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11. 发明授权

US07091620B2 Semiconductor device and manufacturing method thereof 有权
公开(公告)号：US07091620B2
公开(公告)日：2006-08-15
申请号：US11116209
申请日：2005-04-28
申请人： Chuichi Miyazaki , Yukiharu Akiyama , Masnori Shibamoto , Tomoaki Kudaishi , Ichiro Anjoh , Kunihiko Nishi , Asao Nishimura , Hideki Tanaka , Ryosuke Kimoto , Kunihiro Tsubosaki , Akio Hasebe , Takehiro Ohnishi , Noriou Shimada , Shuji Eguchi , Hiroshi Koyama , Akira Nagai , Masahiko Ogino
发明人： Chuichi Miyazaki , Yukiharu Akiyama , Masnori Shibamoto , Tomoaki Kudaishi , Ichiro Anjoh , Kunihiko Nishi , Asao Nishimura , Hideki Tanaka , Ryosuke Kimoto , Kunihiro Tsubosaki , Akio Hasebe , Takehiro Ohnishi , Noriou Shimada , Shuji Eguchi , Hiroshi Koyama , Akira Nagai , Masahiko Ogino
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/50 , H01L23/3114 , H01L23/3128 , H01L23/49572 , H01L23/49816 , H01L23/49827 , H01L23/4985 , H01L24/06 , H01L24/45 , H01L24/48 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/06136 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/4824 , H01L2224/48465 , H01L2224/50 , H01L2224/85951 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2924/00015 , H01L2224/05599
摘要： A semiconductor device includes a semiconductor chip formed with connection terminals, an elastic structure interposed between a main surface of the chip and a wiring substrate formed with wirings connected at first ends thereof to the connection terminals, and bump electrodes connected to the other ends of the wirings. The connection terminals may be at a center part or in peripheral part(s) of the chip main surface and both the elastic structure and wiring substrate are not provided at locations of connection terminals. A resin body seals at least the connection terminals and the exposed first ends of wirings (leads). In a scheme in which the connection terminals are located in a peripheral part of the chip main surface, the wiring substrate protrudes beyond the chip boundary where the connection terminals are arranged, and the resin body shape is restricted by the protruding part of the wiring substrate.

12. 发明申请

US20050069277A1 Mobile millimetric wave radar 审中-公开
标题翻译：移动毫米波雷达
公开(公告)号：US20050069277A1
公开(公告)日：2005-03-31
申请号：US10494932
申请日：2001-11-09
申请人： Terumi Nakazawa , Kenji Tabuchi , Shuji Eguchi , Tsuyoshi Fujita , Hidetaka Shigi
发明人： Terumi Nakazawa , Kenji Tabuchi , Shuji Eguchi , Tsuyoshi Fujita , Hidetaka Shigi
IPC分类号： G01S7/03 , G01S13/34 , G01S13/93 , H01Q1/32 , H01Q1/42 , H01Q21/00 , H01Q23/00 , G02B6/00
CPC分类号： H01Q23/00 , G01S7/032 , G01S13/348 , G01S13/931 , G01S2013/9353 , H01L2223/6677 , H01L2224/16227 , H01L2224/48227 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01Q1/3233 , H01Q1/42 , H01Q21/0087
摘要： An antenna unit for sending out electromagnetic waves of a millimetric-wave band to outside and receiving the wave reflected from a target, and circuits for signal-processing the reflected wave are equipped as a vehicular millimetric-wave radar device. Antenna patterns are formed on a surface of a multilayer base plate formed of plural stacked layers of dielectric plates and an electroconductive layer interposed between each layer. Circuit wiring patterns and electronic components for signal processing of millimetric waves are disposed on the reverse side. Among all the above-mentioned electronic components, only a millimetric-wave signal oscillator, amplifier, and frequency converter are haused in a hermetically sealed section formed in a localized space on a face of the multilayer base plate. The other electronic components are arranged in a non-hermetically structured condition on a periphery of the hermetically sealed section. The above-mentioned oscillator, amplifier, and frequency converter are hermetically sealed in an inert gas atmosphere, whereas at least part of the other electronic components arranged in a non-hermetically structured condition is protected by resin coating. With this configuration, a compact, thin, and highly accurate millimetric-wave radar device is provided at a low cost.
摘要翻译：天线单元，用于向外部发送毫米波段的电磁波并接收从目标反射的波，以及用于信号处理反射波的电路作为车辆毫米波雷达装置。天线图案形成在由介电板的多个堆叠层和介于每层之间的导电层形成的多层基板的表面上。用于毫米波信号处理的电路布线图形和电子部件设置在反面上。在所有上述电子部件中，只有一个毫米波信号振荡器，放大器和变频器在形成在多层基板的表面上的局部空间中的气密密封部分中。其他电子部件在气密密封部分的周边上以非气密结构的状态布置。上述振荡器，放大器和变频器被气密地密封在惰性气体气氛中，而以非气密结构状态布置的其它电子部件的至少一部分被树脂涂覆保护。通过这种配置，以低成本提供了紧凑，薄型和高精度的毫米波雷达装置。

13. 发明授权

US06686226B1 Method of manufacturing a semiconductor device a ball grid array package structure using a supporting frame 失效
标题翻译：使用支撑框架制造半导体器件的球栅阵列封装结构的方法
公开(公告)号：US06686226B1
公开(公告)日：2004-02-03
申请号：US09562758
申请日：2000-05-02
申请人： Shigeharu Tsunoda , Junichi Saeki , Isamu Yoshida , Kazuya Ooji , Michiharu Honda , Makoto Kitano , Nae Yoneda , Shuji Eguchi , Kunihiko Nishi , Ichiro Anjoh , Kenichi Otsuka
发明人： Shigeharu Tsunoda , Junichi Saeki , Isamu Yoshida , Kazuya Ooji , Michiharu Honda , Makoto Kitano , Nae Yoneda , Shuji Eguchi , Kunihiko Nishi , Ichiro Anjoh , Kenichi Otsuka
IPC分类号： H01L2144
CPC分类号： H01L24/97 , H01L21/565 , H01L23/3107 , H01L23/3128 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/05554 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/12044 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2224/83 , H01L2224/85 , H01L2224/05599 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor plastic package, more particularly a preferred package structure and method for making a BGA package. A resin sealed BGA package where a supporting frame which fixedly supports semiconductor parts; i.e., an IC chip, a circuit board, or a circuit film, is sealed with resin, using a mold, which is composed of an upper mold half and a lower mold half with the lower mold half having a plurality of projections, one at a position corresponding to each of the external terminals. The mold has a divisional structure which has an air vent between the divisional elements thereof.
摘要翻译：一种半导体塑料封装，更具体地，优选的封装结构和用于制造BGA封装的方法。树脂密封BGA封装，其中固定支撑半导体部件的支撑框架; 即IC芯片，电路板或电路膜用树脂密封，使用由上半模和下半模组成的模具，下半模具有多个突起，一个在与每个外部端子对应的位置。模具具有在其分割元件之间具有通风口的分隔结构。

14. 发明授权

US06515371B2 Semiconductor device with elastic structure and wiring 有权
标题翻译：具有弹性结构和布线的半导体器件
公开(公告)号：US06515371B2
公开(公告)日：2003-02-04
申请号：US09983177
申请日：2001-10-23
申请人： Yukiharu Akiyama , Tomoaki Kudaishi , Takehiro Ohnishi , Noriou Shimada , Shuji Eguchi , Asao Nishimura , Ichiro Anjo , Kunihiro Tsubosaki , Chuichi Miyazaki , Hiroshi Koyama , Masanori Shibamoto , Akira Nagai , Masahiko Ogino
发明人： Yukiharu Akiyama , Tomoaki Kudaishi , Takehiro Ohnishi , Noriou Shimada , Shuji Eguchi , Asao Nishimura , Ichiro Anjo , Kunihiro Tsubosaki , Chuichi Miyazaki , Hiroshi Koyama , Masanori Shibamoto , Akira Nagai , Masahiko Ogino
IPC分类号： H01L2348
CPC分类号： H01L24/50 , H01L23/3114 , H01L23/49572 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/1433 , H01L2924/3025
摘要： A semiconductor device including a semiconductor chip having connection terminals in a peripheral part of a main surface thereof; an elastic body disposed on the main surface leaving the connection terminals exposed; an insulating tape formed on the elastic body and having openings in areas where the connection terminals are situated; plural leads formed on the top surface of the insulating tape, one end of each lead being connected to one of the connection terminals and the other end being disposed on the elastic body; plural bump electrodes formed on the other ends of the plural leads; and a resin body for sealing the connection terminals and one end of each of the leads, wherein the insulating tape protrudes beyond the chip where the plural connection terminals are arranged, and wherein the shape of the resin body is restricted by the protruding part of the insulating tape.
摘要翻译：一种半导体器件，包括在其主表面的周边部分中具有连接端子的半导体芯片; 设置在主表面上的弹性体，使连接端子露出; 绝缘带，形成在弹性体上并且在连接端子所在的区域中具有开口; 多个引线形成在绝缘带的顶表面上，每个引线的一端连接到一个连接端子，另一端设置在弹性体上; 形成在多个引线的另一端上的多个凸起电极; 以及用于密封连接端子和每个引线的一端的树脂体，其中绝缘带突出超过设置有多个连接端子的芯片，并且其中树脂体的形状受到绝缘胶带

15. 发明授权

US6130112A Semiconductor device 有权
公开(公告)号：US6130112A
公开(公告)日：2000-10-10
申请号：US166857
申请日：1998-10-06
申请人： Makoto Kitano , Ryuji Kohno , Naotaka Tanaka , Akihiro Yaguchi , Tetsuo Kumazawa , Ichiro Anjoh , Hideki Tanaka , Asao Nishimura , Shuji Eguchi , Akira Nagai , Mamoru Mita
发明人： Makoto Kitano , Ryuji Kohno , Naotaka Tanaka , Akihiro Yaguchi , Tetsuo Kumazawa , Ichiro Anjoh , Hideki Tanaka , Asao Nishimura , Shuji Eguchi , Akira Nagai , Mamoru Mita
IPC分类号： H01L21/60 , H01L23/04 , H01L23/12 , H01L23/31 , H01L23/495 , H01L21/48
CPC分类号： H01L24/50 , H01L23/3114 , H01L23/49572 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01052 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/15787
摘要： A semiconductor device, is provided will semiconductor chips having a plurality of electrodes for external connection, elastomer resin portions formed of an elastomer resin, which are bonded to the semiconductor chip excepting at least some of the plurality of electrodes, a tape layer of resin including tape wiring patterns on the surface thereof, a plurality of solder bumps for bonding the printed wiring pattern to the tape wiring patterns, leads for connecting the plurality of electrodes of the semiconductor chips to the tape wiring patterns, and seal resin for covering the leads and the plurality of electrodes which are connected by the leads. The elastomer resin has a modulus of transverse elasticity not less than 50 MPa and not more than 750 MPa.

16. 发明授权

US6097100A Resin sealed semiconductor devices and a process for manufacturing the same 失效
标题翻译：树脂密封半导体器件及其制造方法
公开(公告)号：US6097100A
公开(公告)日：2000-08-01
申请号：US915334
申请日：1997-08-20
申请人： Shuji Eguchi , Yasuhide Sugawara , Toshiaki Ishii , Hiroyoshi Kokaku , Akira Nagai , Ryou Moteki , Ogino Masahiko , Masanori Segawa , Rie Hattori , Nobutake Tsuyuno , Takumi Ueno , Atsushi Nakamura , Asao Nishimura
发明人： Shuji Eguchi , Yasuhide Sugawara , Toshiaki Ishii , Hiroyoshi Kokaku , Akira Nagai , Ryou Moteki , Ogino Masahiko , Masanori Segawa , Rie Hattori , Nobutake Tsuyuno , Takumi Ueno , Atsushi Nakamura , Asao Nishimura
IPC分类号： H01L23/29 , H01L23/31 , H01L23/495 , H01L23/28
CPC分类号： H01L23/4951 , H01L23/293 , H01L23/3128 , H01L2224/05624 , H01L2224/32057 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/48624 , H01L2224/73215 , H01L2224/73265 , H01L2224/83385 , H01L2224/92 , H01L2224/92147 , H01L2224/92247 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2924/01012 , H01L2924/01013 , H01L2924/01039 , H01L2924/01079 , H01L2924/07802 , H01L2924/12044 , H01L2924/15311 , H01L2924/181
摘要： A resin encapsulated semiconductor element is encapsulated with resin composition containing an organic compound selected from the group consisting of organobromine compounds, organophosphorus compounds and organonitrogen compounds, an inorganic filler, and a metal borate. The obtained resin encapsulated semiconductor element has the same flame resistance as a conventional semiconductor element which is encapsulated with a resin composition containing a halogen and antimony compound, and furthermore, has remarkably improved reliabilities regarding moisture resistance and storing at a high temperature by effects of the contained metal borate for suppressing generation of or trapping released gas components, such as halogen or phosphorus, and others.
摘要翻译：树脂封装的半导体元件用含有有机化合物的树脂组合物包封，所述有机化合物选自有机溴化合物，有机磷化合物和有机氮化合物，无机填料和金属硼酸盐。所获得的树脂封装的半导体元件具有与用含有卤素和锑化合物的树脂组合物封装的常规半导体元件相同的阻燃性，并且还具有显着提高的耐湿性的可靠性和高温下的存储含有金属硼酸盐，用于抑制诸如卤素或磷的释放气体组分的产生或捕获等。

17. 发明授权

US07359212B2 Control device and method of manufacturing thereof 有权
标题翻译：控制装置及其制造方法
公开(公告)号：US07359212B2
公开(公告)日：2008-04-15
申请号：US11243319
申请日：2005-10-05
申请人： Takuya Mayuzumi , Shuji Eguchi , Masahiro Sasaki , Kiyoomi Kadoya
发明人： Takuya Mayuzumi , Shuji Eguchi , Masahiro Sasaki , Kiyoomi Kadoya
IPC分类号： H05K7/02 , H05K7/06 , H05K7/08 , H05K7/10
CPC分类号： H05K3/284 , B29C45/14639 , H05K1/0215 , H05K3/0061 , H05K3/321 , H05K3/3447 , H05K5/0034 , H05K5/0082 , H05K7/20854 , H05K2201/09054 , H05K2201/10189 , H05K2201/2036 , Y10T29/49146
摘要： A module comprises a metallic terminal pins for connection and a circuit board with electronic components mounted thereon, a circuit board connecting side of the connector. The electronic components and the circuit board with the electronic components mounted thereon are encapsulated with the same resin. A metallic base is united to the module to obtain an electric conduction between the metallic base and the circuit board.
摘要翻译：模块包括用于连接的金属端子销和安装有电子部件的电路板，连接器的电路板连接侧。电子部件和安装有电子部件的电路板用相同的树脂封装。将金属基体与模块结合，以在金属基座和电路板之间获得电导通。

18. 发明授权

US06940162B2 Semiconductor module and mounting method for same 失效
标题翻译：半导体模块及其安装方法相同
公开(公告)号：US06940162B2
公开(公告)日：2005-09-06
申请号：US10840605
申请日：2004-05-07
申请人： Shuji Eguchi , Akira Nagai , Haruo Akahoshi , Takumi Ueno , Toshiya Satoh , Masahiko Ogino , Asao Nishimura , Ichiro Anjo , Hideki Tanaka
发明人： Shuji Eguchi , Akira Nagai , Haruo Akahoshi , Takumi Ueno , Toshiya Satoh , Masahiko Ogino , Asao Nishimura , Ichiro Anjo , Hideki Tanaka
IPC分类号： H01L21/56 , H01L23/42 , H01L23/433 , H01L25/065 , H01L23/34 , H01L23/48
CPC分类号： H01L23/42 , H01L21/56 , H01L21/565 , H01L23/4334 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0652 , H01L25/0655 , H01L2224/16225 , H01L2224/45015 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/73253 , H01L2224/73265 , H01L2924/0102 , H01L2924/01322 , H01L2924/16152 , H01L2924/16153 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2224/32225 , H01L2924/00012 , H01L2924/20752
摘要： In a multi chip module of a structure wherein a plurality of bare or packaged semiconductor chips are mounted on a single wiring board and upper surfaces of the semiconductor chips are covered with a single heat spread plate, the whole space around the semiconductor chips thus sandwiched between the wiring board and the heat spread plate is filled with resin.By so doing, the semiconductor chips are interconnected through the resin, so that even if a stress is exerted on any of the chips, it is dispersed and therefore it is possible to diminish the occurrence of cracks in the chips and the heat spread plate caused by stress concentration. Besides, since the semiconductor chips and the heat spread plate are bonded together with resin, even if there are variations in size of the chips, both can be bonded easily. Further, the bonding of all the chips and the heat spread plate can be done in a single process.
摘要翻译：在多个裸片或封装的半导体芯片安装在单个布线板上并且半导体芯片的上表面被一个单独的散热板覆盖的结构的多芯片模块中，由此夹在半导体芯片周围的整个空间布线板和扩散板填充树脂。通过这样做，半导体芯片通过树脂互连，使得即使在任何芯片上施加应力，它也被分散，因此可以减少芯片和散热板中的裂纹的发生通过压力集中。此外，由于半导体芯片和扩散板与树脂粘合在一起，即使芯片的尺寸有变化，两者也可以容易地结合。此外，所有芯片和散热板的接合可以在单个工艺中完成。

19. 发明授权

US06861294B2 Semiconductor devices and methods of making the devices 失效
标题翻译：半导体器件和制造器件的方法
公开(公告)号：US06861294B2
公开(公告)日：2005-03-01
申请号：US10673459
申请日：2003-09-30
申请人： Shigeharu Tsunoda , Junichi Saeki , Isamu Yoshida , Kazuya Ooji , Michiharu Honda , Makoto Kitano , Nae Yoneda , Shuji Eguchi , Kunihiko Nishi , Ichiro Anjoh , Kenichi Otsuka
发明人： Shigeharu Tsunoda , Junichi Saeki , Isamu Yoshida , Kazuya Ooji , Michiharu Honda , Makoto Kitano , Nae Yoneda , Shuji Eguchi , Kunihiko Nishi , Ichiro Anjoh , Kenichi Otsuka
IPC分类号： H01L21/56 , H01L23/31 , H01L21/44
CPC分类号： H01L24/97 , H01L21/565 , H01L23/3107 , H01L23/3128 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/05554 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/12044 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2224/83 , H01L2224/85 , H01L2224/05599 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor plastic package, more particularly a preferred package structure and method for making a BGA package. A resin sealed BGA package where a supporting frame which fixedly supports semiconductor parts; i.e., an IC chip, a circuit board, or a circuit film, is sealed with resin, using a mold which is composed of an upper mold half and a lower mold half with the lower mold half having a plurality of projections, one at a position corresponding to each of the external terminals. The mold has a divisional structure which has an air vent between the divisional elements thereof.
摘要翻译：一种半导体塑料封装，更具体地，优选的封装结构和用于制造BGA封装的方法。树脂密封BGA封装，其中固定支撑半导体部件的支撑框架; 即IC芯片，电路板或电路膜用树脂密封，使用由上半模和下半模组成的模具，下半模具有多个突起，一个在对应于每个外部端子的位置。模具具有在其分割元件之间具有通风口的分隔结构。

20. 发明授权

US6114005A Laminate and multilayer printed circuit board 失效
标题翻译：层压板和多层印刷电路板
公开(公告)号：US6114005A
公开(公告)日：2000-09-05
申请号：US859659
申请日：1997-05-20
申请人： Akira Nagai , Masatsugu Ogata , Shuji Eguchi , Masahiko Ogino , Toshiaki Ishii , Masanori Segawa , Hiroyoshi Kokaku , Ryo Moteki , Ichiro Anjoh
发明人： Akira Nagai , Masatsugu Ogata , Shuji Eguchi , Masahiko Ogino , Toshiaki Ishii , Masanori Segawa , Hiroyoshi Kokaku , Ryo Moteki , Ichiro Anjoh
IPC分类号： B32B27/12 , H01L23/14 , H05K1/03 , B32B5/12
CPC分类号： B32B27/12 , H01L23/145 , H05K1/0373 , H01L2224/48227 , H01L2924/10253 , H01L2924/12044 , H01L2924/15311 , H01L2924/30107 , H01L2924/3025 , H05K2201/015 , H05K2201/0209 , H05K2201/0212 , H05K2201/029 , H05K2201/068 , Y10S428/901 , Y10T428/24132 , Y10T428/254
摘要： A laminate capable of mounting semiconductor elements thereon; comprising an insulating layer which is constituted by a resin portion of sea-island structure and a woven reinforcement. The resin portion of sea-island structure is, for example, such that a resin as islands are dispersed in a resin as a matrix. Thus, the insulating layer exhibits a coefficient of thermal expansion of 3.0.about.10 (ppm/K) in a planar direction thereof and a glass transition temperature of 150.about.300 (.degree.C.). Owing to these physical properties, thermal stresses which the laminate undergoes in packaging the semiconductor elements thereon can be reduced, so that the connections of the laminate with the semiconductor elements can be made highly reliable.
摘要翻译：能够在其上安装半导体元件的层压体; 包括由海岛结构的树脂部分和织造加强件构成的绝缘层。例如，海岛结构的树脂部分使得岛状树脂以树脂为基体分散。因此，绝缘层在其平面方向上的热膨胀系数为3.0D（ppm / K），玻璃化转变温度为150℃（℃）。由于这些物理性质，可以减少层压体在其上封装半导体元件时的热应力，使得层压体与半导体元件的连接可以高度可靠。

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