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    • 13. 发明申请
    • COOLER
    • 冷却器
    • US20130206375A1
    • 2013-08-15
    • US13879075
    • 2010-12-24
    • Tadafumi Yoshida
    • Tadafumi Yoshida
    • F28F3/02
    • F28F3/02F28F3/022F28F3/048F28F3/12H01L23/473H01L2924/0002H05K7/20927H01L2924/00
    • A cooler is provided which comprises a heat discharging unit in which a plurality of heat discharge fins are placed in a line and a coolant flows in a passage between the heat discharge fins, an inflow-side coolant reservoir provided extending in a lined direction of the heat discharge fins and connected to a side of one end of the passage between the heat discharge fins through a first diaphragm portion, and an outflow-side coolant reservoir provided extending in the lined direction of the heat discharge fins and connected to a side of the other end of the passage between the heat discharge fins through a second diaphragm portion. An inflow-side fin is formed on a surface of the inflow-side coolant reservoir opposing the first diaphragm portion, and a circulation cross-sectional area of the inflow-side coolant reservoir is set smaller than a circulation cross-sectional area of the outflow-side coolant reservoir.
    • 提供了一种冷却器,其包括放热单元,其中多个散热片布置在一条线中,并且冷却剂在散热片之间的通道中流动,设置在沿着排出翅片的排列方向延伸的流入侧冷却剂储存器 散热翅片,并且通过第一隔膜部分连接到散热片之间的通道一端的一侧,以及流出侧冷却剂储存器,其设置在散热片的排列方向上延伸并连接到散热片的一侧 通过第二隔膜部分在散热片之间的通道的另一端。 在流入侧冷却剂储存器的与第一隔膜部分相对的表面上形成流入侧散热片,并且将流入侧冷却剂储存器的循环横截面积设定为小于流出侧冷却剂流出口的循环截面面积 侧冷却液箱。
    • 16. 发明申请
    • COOLING APPARATUS FOR SEMICONDUCTOR ELEMENT
    • 冷却装置用于半导体元件
    • US20110108247A1
    • 2011-05-12
    • US12943417
    • 2010-11-10
    • Masanori KAWAURAHirohito MatsuiTadafumi Yoshida
    • Masanori KAWAURAHirohito MatsuiTadafumi Yoshida
    • F28D15/00
    • H01L23/473H01L2924/0002H01L2924/00
    • A semiconductor element cooling apparatus includes: a first member whose first surface on which a semiconductor element is mounted, and whose second surface has fins that define coolant flow paths, and that extend in a first direction, and that stand from the second surface to a predetermined height, and that are spaced from each other by predetermined intervals; and a second member that defines the coolant flow paths that extend in the first direction. The fins have grooves which extend in a second direction that intersects the first direction, and which have a depth that extends from the distal end side of the fins toward the second surface. The depth of the grooves is smaller than the height of the fins. A protrusion-forming member is disposed in the grooves, and extends across adjacent fins, and forms protrusions in the coolant flow paths defined by the adjacent fins.
    • 一种半导体元件冷却装置,包括:第一构件,其第一表面上安装有半导体元件,并且其第二表面具有限定冷却剂流动路径的翅片,并且其在第一方向上延伸,并且从第二表面到第二表面 预定高度,并且以预定间隔彼此间隔开; 以及限定沿第一方向延伸的冷却剂流动路径的第二构件。 翅片具有沿与第一方向相交的第二方向延伸的凹槽,并且具有从翅片的远端侧朝向第二表面延伸的深度。 槽的深度小于翅片的高度。 突起形成构件设置在槽中并且延伸穿过相邻的翅片,并且在由相邻翅片限定的冷却剂流动路径中形成突起。
    • 20. 发明授权
    • Injection cooling heat exchanger for vehicle electrical components
    • 汽车电气部件注射冷却热交换器
    • US08251131B2
    • 2012-08-28
    • US12307493
    • 2007-07-10
    • Tadafumi YoshidaYutaka YokoiHiroshi Osada
    • Tadafumi YoshidaYutaka YokoiHiroshi Osada
    • B60H1/00F28D11/06F28D15/00H01L23/34H05K7/20
    • H01L23/4735H01L2924/0002H05K7/20927H01L2924/00
    • A cooling device including a heat absorbing unit, provided with an inflow port of a coolant medium and a discharge port for discharging the coolant medium, sealing the coolant medium in parts other than the inflow port and the discharge port, wherein the heat absorbing unit includes an upper member having an installation surface where semiconductor elements serving as an object to be cooled are installed and a cooling surface serving as a back surface of installation surface, and a lower member forming a chamber having cooling surface as a part of a inner wall surface together with upper member. Injection ports communicating with inflow port for injecting the coolant medium toward cooling surface are provided and the discharge port is provided at a position lower than opening positions of injection ports in lower member.
    • 一种冷却装置,包括设有冷却剂介质的流入口的吸热单元和用于排出冷却剂介质的排出口,将冷却介质密封在流入口和排出口以外的部分,其中,吸热单元包括 安装具有用作待冷却物体的半导体元件的安装表面的上部构件和用作安装表面的后表面的冷却表面,以及形成具有作为内壁表面的一部分的冷却表面的室的下部构件 与上层成员一起。 设置与流入口连通以将冷却剂介质朝向冷却表面喷射的喷射口,并且排出口设置在低于下部构件中的喷射口的打开位置的位置。