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11. 发明申请

US20100243716A1 Enhanced Connector Cradle Having a Cooling Shell for Preferential Cooling of Wafers 审中-公开
标题翻译：具有用于优先冷却晶片的冷却壳的增强连接器支架
公开(公告)号：US20100243716A1
公开(公告)日：2010-09-30
申请号：US12410726
申请日：2009-03-25
申请人： Joseph Kuczynski , Arvind K. Sinha , Kevin A. Splittstoesser , Timothy J. Tofil
发明人： Joseph Kuczynski , Arvind K. Sinha , Kevin A. Splittstoesser , Timothy J. Tofil
IPC分类号： B23K31/02 , B23K37/04 , H01R43/02 , H05K7/20
CPC分类号： H01R43/0256 , B23K1/0016 , B23K2101/36 , Y10T29/49213
摘要： A method, system and apparatus for preferential cooling of an electrical circuit board via a cradle having a cooling shell. An enhanced connector cradle enables the secure and precise placement of a connector on a circuit board by using a cooling component which selectively enables only the connector leads to reach reflow temperature levels. The cradle aligns and securely connects the circuit board to the connector via a comb structure of the cradle to form a single connector unit. Heat is applied to the single connector unit to initiate bond formation. The cradle selectively minimizes the heat to the circuit board and other board components by enabling the circulation of de-ionized water through the cooling component during the heating process. As a result, the cradle restricts reflow temperature levels to the connector leads. The cradle mechanism is removed from the board after the connector is securely bonded to the board.
摘要翻译：一种用于经由具有冷却壳的支架优先冷却电路板的方法，系统和装置。增强的连接器支架通过使用选择性地使得连接器引线达到回流温度水平的冷却部件能够将连接器安全且精确地放置在电路板上。支架通过支架的梳状结构将电路板对准并牢固地连接到连接器，以形成单个连接器单元。将热量施加到单个连接器单元以引发结合形成。支架通过在加热过程中通过冷却部件的循环使选择性地最小化对电路板和其它板部件的热量。因此，支架限制了连接器引线的回流温度水平。将连接器牢固地连接到电路板之后，将托架机构从电路板上取下。

12. 发明授权

US07751918B2 Methods for configuring tubing for interconnecting in-series multiple liquid-cooled cold plates 失效
标题翻译：用于配置串联多个液冷冷板的管道的方法
公开(公告)号：US07751918B2
公开(公告)日：2010-07-06
申请号：US11620088
申请日：2007-01-05
申请人： Levi A. Campbell , John L. Colbert , Michael J. Ellsworth, Jr. , Arvind K. Sinha
发明人： Levi A. Campbell , John L. Colbert , Michael J. Ellsworth, Jr. , Arvind K. Sinha
IPC分类号： G06F19/00 , F25B7/00 , H01G4/002 , H02B1/00
CPC分类号： H05K7/20809 , G06F1/20
摘要： Methods of configuring a cooling subassembly for an electronics system are provided, that is, for establishing a coolant-carrying tube layout for interconnecting multiple liquid-cooled cold plates in series-fluid communication for cooling multiple heat-generating electronic components of an electronics system. The electronic components are to be plugged in fixed relation into a preconfigured motherboard, and the tube layout includes at least one rigid coolant-carrying tube. Simplified analysis is initially performed to evaluate stress on the rigid tube(s) and determine if loss of actuation load on the electronic components exceeds an acceptable threshold, and if so, at least one tube having high stress is identified and reconfigured. Thereafter, analysis is performed to determine whether, with available actuation load on the cooling subassembly, electrical connection loading between the electronic components and the supporting motherboard is above an acceptable minimum level. If so, the coolant-carrying tube layout is chosen as a final design.
摘要翻译：提供了构造用于电子系统的冷却子组件的方法，即，用于建立冷却剂承载管布局，用于将串联流体通信中的多个液冷冷板互连，以冷却电子系统的多个发热电子部件。电子部件将以固定关系插入到预配置的主板中，并且管布置包括至少一个刚性的冷却剂输送管。最初进行简化分析以评估刚性管上的应力，并确定电子部件上的致动负载的损失是否超过可接受的阈值，如果是，则识别和重新配置至少一个具有高应力的管。此后，执行分析以确定在冷却子组件上的可用致动负载下，电子部件和支撑母板之间的电连接负载是否高于可接受的最低水平。如果是这样，选择冷却剂载体管布局作为最终设计。

13. 发明申请

US20080266799A1 Methods and Apparatuses for Cold Plate Stability 失效
标题翻译：冷板稳定性的方法与装置
公开(公告)号：US20080266799A1
公开(公告)日：2008-10-30
申请号：US11741852
申请日：2007-04-30
申请人： Levi A. Campbell , John L. Colbert , Michael J. Ellsworth , Arvind K. Sinha
发明人： Levi A. Campbell , John L. Colbert , Michael J. Ellsworth , Arvind K. Sinha
IPC分类号： H05K7/20
CPC分类号： H05K7/1053 , G06F1/20 , G06F2200/201 , H01L23/4093 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A cold plate assembly includes a cold plate with at least two plumbing ports. The cold plate assembly further includes a spring plate assembly, which applies an actuation load to the cold plate. The actuation load is configured to mechanically actuate the cold plate to a module.
摘要翻译：冷板组件包括具有至少两个管道端口的冷板。冷板组件还包括向冷板施加致动负载的弹簧板组件。致动负载被配置为将冷板机械地致动到模块。

14. 发明申请

US20080024991A1 Heatsink Apparatus for Applying a Specified Compressive Force to an Integrated Circuit Device 有权
标题翻译：用于将特定压缩力应用于集成电路装置的散热装置
公开(公告)号：US20080024991A1
公开(公告)日：2008-01-31
申请号：US11460334
申请日：2006-07-27
申请人： John L. Colbert , John S. Corbin , Jason R. Eagle , Roger Duane Hamilton , Amanda E. Mikhail , Arvind K. Sinha , Terry L. Sobotta
发明人： John L. Colbert , John S. Corbin , Jason R. Eagle , Roger Duane Hamilton , Amanda E. Mikhail , Arvind K. Sinha , Terry L. Sobotta
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A method and apparatus for applying a specified compressive force by a heat dissipation device for an integrated circuit are given, including placing the integrated circuit device onto a printed circuit board and then placing the heat dissipation device onto the integrated circuit device. The method includes tightening an actuation screw in a spring plate against a portion of the heat dissipation device. The actuation screw may be prevented from being tightened beyond a mechanical constraint corresponding to a pre-set calibration for the specific compressive force, which may be greater than or equal to a minimum compressive force corresponding to the greater of a minimum thermal interface pressure and a minimum contact interface pressure. Additionally, the specific compressive force may be less than or equal to a maximum pressure which may be exerted on the integrated circuit device.
摘要翻译：给出了一种通过用于集成电路的散热装置施加特定压缩力的方法和装置，包括将集成电路装置放置在印刷电路板上，然后将散热装置放置在集成电路装置上。该方法包括将弹簧板中的致动螺钉紧固在散热装置的一部分上。可以防止致动螺钉被紧固超过对应于对于特定压缩力的预设校准的机械约束，其可以大于或等于对应于较小的最小热界面压力的最小压缩力，并且最小接触界面压力。此外，比压缩力可以小于或等于可以施加在集成电路装置上的最大压力。

15. 发明申请

US20080024983A1 A DYNAMIC AIR MOVING SYSTEM 失效
标题翻译：动态空气移动系统
公开(公告)号：US20080024983A1
公开(公告)日：2008-01-31
申请号：US11461250
申请日：2006-07-31
申请人： William J. Anderl , Maurice F. Holahan , Arvind K. Sinha , Gregory S. Vande Corput
发明人： William J. Anderl , Maurice F. Holahan , Arvind K. Sinha , Gregory S. Vande Corput
IPC分类号： H05K7/20
CPC分类号： H05K7/20836 , H05K7/20727
摘要： Disclosed is a dynamic air moving system comprising a rail system disposed in an electronic enclosure, at least one fan housing moveably disposed on the rail system, the fan being actuatable along the rail system, a pivotable fan disposed in each of the at least one fan housings, at least one blade included with the fan, the at least one blade being rotatable about at least one blade axes, a fan controller chip controlling actuation of at least one fan housing, individual rotation of at least one blade, and rotation of the fan, a chip thermal sensor disposed on at least one chip located in the electronic enclosure, the thermal sensor being linked to the fan controller chip, and a drive thermal sensor disposed on at least one disk drive associated with the electronic enclosure, the drive thermal sensor being linked to the fan controller chip.
摘要翻译：公开了一种动态空气移动系统，其包括设置在电子外壳中的轨道系统，至少一个风扇壳体，其可移动地设置在轨道系统上，风扇可沿轨道系统致动，可枢转风扇设置在每个至少一个风扇壳体，包括在风扇中的至少一个叶片，所述至少一个叶片可围绕至少一个叶片轴线旋转;风扇控制器芯片，其控制至少一个风扇壳体的致动，至少一个叶片的单独旋转，风扇，设置在位于电子外壳中的至少一个芯片上的芯片热传感器，热传感器连接到风扇控制器芯片，以及设置在与电子外壳相关联的至少一个磁盘驱动器上的驱动热传感器，驱动热传感器连接到风扇控制器芯片。

16. 发明授权

US06634095B2 Apparatus for mounting a land grid array module 失效
标题翻译：用于安装焊盘阵列模块的装置
公开(公告)号：US06634095B2
公开(公告)日：2003-10-21
申请号：US09892967
申请日：2001-06-27
申请人： John L. Colbert , John S. Corbin, Jr. , Roger D. Hamilton , Danny E. Massey , Arvind K. Sinha , Charles C. Stratton
发明人： John L. Colbert , John S. Corbin, Jr. , Roger D. Hamilton , Danny E. Massey , Arvind K. Sinha , Charles C. Stratton
IPC分类号： B23P1900
CPC分类号： H05K7/1061 , Y10S269/903 , Y10T29/49126 , Y10T29/4913 , Y10T29/49133 , Y10T29/49137 , Y10T29/49139 , Y10T29/53174 , Y10T29/53178 , Y10T29/53239 , Y10T29/53265
摘要： An installation apparatus of installing a land grid array (LGA) multi-chip module assembly to a printed wiring board is provided. A module holding member is attached to the printed wiring board. The module assembly is inserted into the module holding member. The module assembly is retained to the module holding member, which facilitates mechanical actuation of the LGA compression hardware. The module assembly is electrically grounded to the printed wiring board while the module assembly is retained to the module holding member.
摘要翻译：提供了一种将印刷电路板安装在地面阵列（LGA）多芯片模块组件上的安装装置。模块保持构件附接到印刷线路板。模块组件插入模块保持构件。模块组件被保持在模块保持构件上，这有助于LGA压缩硬件的机械致动。模块组件在模块组件被保持到模块保持构件的同时电接地到印刷线路板。

17. 发明授权

US06475011B1 Land grid array socket actuation hardware for MCM applications 有权
标题翻译：用于MCM应用的Land Grid阵列插座致动硬件
公开(公告)号：US06475011B1
公开(公告)日：2002-11-05
申请号：US09948195
申请日：2001-09-07
申请人： Arvind K. Sinha , Roger D. Hamilton , John L. Colbert , John S. Corbin, Jr. , Danny E. Massey
发明人： Arvind K. Sinha , Roger D. Hamilton , John L. Colbert , John S. Corbin, Jr. , Danny E. Massey
IPC分类号： H01R1362
CPC分类号： H05K3/325 , H01R43/205
摘要： An apparatus for applying force to a multi-chip module, a printed wiring board and an interposer to facilitate electrical contact there-between, includes a plurality of load posts, a load transfer plate, a spring member, a backside stiffener plate and a spring actuator. The load posts are affixed to the multi-chip module and pass through the printed wiring board. The load transfer plate has a first stiffness. The spring member is disposed adjacent the load transfer plate and has a second stiffness that is less than the first stiffness. The a backside stiffener plate is disposed between the spring member and the printed wiring board and has a third stiffness that is greater than the second stiffness. The spring actuator engages the spring member to apply force to the backside stiffener plate, causing the substrate, the interposer and the printed wiring board to be held in contact.
摘要翻译：一种用于向多芯片模块施加力的装置，印刷线路板和插入件，以便于其间的电接触，包括多个负载柱，负载传递板，弹簧构件，后侧加强板和弹簧执行器。负载柱固定在多芯片模块上并通过印刷电路板。载荷传递板具有第一刚度。弹簧构件设置在负载传递板附近并且具有小于第一刚度的第二刚度。背面加强板设置在弹簧构件和印刷线路板之间，并且具有大于第二刚度的第三刚度。弹簧致动器接合弹簧构件以向后侧加强板施加力，使得基板，插入器和印刷线路板保持接触。

18. 发明授权

US09257359B2 System and method to process horizontally aligned graphite nanofibers in a thermal interface material used in 3D chip stacks 有权
标题翻译：在3D芯片堆叠中使用的热界面材料中处理水平对准的石墨纳米纤维的系统和方法
公开(公告)号：US09257359B2
公开(公告)日：2016-02-09
申请号：US13188572
申请日：2011-07-22
申请人： Joseph Kuczynski , Arvind K. Sinha , Kevin A. Splittstoesser , Timothy J. Tofil
发明人： Joseph Kuczynski , Arvind K. Sinha , Kevin A. Splittstoesser , Timothy J. Tofil
IPC分类号： H01L23/48 , H01L21/50 , H01L23/36 , H01L23/373 , H01L23/42 , H01L23/427 , H01L25/065 , H01L23/00
CPC分类号： H01L23/36 , H01L23/373 , H01L23/42 , H01L23/4275 , H01L23/481 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/81 , H01L25/0657 , H01L2224/131 , H01L2224/14131 , H01L2224/16146 , H01L2224/17181 , H01L2224/17519 , H01L2224/29099 , H01L2224/32245 , H01L2224/73203 , H01L2224/73253 , H01L2224/81815 , H01L2924/01322 , H01L2924/00014 , H01L2924/014 , H01L2924/00
摘要： The chip stack of semiconductor chips with enhanced cooling apparatus includes a first chip with circuitry on a first side and a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The apparatus further includes a thermal interface material pad placed between the first chip and the second chip, wherein the thermal interface material pad includes nanofibers aligned parallel to mating surfaces of the first chip and the second chip. The method includes creating a first chip with circuitry on a first side and creating a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The method further includes placing a thermal interface material pad between the first chip and the second chip, wherein the thermal interface material pad includes nanofibers aligned parallel to mating surfaces of the first chip and the second chip.
摘要翻译：具有增强的冷却装置的半导体芯片的芯片堆叠包括具有第一侧上的电路的第一芯片和通过连接器格栅电和机械地耦合到第一芯片的第二芯片。该装置还包括放置在第一芯片和第二芯片之间的热界面材料垫，其中热界面材料垫包括平行于第一芯片和第二芯片的配合表面排列的纳米纤维。该方法包括在第一侧上创建具有电路的第一芯片，并通过连接器网格将第二芯片电连接并机械耦合到第一芯片。该方法还包括在第一芯片和第二芯片之间放置热界面材料垫，其中热界面材料垫包括平行于第一芯片和第二芯片的配合表面排列的纳米纤维。

19. 发明授权

US08716597B2 Implementing enhanced dimensional stability with graphite nanotube hybrid socket 有权
标题翻译：用石墨纳米管混合插座实现增强的尺寸稳定性
公开(公告)号：US08716597B2
公开(公告)日：2014-05-06
申请号：US13346986
申请日：2012-01-10
申请人： Phillip V. Mann , Kevin M. O'Connell , Mark D. Plucinski , Sandra J. Shirk/Heath , Arvind K. Sinha
发明人： Phillip V. Mann , Kevin M. O'Connell , Mark D. Plucinski , Sandra J. Shirk/Heath , Arvind K. Sinha
IPC分类号： H02G3/08 , H01R13/14 , B82Y40/00
CPC分类号： H05K7/1069 , B82Y30/00
摘要： A method and structure for implementing enhanced dimensional stability with a graphite nanotube hybrid socket. A socket housing wall includes a plurality of aligned graphite nanofibers. The plurality of aligned graphite nanofibers distributing heat and providing enhanced dimensional stability. For example, the plurality of aligned graphite nanofibers more evenly distributes heat when the socket is undergoing solder reflow processes, thereby reducing strain.
摘要翻译：用石墨纳米管混合插座实现增强的尺寸稳定性的方法和结构。插座壳体壁包括多个对准的石墨纳米纤维。多个对准的石墨纳米纤维分布热量并提供增强的尺寸稳定性。例如，当插座经历焊料回流工艺时，多个对准的石墨纳米纤维更均匀地分布热量，从而减少应变。

20. 发明授权

US08558564B2 Heat spreader flatness detection 失效
标题翻译：散热器平面度检测
公开(公告)号：US08558564B2
公开(公告)日：2013-10-15
申请号：US13033637
申请日：2011-02-24
申请人： Arvind K. Sinha , Kory W. Weckman
发明人： Arvind K. Sinha , Kory W. Weckman
IPC分类号： G01R27/08 , G01R31/08
CPC分类号： G01N27/041 , H05K7/20509
摘要： A heat spreader includes a plurality of sensors that indicate that the heat spreader is flat against and in thermal contact with a plurality of chips when the heat spreader is loaded upon a chip stack. One or more nodes within the sensors are connected by electric conductors. The resistances of the conductors may be compared to determine if the nodes within the sensors are relatively flat. Sensor flatness may be indicated to a higher level electronic device such as a visual display. The display may ultimately be viewed by a user to determine whether the heat spreader is flat and in thermal contact with the plurality of chips when the heat spreader is loaded upon the chip stack.
摘要翻译：散热器包括多个传感器，这些传感器指示当散热器装载在芯片堆叠上时，散热器平坦地对抗多个芯片并与之热接触。传感器内的一个或多个节点通过电导体连接。可以比较导体的电阻，以确定传感器内的节点是否相对平坦。传感器的平坦度可以指示到较高级别的电子设备，诸如视觉显示器。用户可以最终看到显示器，以便当散热器装载在芯片堆叠上时，确定散热器是否平坦并与多个芯片热接触。

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