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    • 11. 发明授权
    • Structure of semiconductor device with sinker contact region
    • 具有沉降片接触区域的半导体器件的结构
    • US07164186B2
    • 2007-01-16
    • US10939221
    • 2004-09-10
    • Angelo PintoJeffrey A. BabcockMichael SchoberScott G. BalsterChristoph Dirnecker
    • Angelo PintoJeffrey A. BabcockMichael SchoberScott G. BalsterChristoph Dirnecker
    • H01L29/70
    • H01L29/66272H01L29/41708
    • A method for manufacturing a semiconductor device includes forming a buried layer of a semiconductor substrate. An active region is formed adjacent at least a portion of the buried layer. A first isolation structure is formed adjacent at least a portion of the buried layer. A second isolation structure is formed adjacent at least a portion of the active region. A base layer is formed adjacent at least a portion of the active region. A dielectric layer is formed adjacent at least a portion of the base layer, and then at least part of the dielectric layer is removed at an emitter contact location and at a sinker contact location. An emitter structure is formed at the emitter contact location. Forming the emitter structure includes etching the semiconductor device at the sinker contact location to form a sinker contact region. The sinker contact region has a first depth. The method may also include forming a gate structure. Forming the gate structure includes etching the sinker contact region thereby increasing the first depth of the sinker contact region to a second depth.
    • 半导体器件的制造方法包括形成半导体衬底的掩埋层。 在掩埋层的至少一部分附近形成有源区。 在掩埋层的至少一部分附近形成第一隔离结构。 在活性区域的至少一部分附近形成第二隔离结构。 在活性区域的至少一部分附近形成基底层。 在基底层的至少一部分附近形成电介质层,然后在发射极接触位置和沉降片接触位置移除介电层的至少一部分。 发射极结构形成在发射极接触位置。 形成发射极结构包括在沉降片接触位置蚀刻半导体器件以形成沉降片接触区域。 沉降片接触区域具有第一深度。 该方法还可以包括形成栅极结构。 形成栅极结构包括蚀刻沉降片接触区域,从而将沉降片接触区域的第一深度增加到第二深度。
    • 20. 发明授权
    • Method for manufacturing a semiconductor device with sinker contact region
    • 制造具有沉降片接触区域的半导体器件的方法
    • US06806159B2
    • 2004-10-19
    • US10262211
    • 2002-09-30
    • Angelo PintoJeffrey A. BabcockMichael SchoberScott G. BalsterChristoph Dirnecker
    • Angelo PintoJeffrey A. BabcockMichael SchoberScott G. BalsterChristoph Dirnecker
    • H01L21331
    • H01L29/66272H01L29/41708
    • A method for manufacturing a semiconductor device includes forming a buried layer of a semiconductor substrate. An active region is formed adjacent at least a portion of the buried layer. A first isolation structure is formed adjacent at least a portion of the buried layer. A second isolation structure is formed adjacent at least a portion of the active region. A base layer is formed adjacent at least a portion of the active region. A dielectric layer is formed adjacent at least a portion of the base layer, and then at least part of the dielectric layer is removed at an emitter contact location and at a sinker contact location. An emitter structure is formed at the emitter contact location. Forming the emitter structure includes etching the semiconductor device at the sinker contact location to form a sinker contact region. The sinker contact region has a first depth. The method may also include forming a gate structure. Forming the gate structure includes etching the sinker contact region thereby increasing the first depth of the sinker contact region to a second depth.
    • 半导体器件的制造方法包括形成半导体衬底的掩埋层。 在掩埋层的至少一部分附近形成有源区。 在掩埋层的至少一部分附近形成第一隔离结构。 在活性区域的至少一部分附近形成第二隔离结构。 在活性区域的至少一部分附近形成基底层。 在基底层的至少一部分附近形成电介质层,然后在发射极接触位置和沉降片接触位置移除介电层的至少一部分。 发射极结构形成在发射极接触位置。 形成发射极结构包括在沉降片接触位置蚀刻半导体器件以形成沉降片接触区域。 沉降片接触区域具有第一深度。 该方法还可以包括形成栅极结构。 形成栅极结构包括蚀刻沉降片接触区域,从而将沉降片接触区域的第一深度增加到第二深度。