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    • 17. 发明授权
    • Plasma processing apparatus and method
    • 等离子体处理装置及方法
    • US08231800B2
    • 2012-07-31
    • US12359691
    • 2009-01-26
    • Tsuyoshi MoriyaHiroyuki Nakayama
    • Tsuyoshi MoriyaHiroyuki Nakayama
    • B44C1/22
    • H01J37/32431H01J2237/022
    • There is provided a plasma processing apparatus including a plasma generating unit for generating a plasma in a processing chamber in which a set processing is performed on a substrate serving as an object to be processed. The plasma processing apparatus further includes a particle moving unit for electrostatically driving particles in a region above the substrate to be removed out of the region above the substrate in the processing chamber while the processing on the substrate is performed by using the plasma. In addition, there is provided a plasma processing method of a plasma processing apparatus including the steps of generating plasma in a processing chamber in which a set processing is performed on a substrate serving as an object to be processed; and performing the processing on the substrate by the plasma.
    • 提供了一种等离子体处理装置,其包括等离子体产生单元,用于在处理室中产生等离子体,其中对作为待处理对象的基板进行设定处理。 等离子体处理装置还包括一个粒子移动单元,用于在通过使用等离子体进行基板上的处理的同时,在处理室中的基板上方的区域中,将基板上方的区域中的颗粒静电驱动。 此外,提供了一种等离子体处理装置的等离子体处理方法,其包括以下步骤:在对作为被处理对象的基板进行设定处理的处理室中产生等离子体; 并通过等离子体对衬底进行处理。
    • 19. 发明授权
    • Method for cleaning elements in vacuum chamber and apparatus for processing substrates
    • 用于清洁真空室中的元件的方法和用于处理衬底的装置
    • US08137473B2
    • 2012-03-20
    • US10921947
    • 2004-08-20
    • Tsuyoshi MoriyaHiroshi NagaikeHiroyuki Nakayama
    • Tsuyoshi MoriyaHiroshi NagaikeHiroyuki Nakayama
    • B08B5/00B08B7/00
    • H01L21/67028B08B3/12H01J37/32862H01L21/6831
    • To clean an element in a vacuum chamber by causing particles sticking to the element to scatter, the present invention uses a means for applying a voltage to the element and causing the particles to scatter by utilizing Maxwell's stress, a means for electrically charging the particles and causing the particles to scatter by utilizing the Coulomb force, a means for introducing a gas into the vacuum chamber and causing the particles sticking to the element to scatter by causing a gas shock wave to hit the element, a means for heating the element and causing the particles to scatter by utilizing the thermal stress and thermophoretic force, or a means for causing the particles to scatter by applying mechanical vibrations to the element. The thus scattered particles are removed by carrying them in a gas flow in a relatively high pressure atmosphere.
    • 为了通过使颗粒粘附到元件上来清洁真空室中的元件散射,本发明使用了一种用于向元件施加电压并且通过利用麦克斯韦应力使颗粒散射的装置,用于对颗粒进行充电的装置和 通过利用库仑力使颗粒散射,用于将气体引入真空室中并通过使气体冲击波撞击元件而使颗粒粘附到元件上的装置,用于加热元件并引起 通过利用热应力和热压力来散射的颗粒,或通过对元件施加机械振动来使颗粒散射的装置。 通过在相对高压气氛中的气流中携带它们来除去如此散落的颗粒。
    • 20. 发明申请
    • PLASMA PROCESSING APPARATUS AND METHOD
    • 等离子体加工设备和方法
    • US20090134121A1
    • 2009-05-28
    • US12359691
    • 2009-01-26
    • Tsuyoshi MORIYAHiroyuki Nakayama
    • Tsuyoshi MORIYAHiroyuki Nakayama
    • H05H1/24C23C14/34B44C1/22C23C16/44
    • H01J37/32431H01J2237/022
    • There is provided a plasma processing apparatus including a plasma generating unit for generating a plasma in a processing chamber in which a set processing is performed on a substrate serving as an object to be processed. The plasma processing apparatus further includes a particle moving unit for electrostatically driving particles in a region above the substrate to be removed out of the region above the substrate in the processing chamber while the processing on the substrate is performed by using the plasma. In addition, there is provided a plasma processing method of a plasma processing apparatus including the steps of generating plasma in a processing chamber in which a set processing is performed on a substrate serving as an object to be processed; and performing the processing on the substrate by the plasma.
    • 提供了一种等离子体处理装置,其包括等离子体产生单元,用于在处理室中产生等离子体,其中对作为待处理对象的基板进行设定处理。 等离子体处理装置还包括一个粒子移动单元,用于在通过使用等离子体进行基板上的处理的同时,在处理室中的基板上方的区域中,将基板上方的区域中的颗粒静电驱动。 此外,提供了一种等离子体处理装置的等离子体处理方法,其包括以下步骤:在对作为被处理对象的基板进行设定处理的处理室中产生等离子体; 并通过等离子体对衬底进行处理。