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    • 12. 发明申请
    • METHOD FOR MANUFACTURING SOLID-STATE IMAGE SENSOR
    • 制造固态图像传感器的方法
    • US20110281392A1
    • 2011-11-17
    • US13088465
    • 2011-04-18
    • Takanori Watanabe
    • Takanori Watanabe
    • H01L31/18
    • H01L27/14689H01L27/14641H01L27/14643
    • A method for manufacturing a sensor having pixels on a substrate, each pixel including a photoelectric converter, a charge-voltage converter, and a gate for forming a channel for transferring charges in the photoelectric converter to the charge-voltage converter, comprises a step of implanting ions into target regions, of the substrate, where the photoelectric converters are to be formed, wherein the step is performed N times, in each of the steps, the ions are implanted along a direction with an inclined angle with respect to a normal to the substrate surface, the target regions where the ions are implanted are different in each step, and for each step, a mask is formed on the substrate, having an opening for every N pixels, a plurality of the openings periodically arranged in a direction along an intersection line between the surface and a plane determined by the normal and the direction.
    • 一种用于制造在基板上具有像素的传感器的方法,每个像素包括光电转换器,电荷 - 电压转换器和用于形成用于将光电转换器中的电荷转移到电荷 - 电压转换器的通道的栅极,包括以下步骤: 将离子注入到要形成光电转换器的衬底的靶区域中,其中步骤进行N次,在每个步骤中,离子沿着相对于法向的倾斜角度的方向注入 衬底表面,离子注入的目标区域在每个步骤中是不同的,并且对于每个步骤,在基板上形成掩模,每个N个像素具有开口,沿着沿着方向周期性地排列的多个开口 表面与平面和方向确定的平面之间的交点。
    • 17. 发明申请
    • IMAGE PICKUP APPARATUS AND IMAGE PICKUP SYSTEM
    • 图像拾取装置和图像拾取系统
    • US20090159945A1
    • 2009-06-25
    • US12390836
    • 2009-02-23
    • Akira OkitaMasanori OguraSeiichiro SakaiTakanori Watanabe
    • Akira OkitaMasanori OguraSeiichiro SakaiTakanori Watanabe
    • H01L27/146
    • H01L27/14603H01L27/1463H01L27/14641
    • To provide a solid-state image pickup apparatus with little or no difference in the dark currents between adjacent photoelectric conversion elements and providing a high sensitivity and a low dark current even in a high-speed readout operation.A well 302 is formed on a wafer 301, and semiconductor layers 101a, 101b are formed in the well to constitute photodiodes. A well contact 306 is formed between the semiconductor layers 101a, 101b. Element isolation regions 303b, 303a are provided between the well contact and the semiconductor layers, and channel stop layers 307b, 307a are provided under the element isolation regions 303b, 303a. A conductive layer 304 is provided on the element isolation region 303b, and a side wall 308 is provided on a side face of the conductive layer 304. A distance a between an end of the element isolation region 303b and the conductive layer 304, a width b of the side wall 308 and a device isolation width c satisfy a relation c>a≧b.
    • 为了提供即使在高速读出操作中,相邻的光电转换元件之间的暗电流几乎或没有差异,并且提供高灵敏度和低暗电流的固态图像拾取装置。 阱302形成在晶片301上,半导体层101a,101b形成在阱中以构成光电二极管。 在半导体层101a,101b之间形成阱接触306。 元件隔离区域303b,303a设置在阱接触件和半导体层之间,并且通道阻挡层307b,307a设置在元件隔离区域303b,303a的下方。 导电层304设置在元件隔离区域303b上,侧壁308设置在导电层304的侧面上。元件隔离区域303b的一端与导电层304之间的距离a,宽度 侧壁308的b和设备隔离宽度c满足关系c> a> = b。