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    • 14. 发明申请
    • DISPLAY DEVICE
    • 显示设备
    • US20140043574A1
    • 2014-02-13
    • US14112877
    • 2012-04-16
    • Teruhiko IchimuraHideaki SakaiShigeki KitamuraHiroaki Ito
    • Teruhiko IchimuraHideaki SakaiShigeki KitamuraHiroaki Ito
    • G02F1/1333
    • G02F1/133345G02F1/1339G02F2001/134372G02F2201/503G02F2202/28
    • A display device includes: a first substrate and a second substrate which are located so that inner main surfaces thereof face each other; a liquid crystal layer located between the first substrate and the second substrate; a seal material located between the first substrate and the second substrate so as to surround the liquid crystal layer, the seal material bonding the first substrate and the second substrate to each other; an organic insulation film located in a seal formation area on the inner main surface of the second substrate, the organic insulation film having an opening section in the seal formation area; and an inorganic insulation film located to continue from an inside of the opening section to a surface of the organic insulation film through an inner wall surface of the opening section, the inorganic insulation film being directly covered with the seal material.
    • 显示装置包括:第一基板和第二基板,其内表面彼此面对; 位于第一基板和第二基板之间的液晶层; 位于所述第一基板和所述第二基板之间以围绕所述液晶层的密封材料,所述密封材料将所述第一基板和所述第二基板彼此接合; 有机绝缘膜,位于所述第二基板的内主表面上的密封形成区域中,所述有机绝缘膜在所述密封形成区域中具有开口部; 以及无机绝缘膜,其通过所述开口部的内壁面从所述开口部的内部延伸到所述有机绝缘膜的表面,所述无机绝缘膜直接被所述密封材料覆盖。
    • 15. 发明授权
    • Polishing apparatus
    • 抛光设备
    • US06425809B1
    • 2002-07-30
    • US09504619
    • 2000-02-15
    • Teruhiko Ichimura
    • Teruhiko Ichimura
    • B24B500
    • B24B37/30B24B37/26B24B49/16
    • A polishing apparatus for polishing a plate-like member such as semiconductor wafer with a high degree of polished surface flatness is provided. The apparatus comprises a turntable having a surface provided on its upper surface with a polishing pad having an upper or polishing surface, and a carrier having an article holding surface for holding thereon a plate-like article. The carrier is adapted to press a surface of the plate-like article against the polishing surface of the polishing pad to polish and flatten the surface of the plate-like article by relative movement between the article and the polishing surface. An annular member is provided along the peripheral edge of the plate-like article between the article holding surface and the plate-like article to form a chamber therebetween, and a pressurized fluid source is fluidly connected to the chamber for supplying a pressurized fluid into the chamber. The polishing surface of the polishing pad is provided with grooves to divide the polishing surface into a number of sections. The chamber may be divided into outer and inner chamber sections so that the pressures in those chamber sections can be controlled, respectively.
    • 提供了用于抛光具有高抛光表面平坦度的诸如半导体晶片的板状构件的抛光装置。 该设备包括一转台,该转盘具有在其上表面上设有抛光垫的表面,该抛光垫具有上表面或抛光表面,以及具有用于保持板状物品的物品保持表面的托架。 载体适于将板状制品的表面压靠在抛光垫的抛光表面上,以通过制品和抛光表面之间的相对运动来抛光和平坦化板状制品的表面。 沿着板状物品的周缘在物品保持表面和板状物品之间设置环形构件,以在它们之间形成腔室,加压流体源流体地连接到腔室,用于将加压流体供应到 房间。 抛光垫的抛光表面设置有将抛光表面分成多个部分的凹槽。 腔室可分为外腔室和内腔室,从而可分别控制腔室部分中的压力。
    • 17. 发明授权
    • Wafer holder and polishing device
    • 基板保持装置和抛光装置
    • US06435956B1
    • 2002-08-20
    • US09647560
    • 2000-10-02
    • Shin OhwadaTeruhiko Ichimura
    • Shin OhwadaTeruhiko Ichimura
    • B24B2900
    • B24B37/30B24B49/10B24B49/14B24B49/16H01L21/30625H01L21/6838
    • The present invention provides a substrate holding apparatus which can adjust a holding state of a substrate in accordance with a polishing state, and maintain uniformity of a polishing amount over an entire surface of the substrate, or control the polishing amount intentionally. The substrate holding apparatus comprises a holding plate having a holding surface for a substrate, a cover element for covering a backside surface of the holding plate to form a sealed back pressure space at the backside surface side, a plurality of through-holes distributed over the substantially entire holding surface for allowing the holding surface to communicate with the back pressure space, a division element removably provided for dividing the back pressure space between the holding plate and the cover element into a plurality of predetermined sealed divisional spaces in a plane, and a back pressure controller for individually controlling back pressures in the divisional spaces.
    • 本发明提供一种能够根据研磨状态调整基板的保持状态,并且保持基板的整个表面的研磨量的均匀性,或有意地控制研磨量的基板保持装置。 基板保持装置包括:具有用于基板的保持面的保持板,覆盖保持板的背面的盖元件,在背面侧形成密封的背压空间;多个贯通孔, 用于允许保持表面与背压空间连通的基本上整体的保持表面,可移除地设置用于将保持板和盖元件之间的背压空间分成多个预定的平面中的密封分割空间的分隔元件, 用于单独控制分区中的背压的背压控制器。