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11. 发明授权

US06627263B2 Film forming apparatus and film forming method 失效
公开(公告)号：US06627263B2
公开(公告)日：2003-09-30
申请号：US10154111
申请日：2002-05-21
申请人： Takahiro Kitano , Masateru Morikawa , Masami Akimoto , Kazuhiro Takeshita
发明人： Takahiro Kitano , Masateru Morikawa , Masami Akimoto , Kazuhiro Takeshita
IPC分类号： B05D312
CPC分类号： H01L21/6715 , B05C5/0216 , B05C11/08 , G03F7/162
摘要： A film forming apparatus comprising a substrate holding section for holding a substrate to be processed, a nozzle unit arranged and opposing the substrate holding section, having a discharge hole for continuously applying film-forming solution, in the form of a slender stream, to a surface of a substrate held by the substrate holding section, and a drive mechanism for driving the substrate and the nozzle unit relative to each other, thereby to coat the surface of the substrate with the solution, while the nozzle unit is applying the solution, in the form of a slender stream, to the surface of the substrate.

12. 发明授权

US06416583B1 Film forming apparatus and film forming method 失效
公开(公告)号：US06416583B1
公开(公告)日：2002-07-09
申请号：US09328771
申请日：1999-06-09
申请人： Takahiro Kitano , Masateru Morikawa , Masami Akimoto , Kazuhiro Takeshita
发明人： Takahiro Kitano , Masateru Morikawa , Masami Akimoto , Kazuhiro Takeshita
IPC分类号： B05C1100
CPC分类号： H01L21/6715 , B05C5/0216 , B05C11/08 , G03F7/162
摘要： A film forming apparatus comprising a substrate holding section for holding a substrate to be processed, a nozzle unit arranged and opposing the substrate holding section, having a discharge hole for continuously applying film-forming solution, in the form of a slender stream, to a surface of a substrate held by the substrate holding section, and a drive mechanism for driving the substrate and the nozzle unit relative to each other, thereby to coat the surface of the substrate with the solution, while the nozzle unit is applying the solution, in the form of a slender stream, to the surface of the substrate.

13. 发明申请

US20050100681A1 Substrate coating unit and substrate coating method 审中-公开
标题翻译：基材涂布单元和基材涂布方法
公开(公告)号：US20050100681A1
公开(公告)日：2005-05-12
申请号：US11013515
申请日：2004-12-17
申请人： Shinji Kobayashi , Takahiro Kitano , Masateru Morikawa , Kazuhiro Takeshita , Yoshiyuki Kawafuchi
发明人： Shinji Kobayashi , Takahiro Kitano , Masateru Morikawa , Kazuhiro Takeshita , Yoshiyuki Kawafuchi
IPC分类号： H01L21/027 , H01L21/00 , C23C28/00 , B05C5/00
CPC分类号： H01L21/6715
摘要： The present invention is a coating unit for applying a coating solution to a substrate which includes: a discharge nozzle for reciprocating in a predetermined direction above the substrate and discharging the coating solution to the substrate; a holder for holding the substrate and horizontally movable in one direction perpendicular to the predetermined direction; and a cover for covering an upper face of the substrate when the substrate is moved in the one direction to be more forward than the discharge nozzle as viewed from a plane, wherein a lower face of the cover is inclined such as to be higher on the discharge nozzle side. According to the present invention, the cover covering the upper face of the substrate restrains a solvent from evaporating from the coating solution applied on the substrate to secure flatness of a coating film.
摘要翻译：本发明是一种涂布单元，用于将涂布溶液涂布在基材上，该涂布单元包括：排出喷嘴，用于在基板上方沿预定方向往复运动并将涂布溶液排放到基板上; 用于保持基板并在垂直于预定方向的一个方向上可水平移动的保持器; 以及当从平面观察时，当基板沿着一个方向移动到比排出喷嘴更向前时，覆盖基板的上表面的盖，其中盖的下表面倾斜以在排出口侧。根据本发明，覆盖基板的上表面的盖子阻止溶剂从施加在基板上的涂布溶液蒸发，以确保涂膜的平坦度。

14. 发明授权

US06860945B2 Substrate coating unit and substrate coating method 失效
公开(公告)号：US06860945B2
公开(公告)日：2005-03-01
申请号：US10101707
申请日：2002-03-21
申请人： Shinji Kobayashi , Takahiro Kitano , Masateru Morikawa , Kazuhiro Takeshita , Yoshiyuki Kawafuchi
发明人： Shinji Kobayashi , Takahiro Kitano , Masateru Morikawa , Kazuhiro Takeshita , Yoshiyuki Kawafuchi
IPC分类号： H01L21/027 , H01L21/00 , B05B15/04 , B05B3/00 , B05C5/00
CPC分类号： H01L21/6715
摘要： The present invention is a coating unit for applying a coating solution to a substrate which includes: a discharge nozzle for reciprocating in a predetermined direction above the substrate and discharging the coating solution to the substrate; a holder for holding the substrate and horizontally movable in one direction perpendicular to the predetermined direction; and a cover for covering an upper face of the substrate when the substrate is moved in the one direction to be more forward than the discharge nozzle as viewed from a plane, wherein a lower face of the cover is inclined such as to be higher on the discharge nozzle side. According to the present invention, the cover covering the upper face of the substrate restrains a solvent from evaporating from the coating solution applied on the substrate to secure flatness of a coating film.

15. 发明授权

US07998306B2 Substrate processing apparatus 失效
标题翻译：基板加工装置
公开(公告)号：US07998306B2
公开(公告)日：2011-08-16
申请号：US12292947
申请日：2008-12-01
申请人： Koukichi Hiroshiro , Hideyuki Yamamoto , Kazuhiro Takeshita , Takayuki Toshima
发明人： Koukichi Hiroshiro , Hideyuki Yamamoto , Kazuhiro Takeshita , Takayuki Toshima
IPC分类号： H01L21/304
CPC分类号： H01L21/67057
摘要： The present invention provides a substrate processing apparatus for processing substrates by immersing the substrates in a processing liquid. This substrate processing apparatus includes a processing tank having a pair of side walls arranged to be opposed to each other; and a pair of processing-liquid supply mechanisms provided respectively corresponding to the pair of side walls. The pair of processing-liquid supply mechanisms are respectively configured for supplying the processing liquid toward a central portion of the processing tank in the width direction connecting the pair of side walls, thereby to create a rising flow of the processing liquid in a central area in the width direction of the processing tank. Each inner wall face of the pair of side walls includes a main body, a projecting portion located above the main body, and a discharge guide portion located uppermost and providing a discharge port configured for allowing the processing liquid to overflow. The discharge guide portion is inclined upward, opposite to the central portion in the width direction. The projecting portion includes an inner end portion located nearer to the central portion in the width direction, as compared with the main body and discharge guide portion.
摘要翻译：本发明提供一种基板处理装置，用于通过将基板浸入处理液中来处理基板。该基板处理装置具备：处理槽，具有配置成彼此相对的一对侧壁; 以及分别对应于一对侧壁设置的一对处理液供给机构。一对处理液供给机构分别构成为将处理液朝向连接该一对侧壁的宽度方向的处理槽的中央部供给，从而在处理液的中央区域产生上升的流动处理槽的宽度方向。一对侧壁的每个内壁面包括主体，位于主体上方的突出部分和位于最上方的排出引导部分，并且设置用于允许处理液体溢出的排出口。排出引导部分在宽度方向上与中心部分相反地向上倾斜。与主体和排出引导部相比，突出部包括位于宽度方向上更接近中央部的内端部。

16. 发明授权

US06726775B2 Method of coating film, coating unit, aging unit, solvent replacement unit, and apparatus for coating film 失效
标题翻译：涂膜方法，涂布单元，老化单元，溶剂置换单元和涂膜装置
公开(公告)号：US06726775B2
公开(公告)日：2004-04-27
申请号：US10421839
申请日：2003-04-24
申请人： Kazuhiro Takeshita , Shinji Nagashima , Makoto Muramatsu , Yoji Mizutani , Kazutoshi Yano , Kyoshige Katayama
发明人： Kazuhiro Takeshita , Shinji Nagashima , Makoto Muramatsu , Yoji Mizutani , Kazutoshi Yano , Kyoshige Katayama
IPC分类号： C23C806
CPC分类号： H01L21/6708 , B05D1/005 , B05D3/0486 , B05D3/107 , H01L21/6715 , Y10S134/902
摘要： Prior to transfer of an wafer W, a mixed gas is being generated and exhausted, thereby fluctuation of concentration and temperature of a solvent component at the beginning of gas introduction into a chamber 3 is suppressed. A step of gelling after the wafer W is carried into an aging unit is divided into several steps. Until a temperature of the wafer W reaches a predetermined treatment temperature, an average concentration of the solvent component in a mixed gas is gradually raised relative to the temperature of the wafer W. Thereby, immediately after the wafer W is transferred into a sealed chamber, the gas of the solvent component is prevented from condensing.
摘要翻译：在转移晶片W之前，产生并排出混合气体，从而抑制了在气体引入室3开始时的溶剂成分的浓度和温度的波动。将晶片W携带到老化单元中之后的胶凝步骤分为几个步骤。直到晶片W的温度达到预定的处理温度，混合气体中的溶剂组分的平均浓度相对于晶片W的温度逐渐升高。由此，在将晶片W转移到密封室之后，可以防止溶剂成分的气体冷凝。

17. 发明授权

US06660096B2 Gas treatment apparatus 失效
标题翻译：气体处理装置
公开(公告)号：US06660096B2
公开(公告)日：2003-12-09
申请号：US09735627
申请日：2000-12-14
申请人： Kazuhiro Takeshita , Shinji Nagashima , Yoji Mizutani , Kyoshige Katayama
发明人： Kazuhiro Takeshita , Shinji Nagashima , Yoji Mizutani , Kyoshige Katayama
IPC分类号： C23C1600
CPC分类号： H01L21/67017 , B05D1/005 , B05D3/0453
摘要： A gas flow regulating surface portion 37a is the farthest from the front surface of a wafer W in the middle between a peripheral portion of the wafer W and a center portion of a sealing vessel. The gas flow regulating portion 37a protrudes to the front surface of the wafer W in the vicinity of a center portion that surrounds an exhausting opening 35a. In other words, a convex portion 37c is formed in a peripheral area of the gas flow regulating surface portion 37a that surrounds the exhausting opening 35a. Since treatment gas flows along the front surface of the gas flow regulating portion 37a, treatment gas equally contacts the wafer W in the radius direction of the wafer W. Thus, a film with equal thickness is formed.
摘要翻译：气体流量调节表面部分37a在晶片W的周边部分和密封容器的中心部分之间的中间距离晶片W的前表面最远。气体流量调节部分37a在围绕排气口35a的中心部分附近向晶片W的前表面突出。换句话说，在围绕排气口35a的气体流量调节表面部分37a的周边区域中形成有凸部37c。由于处理气体沿着气体流量调节部分37a的前表面流动，所以处理气体在晶片W的半径方向上均匀地接触晶片W.因此，形成了具有相同厚度的膜。

18. 发明授权

US06197385B1 Film forming apparatus, substrate conveying apparatus, film forming method, and substrate conveying method 失效
标题翻译：成膜装置，基板输送装置，成膜方法和基板输送方法
公开(公告)号：US06197385B1
公开(公告)日：2001-03-06
申请号：US09243120
申请日：1999-02-03
申请人： Kazuhiro Takeshita , Shinji Nagashima , Yoji Mizutani
发明人： Kazuhiro Takeshita , Shinji Nagashima , Yoji Mizutani
IPC分类号： B05D312
CPC分类号： B05C11/08
摘要： A coating unit, an aging unit, and a solvent substituting unit are adjacently disposed. The waiting time period after a wafer is loaded to the coating unit until the coating process of the coating process is started, is adjusted so that the staying time period of the wafer in the coating unit becomes longer than the staying time period of the wafer in the aging unit and the staying time period of the wafer in the solvent substituting unit (whichever longer). The staying time period of the wafer in the coating unit is designated as a rate determiner. Thus, after the coating solution is coated to the wafer, the wafer is quickly conveyed to the next process. Consequently, since the solvent can be suppressed from evaporating, an excellent thin film can be obtained.
摘要翻译：涂布单元，老化单元和溶剂置换单元相邻布置。将晶片装载到涂布单元直到涂布处理的涂布处理开始之后的等待时间被调节，使得涂布单元中的晶片的停留时间长于晶片的停留时间晶片在溶剂置换单元中的老化单元和停留时间（以较长者为准）。将涂布单元中的晶片的停留时间段指定为速率确定器。因此，在将涂布溶液涂布到晶片之后，晶片被快速地传送到下一个工艺。因此，由于可以抑制溶剂蒸发，所以可以获得优异的薄膜。

19. 发明授权

US5048878A Striker for lid of fuel inlet chamber 失效
标题翻译：燃油入口舱盖的前叉
公开(公告)号：US5048878A
公开(公告)日：1991-09-17
申请号：US466531
申请日：1990-01-17
申请人： Kazuhiro Takeshita , Tatsuo Chiura
发明人： Kazuhiro Takeshita , Tatsuo Chiura
IPC分类号： B60J7/185 , E05B53/00 , E05B63/00 , E05B65/12
CPC分类号： E05B63/0056 , E05B79/20 , E05B83/34 , Y10T292/0992
摘要： A striker for a lid of a fuel inlet chamber, which is remotely controllable through a control cable. The striker comprises a lock pin, a spring and an inner cable of the control cable. The lock pin is movable in the axial direction thereof and rotatable around a rotational axis, and the rotation of the lock pin can be locked to an aimed position. The lock pin is urged to be projected inside the fuel inlet chamber by the spring. The inner cable is used for withdrawing the lock pin backward.
摘要翻译：用于燃料入口室的盖的撞针，其通过控制电缆可远程控制。撞击器包括锁定销，弹簧和控制电缆的内部电缆。锁定销可沿其轴向移动并且能够围绕旋转轴线旋转，并且锁定销的旋转可被锁定到目标位置。锁定销被弹簧弹簧推入燃料入口室内。内部电缆用于将锁定销向后退回。

20. 发明申请

US20050254360A1 Focus control method for optical disk device 审中-公开
标题翻译：光盘设备的聚焦控制方法
公开(公告)号：US20050254360A1
公开(公告)日：2005-11-17
申请号：US11116236
申请日：2005-04-28
申请人： Toshihisa Sameshima , Kazuhiro Takeshita , Hisashi Sugibuchi
发明人： Toshihisa Sameshima , Kazuhiro Takeshita , Hisashi Sugibuchi
IPC分类号： G11B7/085 , G11B7/00 , G11B7/09 , G11B7/095
CPC分类号： G11B7/0945 , G11B7/0956
摘要： The focus control method of the present invention includes: rotating an optical disk; driving an optical pickup upward and downward vertically to the optical disk at timing of a signal pulse detecting the rotational angle of the optical disk; detecting a focus drive value at timing at which the focal point of a light beam is located on a recording surface of the optical disk; computing a vertical deviation amount from focus drive values at three or more detection points per rotation; applying in advance the vertical deviation amount for a given rotational angle detection signal pulse as the focus drive value; and performing focus control at the given rotational angle detection signal pulse.
摘要翻译：本发明的聚焦控制方法包括：旋转光盘; 在信号脉冲检测光盘的旋转角度的定时，将光拾取器向上和向下垂直驱动; 在所述光束的焦点位于所述光盘的记录表面上的定时处检测聚焦驱动值; 计算每旋转三个或更多个检测点处的聚焦驱动值的垂直偏差量; 预先施加用于给定旋转角度检测信号脉冲的垂直偏移量作为聚焦驱动值; 并在给定的旋转角度检测信号脉冲下执行聚焦控制。

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