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11. 发明专利

JPH06151519A MANUFACTURE OF SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH06151519A
公开(公告)日：1994-05-31
申请号：JP29515392
申请日：1992-11-04
申请人： TOSHIBA CORP , NIPPON STEEL CORP
发明人： SHIMIZU SHINYA , FUJIZU TAKAO , KUDO YOSHIMASA , ONO TAKAHIDE , TATSUMI KOHEI , ANDO TOSHINORI
IPC分类号： H01L21/60 , H01L23/50
摘要： PURPOSE:To furnish a manufacture of a semiconductor device which enables increase of a production efficiency by a method wherein a lead frame is supplied continuously to a plating bonding device to be bonded, without being cut in the shape of a strip. CONSTITUTION:In a process wherein the fore end of a lead of a lead frame and an electrode of a semiconductor chip are connected by plating, supply of the frame to a plating bonding device 1 is executed from a reel 4 to a reel 5 in a reel-to-reel manner.

12. 发明专利

JPH05243338A 失效
公开(公告)号：JPH05243338A
公开(公告)日：1993-09-21
申请号：JP2284692
申请日：1992-02-07
申请人： NIPPON STEEL CORP , TOSHIBA CORP
发明人： ANDO TOSHINORI , TATSUMI KOHEI , ONO TAKAHIDE , FUJIZU TAKAO , KUDO YOSHIMASA , SHIMIZU SHINYA
IPC分类号： H01L21/60 , H01L23/50
摘要： PURPOSE:To uniformly and stably package a semiconductor element for multiple pins by making connecting metal to be joined with a lead protrude on an insulating film side of a TAB tape and bringing it into direct contact with the connecting metal and a semiconductor element electrode. CONSTITUTION:A film 1 at a tip 3 of a lead 2 wired on an organic insulating film 1 is removed to form a viahole 4, in which a lead 1 surface is exposed 5. Then a TAB tape with the viahole 4 provided is dipped in a plating bath to attach and deposit plating metal on a lead exposed face 5 inside the viahole 4 so that connecting metal 6 filling the viahole 4 is made to protrude. The connecting metal 6 is fixed in contact with a surface of an electrode 9 provided on a semiconductor element 8, and the connecting metal 6 and a surface of the electrode 9 are connected with each other by plating metal 10. Thus short- time and efficient plate joining is possible, while stable junction can be obtained and a highly reliable semiconductor device for multiple pins can be obtained.

13. 发明专利

JPH05175408A MATERIAL AND METHOD FOR MOUNTING SEMICONDUCTOR ELEMENT 失效
公开(公告)号：JPH05175408A
公开(公告)日：1993-07-13
申请号：JP31701791
申请日：1991-11-29
申请人： NIPPON STEEL CORP , TOSHIBA CORP
发明人： ANDO TOSHINORI , TATSUMI KOHEI , ONO TAKAHIDE , FUJIZU TAKAO , KUDO YOSHIMASA , SHIMIZU SHINYA
IPC分类号： H01L21/60 , H01L23/50
摘要： PURPOSE:To achieve connection efficiently at the minimum plating area and to prevent the short circuit between a lead and a semiconductor edge by coating the surface with an insulator, using the lead, wherein only the tip surface is exposed to a conductor, and directly bringing the lead into contact with an electrode, when plating junction is performed. CONSTITUTION:The entire surface of a lead part 1 is coated 2 with insulating paint, film, insulating inorganic material or the like. Then, a tip part 3 of the lead 1 is cut, and the conductor of the lead 1 is exposed to a cut edge 4. The coating 2 at the tip part 3 of the cut lead 1 is removed with solvent and the like, or the lead 1 is exposed without applying coating on the tip part 3. The lead part 1 is arranged at the position of an electrode 6, which is provided on the surface of a semiconductor element 5, brought close to or into contact with the surface of the electrode 6 and fixed with a jig. The lead part is submerged into plating bath or placed in spray plating liquid. The exposed conductor of the lead edge 4 and the surface of the electrode are connected to the plating metal 7.

14. 发明专利

JPH04286146A LEAD FRAME AND RESIN-SEALED SEMICONDUCTOR DEVICE USING SAME 失效
公开(公告)号：JPH04286146A
公开(公告)日：1992-10-12
申请号：JP4966891
申请日：1991-03-14
申请人： TOSHIBA CORP
发明人： KUDO YOSHIMASA
IPC分类号： H01L23/28 , H01L23/50
摘要： PURPOSE:To prevent occurrence of cracks in a semiconductor package when the package is mounted on a printed board and improve heat dissipation of a semiconductor element. CONSTITUTION:A semiconductor chip 12 is placed on one surface side of a die pad 11 of a lead frame having the pad 11 and a die support 17. The pad 11, part of the support 17 and the chip 12 are covered with resin 18. Grooves 16 are formed on an opposite surface side to one surface of the pad 11 and the support 17, and extended from the pad 11 to the exterior of the resin 18 through the support 17. Thus, occurrence of cracks in the resin 16 is prevented and heat dissipation of a semiconductor element is improved.

15. 发明专利

JPS6269627A METHOD AND DEVICE FOR MOUNTING SEMICONDUCTOR ELEMENT 失效
公开(公告)号：JPS6269627A
公开(公告)日：1987-03-30
申请号：JP20894885
申请日：1985-09-24
申请人： TOSHIBA CORP
发明人： KUDO YOSHIMASA
IPC分类号： H01L21/52 , H01L21/58
摘要： PURPOSE:To prevent the generation of cavities by a method wherein cavities and bed parts which are supposed to generate in the mounting process are vibrated by means of ultrasonic waves. CONSTITUTION:The necessary semiconductor element is laminated on a solder layer from a gaging stage and a solder is fused by a heater block under an atmosphere of N2 to execute a soldering. Then, this lead frame is carried to a U.S giving part 14 and ultrasonic waves are applied to its bed part fixing with the semiconductor element from an ultrasonic vibrator for 10-15W 0.5sec. Meanwhile at the diode, a Pb-Sn solder is fed to its semiconductor element electrode at a 2nd solder feeding part 15, then ultrasonic waves are applied at a 2nd U.S giving part 17 before connectors are connected at a connector connecting part 16. Hereby, a solder cavity is shifted to the part, at which pressure is lower, by the deairing action of a cavitation effect and finally extruded outside.

16. 发明专利

JPS6185847A Resin-sealed semiconductor device 失效
标题翻译：树脂密封半导体器件
公开(公告)号：JPS6185847A
公开(公告)日：1986-05-01
申请号：JP20718984
申请日：1984-10-04
申请人： Toshiba Corp
发明人： KUDO YOSHIMASA
IPC分类号： H01L23/34 , H01L23/495
CPC分类号： H01L23/49568 , H01L2224/48 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： PURPOSE:To obtain a small-sized and favorably heat radiating semiconductor device by a method wherein each tie bar is provided with U-shaped curving parts at least more than one place, and at the same time, the base surfaces of the U-shaped curing parts are made to expose on the surface of the resin molding part. CONSTITUTION:The greater parts of a tie bars 11 are formed wider than each lead part 8, and at the same time, constricted parts 11b are provided at the point parts thereof. Moreover, roughly U-shaped curving parts 11a are formed at the wider parts and the horizontal parts of the curving parts 11a that is, the U-shaped base parts are made to expose on the base surface of a resin molding part 7 when the resin molding part 7 is formed. Accordingly, the tie bars 11 respectively function as the heat radiating plate. As the intrusion of moisture into the interior of the resin molding part 7 from the surface must pass through the curving path, there is little possibility that the moisture reaches the bed part mounted with a chip. Moreover, as no fin is used in this device, the number of pins can be increased more than that in the semiconductor devices with fin.
摘要翻译：目的：通过一种方法获得小型和有利的散热半导体器件，其中每个连接杆至少设有一个以上的U形弯曲部分，同时，U形的基底表面使固化部件暴露在树脂成型部件的表面上。构成：连杆11的较大部分形成为比每个引导部分8更宽，并且同时在其点部设置收缩部分11b。此外，在弯曲部11a的较宽部分和水平部分形成有大致U形的弯曲部11a，即当树脂成型部7的树脂成型部7的基面上露出U形基部时，形成成型部7。因此，连杆11分别用作散热板。由于从表面侵入树脂成型部7的内部的水分必须通过弯曲路径，所以水分几乎不会到达安装有芯片的床部分。此外，由于在该器件中不使用鳍片，所以与具有鳍片的半导体器件相比，引脚数可以增加。

17. 发明专利

JPH07115102A SEALED TYPE SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH07115102A
公开(公告)日：1995-05-02
申请号：JP19851594
申请日：1994-08-23
申请人： TOSHIBA CORP
发明人： MIZUNO YOSHITAKA , KUDO YOSHIMASA
IPC分类号： H01L21/60 , H01L21/56 , H01L23/28
摘要： PURPOSE:To thinly form the title semiconductor device without impairing reliability when a high density mounting operation is conducted. CONSTITUTION:The inner lead part 12a of each lead of a lead frame 12 is connected to each electrode pad 13 on a semiconductor chip 13. An insulating sealing material 14, having the melting point almost same as the melting point of the solder 16, is attached to the upper part of the inner lead part 12a. On the other hand, the outer lead part 12b of each lead is tacked to each substrate wiring 11a on a mounting substrate 11 using solder 16. Then, by adding heat required for mounting, the junction of the outer lead part 12b and the substrate wiring 11a and the sealing of the semiconductor chip 13 are conducted simultaneously using the solder 16 for the former and the fused insulating material 14 for the latter.

18. 发明专利

JPH0766347A LEAD FRAME FOR SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH0766347A
公开(公告)日：1995-03-10
申请号：JP21269793
申请日：1993-08-27
申请人： TOSHIBA CORP
发明人： KUDO YOSHIMASA
IPC分类号： H01L23/28 , H01L23/50
摘要： PURPOSE:To provide a lead frame using fixing tapes which prevent the deformation of leads, etc., and, at the same time, do not obstruct a resin flow at the time of sealing the lead frame with the resin. CONSTITUTION:A lead frame 10 is composed of a die pad 11 on which a semiconductor chip 20 is mounted, four hanging pins 12 which support the die pad 11, a plurality of leads 13, and fixing tapes 14a-14d which fix the pins 12 and leads 13 positioned around the pins 12. Each fixing tape 14a-14d has a peculiar shape so as to reduce their resistances to a resin flow at the time of sealing a semiconductor device with the resin.

19. 发明专利

JPH06326236A RESIN SEALED SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH06326236A
公开(公告)日：1994-11-25
申请号：JP10912393
申请日：1993-05-11
申请人： TOSHIBA CORP
发明人： MIZUNO YOSHITAKA , KUDO YOSHIMASA
IPC分类号： H01L23/28 , H01L23/29 , H01L23/373 , H01L23/50
摘要： PURPOSE:To enhance heat dissipation characteristics by disposing a good thermal conductor on the rear of a semiconductor chip thereby dissipating heat produced from the semiconductor chip directly to the outside through the good thermal conductor. CONSTITUTION:A semiconductor chip 11 is mounted on a die pad, i.e., a dielectric polyimide film 12. Bump electrodes on the semiconductor chip 11 are connected electrically with leads 13 through thin metal wires 14 and then the chip 11 is sealed with resin 15 while exposing the rear side of the polyimide film 12. A good thermal conductor 16 is embedded at one or more point in the polyimide film 12 while penetrating through the polyimide film 12. The good thermal conductor 16 is also embedded at a point where the semiconductor chip 11 is mounted. Heat produced from the semiconductor chip 11 is dissipated directly to the outside through the good thermal conductor 16. Heat dissipation properties can be further enhanced by disposing the good thermal conductors uniformly beneath the semiconductor chip 11.

20. 发明专利

JPH06310561A SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH06310561A
公开(公告)日：1994-11-04
申请号：JP9424593
申请日：1993-04-21
申请人： TOSHIBA CORP , NIPPON STEEL CORP
发明人： SHIMIZU SHINYA , FUJIZU TAKAO , KUDO YOSHIMASA , ONO YASUHIKO , TATSUMI KOHEI , ANDO TOSHINORI
IPC分类号： H01L21/60
摘要： PURPOSE:To improve productivity and reliability of a semiconductor device and manufacturing method thereof by electrically connecting an electrode on a semiconductor chip and the inner lead of a TCP tape by plating. CONSTITUTION:For example, in a step for connecting the electrode pad of a semiconductor chip 10 and the tip of a lead 31 of a TCP tape 30 by plating, the semiconductor chip 10 is bonded and fixed to a position fixing tape 20 by using a bonding agent 21. Thereafter, the semiconductor chip 10 fixed with the position fixing tape 20 is bonded and fixed to the TCP tape 30 by using the position fixing tape 20. Thus, the semiconductor chip 10 and the TCP tape 30 are positioned and fixed by using the position fixing tape 20, and plating bonding is performed in this constitution.

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