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    • 14. 发明授权
    • Optoelectronic transducer formed of a semiconductor component and a lens
system
    • 由半导体元件和透镜系统形成的光电换能器
    • US5981945A
    • 1999-11-09
    • US614836
    • 1996-03-08
    • Werner SpaethWolfgang GramannGeorg BognerRalf Dietrich
    • Werner SpaethWolfgang GramannGeorg BognerRalf Dietrich
    • G02B6/42H01L31/0203H01L31/0232H01L33/58H01J5/02
    • H01L33/58G02B6/4204H01L31/0203H01L31/0232H01L2224/32225
    • An optoelectronic transducer includes a base plate, a radiation-emitting or transmitting semiconductor component disposed on the base plate, an optical lens system aimed at the semiconductor component and a spacer joined to the base plate for the lens system. The base plate, the spacer and the lens system are formed of materials with at least similar coefficients of thermal expansion. A method for producing an optoelectronic transducer includes forming indentations in a base plate for receiving semiconductor components, while leaving a land remaining on at least one side of each of the indentations. A first plate of the size of the base plate is placed on the lands and joined to the lands by material locking. The first plate is removed between the lands producing spacers joined to the base plate. A number of the semiconductor components are inserted into the indentations in accordance with a predetermined grid pattern and are joined to the base plate to form substrates. The substrates are covered with a second plate including a number of lens systems correspopnding to number of semiconductor components, while placing the lens systems of the second plate in the same grid pattern. The second plate is adjusted relative to the substrates for aiming each of the lens systems at a respective one of the semiconductor components. The second plate is secured to the substrates.
    • 光电转换器包括基板,设置在基板上的辐射发射或透射半导体部件,瞄准半导体部件的光学透镜系统和连接到透镜系统的基板的间隔件。 基板,间隔件和透镜系统由具有至少相似的热膨胀系数的材料形成。 一种光电子换能器的制造方法包括:在基板中形成用于接收半导体部件的凹陷部,同时留下残留在每个压痕的至少一侧上的焊盘。 基板的尺寸的第一板被放置在平台上,并通过材料锁定而接合到平台上。 第一板在连接到基板的间隔件之间移除。 根据预定的格栅图案将多个半导体部件插入到凹陷中,并且与基板接合以形成基板。 在将第二板的透镜系统放置在相同的格栅图案中的同时,用包括多个半导体部件的多个透镜系统的第二板覆盖基板。 相对于基板调整第二板,以将每个透镜系统瞄准相应的一个半导体部件。 第二板固定在基板上。