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1. 发明授权

US06634095B2 Apparatus for mounting a land grid array module 失效
标题翻译：用于安装焊盘阵列模块的装置
公开(公告)号：US06634095B2
公开(公告)日：2003-10-21
申请号：US09892967
申请日：2001-06-27
申请人： John L. Colbert , John S. Corbin, Jr. , Roger D. Hamilton , Danny E. Massey , Arvind K. Sinha , Charles C. Stratton
发明人： John L. Colbert , John S. Corbin, Jr. , Roger D. Hamilton , Danny E. Massey , Arvind K. Sinha , Charles C. Stratton
IPC分类号： B23P1900
CPC分类号： H05K7/1061 , Y10S269/903 , Y10T29/49126 , Y10T29/4913 , Y10T29/49133 , Y10T29/49137 , Y10T29/49139 , Y10T29/53174 , Y10T29/53178 , Y10T29/53239 , Y10T29/53265
摘要： An installation apparatus of installing a land grid array (LGA) multi-chip module assembly to a printed wiring board is provided. A module holding member is attached to the printed wiring board. The module assembly is inserted into the module holding member. The module assembly is retained to the module holding member, which facilitates mechanical actuation of the LGA compression hardware. The module assembly is electrically grounded to the printed wiring board while the module assembly is retained to the module holding member.
摘要翻译：提供了一种将印刷电路板安装在地面阵列（LGA）多芯片模块组件上的安装装置。模块保持构件附接到印刷线路板。模块组件插入模块保持构件。模块组件被保持在模块保持构件上，这有助于LGA压缩硬件的机械致动。模块组件在模块组件被保持到模块保持构件的同时电接地到印刷线路板。

2. 发明授权

US06475011B1 Land grid array socket actuation hardware for MCM applications 有权
标题翻译：用于MCM应用的Land Grid阵列插座致动硬件
公开(公告)号：US06475011B1
公开(公告)日：2002-11-05
申请号：US09948195
申请日：2001-09-07
申请人： Arvind K. Sinha , Roger D. Hamilton , John L. Colbert , John S. Corbin, Jr. , Danny E. Massey
发明人： Arvind K. Sinha , Roger D. Hamilton , John L. Colbert , John S. Corbin, Jr. , Danny E. Massey
IPC分类号： H01R1362
CPC分类号： H05K3/325 , H01R43/205
摘要： An apparatus for applying force to a multi-chip module, a printed wiring board and an interposer to facilitate electrical contact there-between, includes a plurality of load posts, a load transfer plate, a spring member, a backside stiffener plate and a spring actuator. The load posts are affixed to the multi-chip module and pass through the printed wiring board. The load transfer plate has a first stiffness. The spring member is disposed adjacent the load transfer plate and has a second stiffness that is less than the first stiffness. The a backside stiffener plate is disposed between the spring member and the printed wiring board and has a third stiffness that is greater than the second stiffness. The spring actuator engages the spring member to apply force to the backside stiffener plate, causing the substrate, the interposer and the printed wiring board to be held in contact.
摘要翻译：一种用于向多芯片模块施加力的装置，印刷线路板和插入件，以便于其间的电接触，包括多个负载柱，负载传递板，弹簧构件，后侧加强板和弹簧执行器。负载柱固定在多芯片模块上并通过印刷电路板。载荷传递板具有第一刚度。弹簧构件设置在负载传递板附近并且具有小于第一刚度的第二刚度。背面加强板设置在弹簧构件和印刷线路板之间，并且具有大于第二刚度的第三刚度。弹簧致动器接合弹簧构件以向后侧加强板施加力，使得基板，插入器和印刷线路板保持接触。

3. 发明授权

US06802733B2 Topside installation apparatus for land grid array modules 失效
标题翻译：地面栅格阵列模块的顶部安装装置
公开(公告)号：US06802733B2
公开(公告)日：2004-10-12
申请号：US09931299
申请日：2001-08-16
申请人： John L. Colbert , John S. Corbin, Jr. , Roger D. Hamilton , Danny E. Massey , Arvind K. Sinha
发明人： John L. Colbert , John S. Corbin, Jr. , Roger D. Hamilton , Danny E. Massey , Arvind K. Sinha
IPC分类号： H01R1362
CPC分类号： H05K3/325 , H05K7/1061
摘要： An installation apparatus and method for actuating the electrical connection of a land grid array module to a printed wiring board is provided. A backside stiffener with load posts is attached to a printed wiring board. A load plate, module, plurality of load columns, and springplate are operably connected to the load posts. An actuation screw operably connected to the springplate is rotated imparting an actuation force to the module. The backside stiffener includes a local stiffener, wherein the local stiffener causes a deflection in the printed wiring board complementary to the deflection of the module when the actuation force is applied.
摘要翻译：提供了一种用于致动陆地网格阵列模块到印刷线路板的电连接的安装装置和方法。具有负载柱的背面加强件连接到印刷线路板。负载板，模块，多个负载柱和弹簧板可操作地连接到负载柱。可操作地连接到弹簧板的致动螺钉被旋转，向模块施加致动力。背面加强件包括局部加强件，其中当施加致动力时，局部加强件引起印刷线路板中的挠曲与模块的偏转互补。

4. 发明授权

US06757965B2 Method of installing a land grid array multi-chip modules 失效
标题翻译：安装地面阵列多芯片模块的方法
公开(公告)号：US06757965B2
公开(公告)日：2004-07-06
申请号：US10455538
申请日：2003-06-05
申请人： John L. Colbert , John S. Corbin, Jr. , Roger D. Hamilton , Danny E. Massey , Arvind K. Sinha , Charles C. Stratton
发明人： John L. Colbert , John S. Corbin, Jr. , Roger D. Hamilton , Danny E. Massey , Arvind K. Sinha , Charles C. Stratton
IPC分类号： H05K330
CPC分类号： H05K7/1061 , Y10S269/903 , Y10T29/49126 , Y10T29/4913 , Y10T29/49133 , Y10T29/49137 , Y10T29/49139 , Y10T29/53174 , Y10T29/53178 , Y10T29/53239 , Y10T29/53265
摘要： A method of installing a land grid array (LGA) multi-chip module assembly to a printed wiring board is provided. A module holding member is attached to the printed wiring board. The module assembly is inserted into the module holding member. The module assembly is retained to the module holding member, which facilitates mechanical actuation of the LGA compression hardware. The module assembly is electrically grounded to the printed wiring board while the module assembly is retained to the module holding member.
摘要翻译：提供了一种将焊盘阵列（LGA）多芯片组件安装到印刷电路板的方法。模块保持构件附接到印刷线路板。模块组件插入模块保持构件。模块组件被保持在模块保持构件上，这有助于LGA压缩硬件的机械致动。模块组件在模块组件被保持到模块保持构件的同时电接地到印刷线路板。

5. 发明授权

US07701720B2 Electronic assembly and techniques for installing a heatsink in an electronic assembly 有权
标题翻译：用于在散热器中安装电子组件的电子装配和技术
公开(公告)号：US07701720B2
公开(公告)日：2010-04-20
申请号：US11862848
申请日：2007-09-27
申请人： John L. Colbert , John S. Corbin, Jr. , Jason R. Eagle , Arvind K. Sinha , Christopher L. Tuma
发明人： John L. Colbert , John S. Corbin, Jr. , Jason R. Eagle , Arvind K. Sinha , Christopher L. Tuma
IPC分类号： H05K7/20
CPC分类号： H01L23/4006 , H01L2924/0002 , Y10T29/53113 , H01L2924/00
摘要： A technique for installing a heatsink in an electronic assembly includes simultaneously applying force to multiple fastener assemblies that each retain a respective fastener in a body of the heatsink. The heatsink is then attached to the electronic assembly by actuating the fasteners while the force is simultaneously applied to the multiple fastener assemblies.
摘要翻译：用于在电子组件中安装散热器的技术包括同时向多个紧固件组件施加力，每个紧固件组件将相应的紧固件保持在散热器的主体中。然后通过致动紧固件将散热器附接到电子组件，同时力同时施加到多个紧固件组件。

6. 发明授权

US07777329B2 Heatsink apparatus for applying a specified compressive force to an integrated circuit device 有权
标题翻译：用于向集成电路装置施加规定的压缩力的散热装置
公开(公告)号：US07777329B2
公开(公告)日：2010-08-17
申请号：US11460334
申请日：2006-07-27
申请人： John L. Colbert , John S. Corbin, Jr. , Jason R. Eagle , Roger Duane Hamilton , Amanda E. Mikhail , Arvind K. Sinha , Terry L. Sobotta
发明人： John L. Colbert , John S. Corbin, Jr. , Jason R. Eagle , Roger Duane Hamilton , Amanda E. Mikhail , Arvind K. Sinha , Terry L. Sobotta
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： An apparatus is provided having an integrated circuit device disposed on a printed circuit board and a heat dissipation device on the integrated circuit device. An actuation screw in a spring plate is urged against a portion of the heat dissipation device by tightening the actuation screw. The actuation screw may be prevented from being tightened beyond a mechanical constraint corresponding to a pre-set calibration for the specific compressive force, which may be greater than or equal to a minimum compressive force corresponding to the greater of a minimum thermal interface pressure and a minimum contact interface pressure. Additionally, a method is provided in which the actuation screw is tightened, but prevented from being tightened beyond the mechanical constraint.
摘要翻译：提供一种装置，其具有布置在印刷电路板上的集成电路装置和集成电路装置上的散热装置。通过拧紧致动螺钉，弹簧板中的致动螺钉被推靠在散热装置的一部分上。可以防止致动螺钉被紧固超过对应于对于特定压缩力的预设校准的机械约束，其可以大于或等于对应于较小的最小热界面压力的最小压缩力，并且最小接触界面压力。此外，提供了一种方法，其中致动螺钉被紧固，但是防止超过机械约束被紧固。

7. 发明申请

US20090034198A1 APPARATUS AND METHOD FOR ATTACHING HEATSINKS 审中-公开
标题翻译：装置和连接热源的方法
公开(公告)号：US20090034198A1
公开(公告)日：2009-02-05
申请号：US11831135
申请日：2007-07-31
申请人： John L. Colbert , John S. Corbin, Jr. , Jason R. Eagle , Arvind K. Sinha , Christopher L. Tuma
发明人： John L. Colbert , John S. Corbin, Jr. , Jason R. Eagle , Arvind K. Sinha , Christopher L. Tuma
IPC分类号： H05K7/20
CPC分类号： H01L23/4006 , H01L2023/405 , H01L2023/4062 , H01L2023/4081 , H01L2023/4087 , H01L2924/0002 , H01L2924/00
摘要： An apparatus for attaching a heatsink to an electronic module mounted on a circuit card assembly includes a load frame; a load arm having a first end being pivotally coupled to one end of the load frame and a second end configured to receive at least a portion of a load screw therethrough; a spring plate disposed at an opposite end of the one end of the load frame, and configured to threadedly receive the load screw, opposite ends of the spring plate being retained while an intermediate portion threadedly receiving the at least a portion of the load screw is allowed to bow upwards toward a bottom of the opposite end of the load arm; and a heatsink disposed on the module. An intermediate portion of the load arm aligned with a center region of the module biases the heatsink toward the module when the load screw is threadedly engaged with the spring plate.
摘要翻译：一种用于将散热器附接到安装在电路卡组件上的电子模块的装置包括负载框架; 负载臂具有可枢转地联接到负载框架的一端的第一端和构造成容纳至少一部分负载螺钉的第二端; 弹簧板，设置在所述负载框架的一端的相对端，并且构造成螺纹地接收所述负载螺钉，所述弹簧板的相对端被保持，而螺纹接收所述负载螺钉的至少一部分的中间部分是允许向上朝向负载臂的相对端的底部向上弯曲; 以及设置在模块上的散热器。当负载螺钉与弹簧板螺纹接合时，与模块的中心区域对准的负载臂的中间部分将散热器朝向模块偏置。

8. 发明授权

US06511282B2 Modular and flexible service frame enclosure 失效
标题翻译：模块化灵活的服务框架
公开(公告)号：US06511282B2
公开(公告)日：2003-01-28
申请号：US09892822
申请日：2001-06-27
申请人： Budy D. Notohardjono , John S. Corbin, Jr. , Steven C. McIntosh , Howard P. Welz
发明人： Budy D. Notohardjono , John S. Corbin, Jr. , Steven C. McIntosh , Howard P. Welz
IPC分类号： B65G102
CPC分类号： H05K7/1495 , H02B1/301 , H02B1/54
摘要： An earthquake resistant frame structure which is shippable in a fully populated condition has abase member, a plurality of support members extending from the base member, a top portion disposed over the ends of the support members, a extension member disposed over the top portion, side stiffeners positioned perpendicularly between the support members, and a tie down assembly system positioned between the base member and a flooring surface. The extension member has a platform section and at least two legs depending substantially perpendicularly therefrom that slidingly engage the support members. The two legs have slots therethrough configured to receive fasteners that, when secured to support members, secure and maintain the extension member in position. First and second panels protrude laterally from the frame structure to form an extension area, from which a bracket hingedly depends. A variety of pin arrangements are used to prevent the removal of the bracket from the hinge. The tie down system includes a floor plate positionable between the frame structure and the flooring surface, a fastener extending through the frame structure, through the floor plate, and into the flooring surface, a leveling element positioned between the floor plate and the flooring surface to level the frame structure, and insulators positioned between the fastener and the leveling element to attenuate vibration.
摘要翻译：在完全填充状态下可运输的抗震框架结构具有底座构件，从基座构件延伸的多个支撑构件，设置在支撑构件的端部上方的顶部，设置在顶部的侧面上的延伸构件位于支撑构件之间的加强件垂直定位，以及定位在基部构件和地板表面之间的系固组件系统。延伸构件具有平台部分和至少两个基本垂直地延伸的腿部，其滑动地接合支撑构件。两个腿部具有穿过其中的狭缝，其中构造成具有接收固定件的紧固件，当固定到支撑构件上时，将延伸构件固定并保持在适当位置。第一和第二面板从框架结构横向突出以形成延伸区域，托架从该延伸区域铰接地依靠。使用各种针布置来防止支架从铰链上移除。捆扎系统包括可定位在框架结构和地板表面之间的地板，通过框架结构延伸穿过地板并进入地板表面的紧固件，定位在地板板和地板表面之间的调平元件，定位在框架结构之间，并且绝缘体位于紧固件和调平元件之间以衰减振动。

9. 发明授权

US06425648B1 Modular and flexible server frame enclosure 失效
标题翻译：模块化灵活的服务器框架
公开(公告)号：US06425648B1
公开(公告)日：2002-07-30
申请号：US09547775
申请日：2000-04-12
申请人： Budy D. Notohardjono , John S. Corbin, Jr. , Steven C. McIntosh , Howard P. Welz
发明人： Budy D. Notohardjono , John S. Corbin, Jr. , Steven C. McIntosh , Howard P. Welz
IPC分类号： A47B4700
CPC分类号： H05K7/1495 , H02B1/301 , H02B1/54
摘要： An earthquake resistant frame structure which is shippable in a fully populated condition has a base member, a plurality of support members extending from the base member, a top portion disposed over the ends of the support members, a extension member disposed over the top portion, side stiffeners positioned perpendicularly between the support members, and a tie down assembly system positioned between the base member and a flooring surface. The extension member has a platform section and at least two legs depending substantially perpendicularly therefrom that slidingly engage the support members. The two legs have slots therethrough configured to receive fasteners that, when secured to support members, secure and maintain the extension member in position. First and second panels protrude laterally from the frame structure to form an extension area, from which a bracket hingedly depends. A variety of pin arrangements are used to prevent the removal of the bracket from the hinge. The tie down system includes a floor plate positionable between the frame structure and the flooring surface, a fastener extending through the frame structure, through the floor plate, and into the flooring surface, a leveling element positioned between the floor plate and the flooring surface to level the frame structure, and insulators positioned between the fastener and the leveling element to attenuate vibration.
摘要翻译：在完全填充状态下可运输的抗震框架结构具有基部构件，从基座构件延伸的多个支撑构件，设置在支撑构件的端部上方的顶部，设置在顶部上的延伸构件，位于支撑构件之间的侧向加强件，以及定位在基部构件和地板表面之间的系固组件系统。延伸构件具有平台部分和至少两个基本垂直地延伸的腿部，其滑动地接合支撑构件。两个腿部具有穿过其中的狭缝，其中构造成具有接收固定件的紧固件，当固定到支撑构件上时，将延伸构件固定并保持在适当位置。第一和第二面板从框架结构横向突出以形成延伸区域，托架从该延伸区域铰接地依靠。使用各种针布置来防止支架从铰链上移除。捆扎系统包括可定位在框架结构和地板表面之间的地板，通过框架结构延伸穿过地板并进入地板表面的紧固件，定位在地板板和地板表面之间的调平元件，定位在框架结构之间，并且绝缘体位于紧固件和调平元件之间以衰减振动。

10. 发明授权

US06921272B2 Method and apparatus for providing positive contact force in an electrical assembly 失效
标题翻译：在电气组件中提供正接触力的方法和装置
公开(公告)号：US06921272B2
公开(公告)日：2005-07-26
申请号：US10435917
申请日：2003-05-12
申请人： John S. Corbin, Jr. , William P. Kostenko , John J. Loparco , Budy D. Notohardjono , John G. Torok
发明人： John S. Corbin, Jr. , William P. Kostenko , John J. Loparco , Budy D. Notohardjono , John G. Torok
IPC分类号： H01R12/16 , H01R13/24 , H01R12/00
CPC分类号： H01R12/7076 , H01L2224/16 , H01L2224/45144 , H01L2224/73253 , H01L2924/01079 , H01L2924/16152 , H01R13/24 , H01L2924/00
摘要： An electrical contact assembly includes a first module having a first set of electrical contacts, a second module having a second set of electrical contacts, a shape-generating module, and a clamping arrangement. The second set of electrical contacts is aligned with the first set of electrical contacts and the shape-generating module is arranged to impart a shape to the second module such that the second set of electrical contacts is driven toward the first set of electrical contacts. The clamping arrangement is arranged to clamp the first, the second, and the shape-generating modules together, thereby resulting in a positive contact force between the first and second sets of electrical contacts. The positive contact force is equal to or greater than a predefined value.
摘要翻译：电触头组件包括具有第一组电触点的第一模块，具有第二组电触点的第二模块，形状产生模块和夹紧装置。第二组电触头与第一组电触头对准，并且形状产生模块被布置成赋予第二模块形状，使得第二组电触点朝向第一组电触点驱动。夹持装置被布置成将第一，第二和形状发生模块夹在一起，从而导致第一和第二组电触点之间的正接触力。正接触力等于或大于预定值。

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