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11. 发明授权

US06988942B2 Conductive polishing article for electrochemical mechanical polishing 失效
公开(公告)号：US06988942B2
公开(公告)日：2006-01-24
申请号：US10894756
申请日：2004-07-20
申请人： Liang-Yuh Chen , Yuchun Wang , Yan Wang , Alain Duboust , Daniel A. Carl , Ralph Wadensweiler , Manoocher Birang , Paul D. Butterfield , Rashid Mavliev , Stan D. Tsai
发明人： Liang-Yuh Chen , Yuchun Wang , Yan Wang , Alain Duboust , Daniel A. Carl , Ralph Wadensweiler , Manoocher Birang , Paul D. Butterfield , Rashid Mavliev , Stan D. Tsai
IPC分类号： B24D11/00
CPC分类号： H01L21/32125 , B23H5/08 , B24B37/22 , B24B37/24 , B24B37/26 , B24B53/017 , B24B57/02 , B82Y30/00 , Y10T428/24273 , Y10T428/24355 , Y10T428/24628 , Y10T428/24917
摘要： An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate and a mounting surface. A plurality of perforations may be formed in the polishing article for flow of material therethrough. In another aspect, a polishing article for polishing a substrate includes a body having a polishing surface and a conductive element disposed therein. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. The polishing surface may have one or more pockets formed therein. The conductive element may be disposed in each of the polishing pockets.

12. 发明授权

US07311592B2 Conductive polishing article for electrochemical mechanical polishing 有权
标题翻译：电化学机械抛光用导电抛光制品
公开(公告)号：US07311592B2
公开(公告)日：2007-12-25
申请号：US11556011
申请日：2006-11-02
申请人： Liang-Yuh Chen , Yuchun Wang , Yan Wang , Alain Duboust , Daniel A. Carl , Ralph Wadensweiler , Manoocher Birang , Paul D. Butterfield , Rashid Mavliev , Stan D. Tsai
发明人： Liang-Yuh Chen , Yuchun Wang , Yan Wang , Alain Duboust , Daniel A. Carl , Ralph Wadensweiler , Manoocher Birang , Paul D. Butterfield , Rashid Mavliev , Stan D. Tsai
IPC分类号： B24D3/34 , B24D11/00 , B24D17/00
CPC分类号： B82Y30/00 , B24B37/046 , B24B37/24 , B24B37/26 , B24D3/34
摘要： An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate. A plurality of perforations may be formed in the polishing article for flow of material therethrough. An electrode is also exposed to the polishing surface by at least a portion of the plurality of perforations. The article of manufacture may also include a polishing surface having a plurality of grooves, wherein a portion of the plurality of grooves intersect with a portion of the plurality of perforations.
摘要翻译：提供了一种用于平坦化基板表面的制造和设备。在一个方面，提供了一种用于抛光衬底的制品，所述衬底包括抛光制品，所述抛光制品包括具有适于抛光所述衬底的至少部分导电表面的主体。可以在抛光制品中形成多个穿孔，以使材料流过其中。电极还通过多个穿孔的至少一部分暴露于抛光表面。制品还可以包括具有多个凹槽的抛光表面，其中多个凹槽的一部分与多个穿孔的一部分相交。

13. 发明授权

US07066800B2 Conductive polishing article for electrochemical mechanical polishing 失效
公开(公告)号：US07066800B2
公开(公告)日：2006-06-27
申请号：US10033732
申请日：2001-12-27
申请人： Liang-Yuh Chen , Yuchun Wang , Yan Wang , Alain Duboust , Daniel A. Carl , Ralph Wadensweiler , Manoocher Birang , Paul D. Butterfield , Rashid Mavliev , Stan D. Tsai
发明人： Liang-Yuh Chen , Yuchun Wang , Yan Wang , Alain Duboust , Daniel A. Carl , Ralph Wadensweiler , Manoocher Birang , Paul D. Butterfield , Rashid Mavliev , Stan D. Tsai
IPC分类号： B24D11/00
CPC分类号： H01L21/32125 , B23H5/08 , B24B37/22 , B24B37/24 , B24B37/26 , B24B53/017 , B24B57/02 , B82Y30/00 , Y10T428/24273 , Y10T428/24355 , Y10T428/24628 , Y10T428/24917
摘要： An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate and a mounting surface. A plurality of perforations may be formed in the polishing article for flow of material therethrough. In another aspect, a polishing article for polishing a substrate includes a body having a polishing surface and a conductive element disposed therein. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. The polishing surface may have one or more pockets formed therein. The conductive element may be disposed in each of the polishing pockets.

14. 发明授权

US06979248B2 Conductive polishing article for electrochemical mechanical polishing 失效
标题翻译：电化学机械抛光用导电抛光制品
公开(公告)号：US06979248B2
公开(公告)日：2005-12-27
申请号：US10140010
申请日：2002-05-07
申请人： Yongqi Hu , Yan Wang , Alain Duboust , Feng Q. Liu , Rashid Mavliev , Liang-Yuh Chen , Ratson Morad , Sasson Somekh
发明人： Yongqi Hu , Yan Wang , Alain Duboust , Feng Q. Liu , Rashid Mavliev , Liang-Yuh Chen , Ratson Morad , Sasson Somekh
IPC分类号： C25D7/12 , B23H5/08 , B24B37/04 , B24D13/14 , C25F3/00 , C25F3/30 , C25F7/00 , H01L21/304 , B24B1/00 , C25C7/04 , C25D17/00
CPC分类号： B24B37/16 , B23H5/08 , B24B37/046 , B24B37/14 , Y10S977/902
摘要： An article of manufacture, method, and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including a polishing article having a body comprising at least a portion of fibers coated with a conductive material, conductive fillers, or combinations thereof, and adapted to polish the substrate. In another aspect, a polishing article includes a body having a surface adapted to polish the substrate and at least one conductive element embedded in the polishing surface, the conductive element comprising dielectric or conductive fibers coated with a conductive material, conductive fillers, or combinations thereof. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. A plurality of perforations and a plurality of grooves may be formed in the articles to facilitate flow of material through and around the polishing article.
摘要翻译：提供了一种用于平坦化基板表面的制造方法和装置。在一个方面，提供了一种制造用品，用于抛光包括抛光制品的基材，所述抛光制品具有主体，该主体包括涂覆有导电材料的纤维的至少一部分，导电填料或其组合，并适于抛光该基材。在另一方面，抛光制品包括具有适于抛光基底的表面和嵌入在抛光表面中的至少一个导电元件的主体，该导电元件包括涂覆有导电材料的电介质或导电纤维，导电填料或其组合。导电元件可以具有延伸超过由抛光表面限定的平面的接触表面。可以在制品中形成多个穿孔和多个凹槽以促进材料通过和抛光制品周围的流动。

15. 发明授权

US07137879B2 Conductive polishing article for electrochemical mechanical polishing 有权
公开(公告)号：US07137879B2
公开(公告)日：2006-11-21
申请号：US11393220
申请日：2006-03-30
申请人： Liang-Yuh Chen , Yuchun Wang , Yan Wang , Alain Duboust , Daniel A. Carl , Ralph Wadensweiler , Manoocher Birang , Paul D. Butterfield , Rashid Mavliev , Stan D. Tsai
发明人： Liang-Yuh Chen , Yuchun Wang , Yan Wang , Alain Duboust , Daniel A. Carl , Ralph Wadensweiler , Manoocher Birang , Paul D. Butterfield , Rashid Mavliev , Stan D. Tsai
IPC分类号： B24D3/34 , B24D11/00 , B24D17/00
CPC分类号： B82Y30/00 , B24B37/046 , B24B37/24 , B24B37/26 , B24D3/34
摘要： An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate and a mounting surface. A plurality of perforations may be formed in the polishing article for flow of material therethrough. In another aspect, a polishing article for polishing a substrate includes a body having a polishing surface and a conductive element disposed therein. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. The polishing surface may have one or more pockets formed therein. The conductive element may be disposed in each of the polishing pockets.

16. 发明授权

US07232363B2 Polishing solution retainer 有权
标题翻译：抛光液固定器
公开(公告)号：US07232363B2
公开(公告)日：2007-06-19
申请号：US10942600
申请日：2004-09-16
申请人： Hanzhong Zhang , Feng Liu , Stan Tsai , Rashid Mavliev , Donald Olgado , Liang-Yuh Chen
发明人： Hanzhong Zhang , Feng Liu , Stan Tsai , Rashid Mavliev , Donald Olgado , Liang-Yuh Chen
IPC分类号： B24B57/02 , B24B7/22
CPC分类号： B24B37/04 , B24B57/02
摘要： A substrate polishing apparatus and method are described. A base includes at least one movable platen to engage a polishing pad. At least one carrier head assembly presses a substrate against the polishing pad substantially within a polishing area during a polishing operation. A polishing solution dispenser applies a polishing solution to the polishing pad substantially within the polishing area during the polishing operation. A polishing solution retaining mechanism is attached to one of the base or the carrier head assembly. The retaining mechanism engages a top surface of the polishing pad and retains the polishing solution substantially within the polishing area during the polishing operation. Some implementations may reduce polishing solution consumption and allow for increased angular velocity.
摘要翻译：对基板研磨装置和方法进行说明。基座包括至少一个可移动的压板以接合抛光垫。在抛光操作期间，至少一个承载头组件基本上在抛光区域内将衬底压靠在抛光垫上。抛光溶液分配器在抛光操作期间基本上在抛光区域内将抛光溶液施加到抛光垫。抛光溶液保持机构附接到基座或承载头组件中的一个。保持机构接合抛光垫的顶表面，并且在抛光操作期间将抛光液基本保持在抛光区域内。一些实施方案可以减少抛光溶液消耗并允许增加的角速度。

17. 发明申请

US20050282380A1 METHOD AND APPARATUS FOR CHEMICAL MECHANICAL POLISHING OF SEMICONDUCTOR SUBSTRATES 失效
标题翻译：半导体基板的化学机械抛光方法与装置
公开(公告)号：US20050282380A1
公开(公告)日：2005-12-22
申请号：US10972191
申请日：2004-10-22
申请人： Stan Tsai , Liang-Yuh Chen , Lizhong Sun , Shijian Li , Feng Liu , Rashid Mavliev , Ratson Morad , Daniel Carl
发明人： Stan Tsai , Liang-Yuh Chen , Lizhong Sun , Shijian Li , Feng Liu , Rashid Mavliev , Ratson Morad , Daniel Carl
IPC分类号： B24B37/04 , B24B49/16 , H01L21/321 , H01L21/768 , H01L21/00 , B24B49/00 , B24B51/00 , H01L21/4763
CPC分类号： H01L21/7684 , B24B37/042 , B24B49/16 , H01L21/3212 , Y02P80/30
摘要： Methods and apparatus for processing substrates to improve polishing uniformity, improve planarization, remove residual material and minimize defect formation are provided. In one aspect, a method is provided for processing a substrate having a conductive material and a low dielectric constant material disposed thereon including polishing a substrate at a polishing pressures of about 2 psi or less and at platen rotational speeds of about 200 cps or greater. The polishing process may use an abrasive-containing polishing composition having up to about 1 wt. % of abrasives. The polishing process may be integrated into a multi-step polishing process.
摘要翻译：提供了用于处理基板以改善抛光均匀性，改善平面化，去除残留材料并最小化缺陷形成的方法和装置。在一个方面，提供了一种用于处理具有导电材料和设置在其上的低介电常数材料的衬底的方法，其包括在约2psi或更小的抛光压力和约200cps或更高的压板旋转速度下抛光衬底。抛光工艺可以使用含有至多约1重量％的磨料的抛光组合物。磨料的百分比。抛光工艺可以集成到多步抛光工艺中。

18. 发明申请

US20060166487A1 Method and apparatus for chemical mechanical polishing of semiconductor substrates 失效
公开(公告)号：US20060166487A1
公开(公告)日：2006-07-27
申请号：US11393999
申请日：2006-03-30
申请人： Stan Tsai , Liang-Yuh Chen , Lizhong Sun , Shijian Li , Feng Liu , Rashid Mavliev , Ratson Morad , Daniel Carl
发明人： Stan Tsai , Liang-Yuh Chen , Lizhong Sun , Shijian Li , Feng Liu , Rashid Mavliev , Ratson Morad , Daniel Carl
IPC分类号： H01L21/4763 , H01L21/461
CPC分类号： H01L21/7684 , B24B37/042 , B24B49/16 , H01L21/3212 , Y02P80/30
摘要： Methods and apparatus for processing substrates to improve polishing uniformity, improve planarization, remove residual material and minimize defect formation are provided. In one aspect, a method is provided for processing a substrate having a conductive material and a low dielectric constant material disposed thereon including polishing a substrate at a polishing pressures of about 2 psi or less and at platen rotational speeds of about 200 cps or greater. The polishing process may use an abrasive-containing polishing composition having up to about 1 wt. % of abrasives. The polishing process may be integrated into a multi-step polishing process.

19. 发明申请

US20060019581A1 Polishing solution retainer 有权
标题翻译：抛光液固定器
公开(公告)号：US20060019581A1
公开(公告)日：2006-01-26
申请号：US10942600
申请日：2004-09-16
申请人： Hanzhong Zhang , Feng Liu , Stan Tsai , Rashid Mavliev , Donald Olgado , Liang-Yuh Chen
发明人： Hanzhong Zhang , Feng Liu , Stan Tsai , Rashid Mavliev , Donald Olgado , Liang-Yuh Chen
IPC分类号： B24B1/00
CPC分类号： B24B37/04 , B24B57/02
摘要： A substrate polishing apparatus and method are described. A base includes at least one movable platen to engage a polishing pad. At least one carrier head assembly presses a substrate against the polishing pad substantially within a polishing area during a polishing operation. A polishing solution dispenser applies a polishing solution to the polishing pad substantially within the polishing area during the polishing operation. A polishing solution retaining mechanism is attached to one of the base or the carrier head assembly. The retaining mechanism engages a top surface of the polishing pad and retains the polishing solution substantially within the polishing area during the polishing operation. Some implementations may reduce polishing solution consumption and allow for increased angular velocity.
摘要翻译：对基板研磨装置和方法进行说明。基座包括至少一个可移动的压板以接合抛光垫。在抛光操作期间，至少一个承载头组件基本上在抛光区域内将衬底压靠在抛光垫上。抛光溶液分配器在抛光操作期间基本上在抛光区域内将抛光溶液施加到抛光垫。抛光溶液保持机构附接到基座或承载头组件中的一个。保持机构接合抛光垫的顶表面，并且在抛光操作期间将抛光液基本保持在抛光区域内。一些实施方案可以减少抛光溶液消耗并允许增加的角速度。

20. 发明授权

US06991526B2 Control of removal profile in electrochemically assisted CMP 失效
标题翻译：电化学辅助CMP中去除曲线的控制
公开(公告)号：US06991526B2
公开(公告)日：2006-01-31
申请号：US10244697
申请日：2002-09-16
申请人： Lizhong Sun , Liang-Yuh Chen , Siew Neo , Feng Q. Liu , Alain Duboust , Stan D. Tsai , Rashid Mavliev
发明人： Lizhong Sun , Liang-Yuh Chen , Siew Neo , Feng Q. Liu , Alain Duboust , Stan D. Tsai , Rashid Mavliev
IPC分类号： B24B1/00 , C25F7/00
CPC分类号： B24B37/042 , B23H5/08
摘要： Aspects of the invention generally provide a method and apparatus for polishing a substrate using electrochemical deposition techniques. In one aspect, an apparatus for polishing a substrate comprises a counter-electrode and a pad positioned between a substrate and the counter-electrode and a pad positioned between a substrate and the counter-electrode. A dielectric insert is positioned between the counter-electrode and the substrate. The dielectric insert has a plurality of zones, each zone permitting a separate current density between the counter-electrode and the substrate. In another embodiment, an apparatus for polishing a substrate that include a conductive layer comprises a counter-electrode to the material layer. The counter-electrode comprises a plurality of electrically isolated conductive elements. An electrical connector is separately coupled to each of the conductive elements.
摘要翻译：本发明的各方面通常提供使用电化学沉积技术来抛光衬底的方法和装置。一方面，用于研磨衬底的装置包括对电极和位于衬底和对电极之间的衬垫以及位于衬底和对电极之间的衬垫。电介质插入件位于对电极和衬底之间。电介质插入件具有多个区域，每个区域允许在对电极和衬底之间分开的电流密度。在另一个实施例中，用于抛光包括导电层的衬底的装置包括与材料层相对的对电极。对电极包括多个电绝缘的导电元件。电连接器分别耦合到每个导电元件。

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