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    • 14. 发明专利
    • Method for manufacturing power module
    • 制造电源模块的方法
    • JP2013019020A
    • 2013-01-31
    • JP2011152954
    • 2011-07-11
    • Toyota Motor Corpトヨタ自動車株式会社
    • HIRANO MASATERUOZAKI TOMOKOTAKATANI TOMOKIIKEJIRI TAKASHITAKANO HIROYUKIMIYAZAKI TOMOHIRO
    • C23C24/04H01L21/52H01L23/373H01L25/07H01L25/18
    • H01L24/83H01L2224/83191H01L2924/1305H01L2924/13055H01L2924/00
    • PROBLEM TO BE SOLVED: To provide a method for manufacturing a power module, in which the generation of a void is suppressed in a solder, and the adhesion between a power element and a base material can be improved.SOLUTION: A film formation step is for blowing metal powder in a solid phase together with a compressed carrier gas to form a metal film, on a surface of the base material 11, for soldering the power element 15. The film formation method includes: a first film formation step of blowing the metal powder against the surface of the base material 11 at a blowing pressure such that the carrier gas is contained to form a first metal film 12 made of the metal powder, on the surface of the base material 11; and a second film formation step of blowing the metal powder against a surface of the first metal film 12 at a blowing pressure lower than the blowing pressure of the metal powder in the first film formation step to form a second metal film 13 made of the metal powder, on the surface of the first metal film.
    • 要解决的问题:提供一种制造功率模块的方法,其中在焊料中抑制空穴的产生,并且可以提高功率元件和基材之间的粘合性。 解决方案:成膜步骤用于在基材11的表面上与压缩的载气一起吹入固相中的金属粉末以形成金属膜,用于焊接功率元件15.成膜方法 包括:第一成膜步骤,以使得载体载体形成由金属粉末制成的第一金属膜12的吹塑压力将金属粉末吹在基材11的表面上,在基材的表面上 材料11; 以及第二成膜步骤,在第一成膜步骤中以比金属粉末的吹送压力低的吹塑压力将金属粉末吹向第一金属膜12的表面,以形成由金属制成的第二金属膜13 粉末,在第一金属膜的表面上。 版权所有(C)2013,JPO&INPIT
    • 16. 发明专利
    • Power module
    • 电源模块
    • JP2009231381A
    • 2009-10-08
    • JP2008072228
    • 2008-03-19
    • Toyota Motor Corpトヨタ自動車株式会社
    • HIRANO MASATERU
    • H01L23/36H01L23/473
    • H01L23/3735H01L2924/0002H05K1/0203H01L2924/00
    • PROBLEM TO BE SOLVED: To provide a power module which is superior in radiation performance when a semiconductor element generates heat, effectively relieves stress due to deformation of a cooler forming the power module and suppresses stress occurring in an insulating substrate and the semiconductor element to the minimum.
      SOLUTION: In the power module 10, the semiconductor element 5 is loaded on one side of the insulating substrate 4 (DBA), and the cooler 6 is installed on the other side of the insulating substrate 4. A green compact 7 is inserted between the other side of the insulating substrate 4 and the cooler 6.
      COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:为了提供一种在半导体元件产生热量时辐射性能优异的功率模块,有效地减轻了由形成功率模块的冷却器的变形引起的应力,并抑制了在绝缘基板和半导体中产生的应力 元素到最小。 解决方案:在功率模块10中,将半导体元件5装载在绝缘基板4(DBA)的一侧,并且将冷却器6安装在绝缘基板4的另一侧。生坯7是 插入在绝缘基板4的另一侧和冷却器6之间。(C)2010年,JPO和INPIT
    • 17. 发明专利
    • Reactor and its manufacturing method
    • 反应器及其制造方法
    • JP2008305854A
    • 2008-12-18
    • JP2007149520
    • 2007-06-05
    • Toyota Motor Corpトヨタ自動車株式会社
    • ONO MARIHIRANO MASATERUSATO TOYOYUKI
    • H01F37/00H01F41/12
    • PROBLEM TO BE SOLVED: To provide a reactor with a resin mold object excellent in both crack resistance and heat dissipation nature, in which the resin mold object is formed around a reactor core housed in a case, and a manufacturing method thereof.
      SOLUTION: A reactor 10 comprises a case 3, a heat dissipation board 2 provided on the lower surface of the case 3, and a reactor core 4 equipped with a coil 5 and placed on the heat dissipation board 2 in the case 3. The upper surface of the coil 5 is positioned lower than the upper end of the sidewall of the case 3. In the case 3, a first resin mold object 61 having relatively high hardness and high heat dissipation nature is formed from the heat dissipation board 2 to a portion of the coil 5 at least and a second resin mold object 62 having relatively low hardness is formed from a portion of the coil 5 to the upper end of the sidewall of the case 3 or the vicinity thereof.
      COPYRIGHT: (C)2009,JPO&INPIT
    • 解决的问题:为了提供一种反应器,其具有在容纳在壳体中的反应堆芯周围形成树脂模制对象的抗裂性和散热性两者都优异的树脂模制物体及其制造方法。 解决方案:反应器10包括壳体3,设置在壳体3的下表面上的散热板2和装备有线圈5的反应堆堆芯4并放置在壳体3中的散热板2上 线圈5的上表面位于比壳体3的侧壁的上端低的位置。在这种情况3中,由散热板形成具有较高硬度和高散热特性的第一树脂成型体61 2到线圈5的至少一部分,并且具有相对低硬度的第二树脂模制对象62由线圈5的一部分形成到壳体3的侧壁的上端或其附近。 版权所有(C)2009,JPO&INPIT
    • 18. 发明专利
    • Piston and method for manufacturing same
    • 活塞及其制造方法
    • JP2007132275A
    • 2007-05-31
    • JP2005326378
    • 2005-11-10
    • Toyota Motor Corpトヨタ自動車株式会社
    • HIRANO MASATERUKAJIKAWA YOSHIAKI
    • F02F3/10F02F3/00F16J1/01
    • PROBLEM TO BE SOLVED: To provide a piston excellent in thermal conductivity and capable of inhibiting generation of a heat spot.
      SOLUTION: High thermal conductivity layer composed of material having higher thermal conductivity than material forming a piston body part is coated on a top surface part of the piston body part. The high thermal conductivity layer is joined without melting the top surface part of the piston. Since the high thermal conductivity layer is coated without melting the piston body part, formation of a layer causing drop of thermal resistance and strength due to oxide film, gap, alloy or the like between the top surface part of the piston and the high thermal conductivity layer can be reduced and the piton exhibiting high performance and the method for manufacturing the same can be provided. Especially, overheat of the piston body can be reduced, formation of oxide film and alloy can be reduced, and formation of the large gap can be inhibited in principal by adopting spraying, cold spraying an/or plating as a method for forming the high thermal conductivity layer. Even if a gap is generated in the worst case, the gap can be made small by plating or rolling.
      COPYRIGHT: (C)2007,JPO&INPIT
    • 要解决的问题:提供导热性优异且能够抑制发热点的活塞。 解决方案:由具有比形成活塞体部分的材料更高的导热性的材料构成的高导热层被涂覆在活塞体部分的顶表面部分上。 高导热层被连接而不熔化活塞的顶表面部分。 由于在不熔化活塞主体部分的情况下涂覆高导热层,所以形成由活塞的上表面部分之间的氧化膜,间隙,合金等引起的热阻和强度的降低以及高导热性 可以减少层,并且可以提供表现出高性能的皮托及其制造方法。 特别是,可以减少活塞体的过热,可以减少氧化膜和合金的形成,通过采用喷涂,冷喷涂或电镀作为形成高热的方法,可以主要抑制大间隙的形成 导电层。 即使在最坏的情况下产生间隙,也可以通过电镀或轧制使间隙变小。 版权所有(C)2007,JPO&INPIT