告)日：2017-05-16
申请号：US14221906
申请日：2014-03-21
申请人： Masatomo Mizuta , Kazuaki Utsumi , Makihiro Otohata , Hiroshi Yageta
发明人： Masatomo Mizuta , Kazuaki Utsumi , Makihiro Otohata , Hiroshi Yageta
IPC分类号： H01M2/00 , H01M2/12 , H01M2/02 , H01M2/08 , H01M2/10 , H01M2/34
CPC分类号： H01M2/1241 , H01M2/0275 , H01M2/08 , H01M2/1061 , H01M2/1229 , H01M2/345
摘要： A packaged battery, an assembled battery, and a film-covered battery, which can prevent a dangerous state involving a high-pressure gas filled in the film-covered battery while ensuring a sealing reliability, are provided. The Packaged battery includes film-covered battery 1 including a battery element and exterior films forming a sealed space housing the battery element, and holding member 10 holding film-covered battery 1. The sealed space includes a housing section housing the battery element, and a pocket communicating with the housing section to expand when the pressure in the sealed space increases. The pocket includes a safety valve which activates when the pocket expands. Holding member 10 includes an opening and a cavity fitting the housing section therein. When the housing section is fitted into the cavity, at least part of the pocket and the safety valve protrude to the outside of the holding member from the opening.

17. 发明授权

US06091310A Multi-layer printed board with an inductor providing a high impedance at high frequency 失效
标题翻译：具有电感器的多层印刷电路板在高频下提供高阻抗
公开(公告)号：US06091310A
公开(公告)日：2000-07-18
申请号：US48127
申请日：1998-03-26
申请人： Kazuaki Utsumi , Shiro Yoshida , Mitsuo Saitou
发明人： Kazuaki Utsumi , Shiro Yoshida , Mitsuo Saitou
IPC分类号： H05K3/46 , H01L23/12 , H01L23/64 , H05K1/00 , H05K1/02 , H05K1/16 , H05K1/18 , H05K3/42
CPC分类号： H05K1/0233 , H01L23/645 , H05K1/165 , H01L2224/48091 , H01L2224/48227 , H01L24/48 , H01L2924/00014 , H01L2924/01078 , H01L2924/14 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H05K1/0298 , H05K2201/09645 , H05K2201/097
摘要： A laminated multi-layer printed board having at least a power source circuit layer, at least a ground layer and at least a signal layer includes a hole which extends through the board to the power source circuit layer. An inductor is provided in the hole.
摘要翻译：具有至少一个电源电路层，至少一个接地层和至少一个信号层的层叠多层印刷电路板包括一个穿过该板延伸到电源电路层的孔。孔中设有电感器。

18. 发明授权

US5952712A Packaged semiconductor device and method of manufacturing the same 失效
公开(公告)号：US5952712A
公开(公告)日：1999-09-14
申请号：US893988
申请日：1997-07-16
申请人： Kazuhiro Ikuina , Yuzo Shimada , Kazuaki Utsumi
发明人： Kazuhiro Ikuina , Yuzo Shimada , Kazuaki Utsumi
IPC分类号： H01L23/12 , H01L21/60 , H01L21/768 , H01L23/13 , H01L23/48 , H01L23/02
CPC分类号： H01L24/80 , H01L21/76898 , H01L23/13 , H01L23/481 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15787
摘要： A packaged semiconductor device includes an LSI chip, a chip size package integrally bonded to the LSI chip to mount and hold the LSI chip thereon in order to connect an electrode of a board on which the LSI chip is to be mounted and an electrode of the LSI chip to each other, an electrode formed on a surface of the package opposite to a surface thereof which is bonded to the LSI chip, so as to be connected to the electrode of the board, at least one through hole formed to extend through the LSI chip and the package, and a connecting conductor formed to extend through the through hole in order to connect the electrode of the package and the electrode of the LSI package to each other.

19. 发明授权

US5079199A Method of manufacturing dielectric ceramic compositions of lead-based perovskite 失效
标题翻译：铅基钙钛矿介电陶瓷组合物的制造方法
公开(公告)号：US5079199A
公开(公告)日：1992-01-07
申请号：US509227
申请日：1990-04-16
申请人： Atsushi Ochi , Seiji Takahashi , Kazuaki Utsumi , Masato Shirakata
发明人： Atsushi Ochi , Seiji Takahashi , Kazuaki Utsumi , Masato Shirakata
IPC分类号： C04B35/497 , C04B35/499 , H01G4/12
CPC分类号： H01G4/1254 , C04B35/497 , C04B35/499
摘要： A manufacturing method for dielectric ceramic compositions of lead-based perovskite containing lead magnesium tungstate [Pb(Mg.sub.1/2 W.sub.1/2)O.sub.3 ] as a component which is characterized in that magnesium tungstate powder [MgWO.sub.4 ] is used as a starting material instead of MgO and WO.sub.3 powder.
摘要翻译：含铅钨酸钙[Pb（Mg1 / 2W1 / 2）O3]作为成分的铅系钙钛矿型介电陶瓷组合物的制造方法，其特征在于，使用钨酸镁粉末[MgWO 4]代替MgO 和WO3粉末。

20. 发明授权

US4791078A Ceramic composition with improved electrical and mechanical properties 失效
标题翻译：陶瓷组合物具有改善的电气和机械性能
公开(公告)号：US4791078A
公开(公告)日：1988-12-13
申请号：US89456
申请日：1987-08-26
申请人： Susumu Saito , Masatomo Yonezawa , Kazuaki Utsumi
发明人： Susumu Saito , Masatomo Yonezawa , Kazuaki Utsumi
IPC分类号： C04B35/00 , C04B35/46 , C04B35/499 , H01B3/12 , H01G4/12
CPC分类号： C04B35/499 , H01G4/1218 , H01G4/1254
摘要： A ceramic composition comprising a solid solution of the ternary system consisting essentially of lead magnesium-niobate (Pb(Mg.sub.1/3 Nb hd 2/3)O.sub.3), lead nickel-niobate (Pb(Ni.sub.1/3 Nb.sub.2/3)O.sub.3) and lead titanate (PbTiO.sub.3) as a major constituent, and an additional constituent consisting essentially of lead manganese-niobate (Pb(Mn.sub.1/3 Nb.sub.2/3)O.sub.3). The ternary system is expressed by the general formula [Pb(Mg.sub.1/3 Nb.sub.2/3)O.sub.3 ].sub.x -[Pb(Ni.sub.1/3 Nb.sub.2/3)O.sub.3 ].sub.y -[PbTiO.sub.3 ].sub.z wherein the subscripts x, y and z satisfy the equation x+y+z=1 and fall within the region defined by the line segments joining the seven points A, B, C, D, E, F and G within the triangular ternary-system diagram shown in the accompanying drawing. Preferably, the lead manganese-niobate (Pb(Mn.sub.1/3 Nb.sub.2/3)O.sub.3) is contained in a proportion of 0.01 mol % to 10 mol % to the major constituent.
摘要翻译：一种陶瓷组合物，其包含三元体系的固溶体，其基本上由铌酸镁镁（Pb（Mg1 / 3NbHd2 / 3）O3），镍铌酸铅（Pb（Ni1 / 3Nb2 / 3）O3）和钛酸铅（PbTiO3）作为主要成分，以及主要由铌酸铅（Pb（Mn1 / 3Nb2 / 3）O3）组成的附加成分。三元体系由通式[Pb（Mg1 / 3Nb2 / 3）O3] x- [Pb（Ni1 / 3Nb2 / 3）O3] y- [PbTiO3] z表示，其中下标x，y和z满足等式 x + y + z = 1，并且落入由附图所示的三角形三元系统图内的连接七个点A，B，C，D，E，F和G的线段限定的区域内。铅铌酸铅（Pb（Mn1 / 3Nb2 / 3）O3）的含量优选为主成分的0.01mol％〜10mol％。

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