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    • 16. 发明申请
    • NANO STRUCTURE AND MANUFACTURING METHOD OF NANO STRUCTURE
    • 纳米结构的纳米结构与制造方法
    • US20090315153A1
    • 2009-12-24
    • US12109701
    • 2008-04-25
    • Taiko MotoiKenji TamamoriShinan WangMasahiko OkunukiHaruhito OnoToshiaki AibaNobuki Yoshimatsu
    • Taiko MotoiKenji TamamoriShinan WangMasahiko OkunukiHaruhito OnoToshiaki AibaNobuki Yoshimatsu
    • H01L29/06H01L21/302
    • B82Y10/00H01L21/3083H01L21/31144
    • To provide a method of manufacturing a nano structure having a pattern of 2 μm or more in depth formed on the surface of a substrate containing Si and a nano structure having a pattern of a high aspect and nano order. A nano structure having a pattern of 2 μm or more in depth formed on the surface of a substrate containing Si, wherein the nano structure is configured to contain Ga or In on the surface of the pattern, and has the maximum value of the concentration of the Ga or the In positioned within 50 nm of the surface of the pattern in the depth direction of the substrate. Further, its manufacturing method is configured such that the surface of the substrate containing Si is irradiated with a focused Ga ion or In ion beam, and the Ga ions or the In ions are injected, while sputtering away the surface of the substrate, and a layer containing Ga or In is formed on the surface of the substrate, and with this layer taken as an etching mask, a dry etching is performed.
    • 本发明提供一种制造具有深度形成在2μm以上的图案的纳米结构体的方法,该方法形成在含有Si的衬底和具有高方面和纳米级的图案的纳米结构的表面上。 在包含Si的基板的表面上形成深度为2μm或更大的图案的纳米结构,其中纳米结构被配置为在图案的表面上含有Ga或In,并且具有 Ga或In位于衬底的深度方向上图案表面的50nm以内。 此外,其制造方法被配置为使得包含Si的衬底的表面被照射聚焦的Ga离子或In离子束,并且注入Ga离子或In离子,同时溅射离开衬底的表面,并且 在基板的表面上形成含有Ga或In的层,将该层作为蚀刻掩模进行干法蚀刻。
    • 17. 发明授权
    • Charged beam processing apparatus
    • 充电光束处理装置
    • US07611810B2
    • 2009-11-03
    • US11678244
    • 2007-02-23
    • Masahiko OkunukiHaruhito OnoShinan WangKenji Tamamori
    • Masahiko OkunukiHaruhito OnoShinan WangKenji Tamamori
    • G03F9/00
    • H01J37/3056B82Y10/00B82Y40/00C23C16/047H01J37/3174H01J2237/0435H01J2237/31732H01J2237/31744
    • A charged beam processing apparatus for processing an object to form structures on the object includes a processing chamber, a multi-charged beam optical system configured to generate a plurality of charged beams, and to converge and to deflect the plurality of charged beams to irradiate the object in the processing chamber with the plurality of charged beams, and a supply port configured to supply a gas into the processing chamber. The multi-charged beam optical system includes (i) a lens array, and (ii) a pattern forming plate configured to select a portion of the lens array to be used to form the structures. The charged beam processing apparatus includes a controller configured to control an exchange of the pattern forming plate in accordance with an arrangement pattern of the structures to be formed on the object.
    • 一种用于处理物体以在物体上形成结构的带电束处理装置包括处理室,多充电束光学系统,其被配置为产生多个带电束,并且会聚和偏转多个带电束以照射 在处理室中具有多个带电束的物体,以及被配置为将气体供应到处理室中的供给口。 多电荷束光学系统包括(i)透镜阵列,以及(ii)配置为选择要用于形成结构的透镜阵列的一部分的图案形成板。 带电波束处理装置包括:控制器,被配置为根据要形成在物体上的结构的布置图案来控制图案形成板的更换。