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1. 发明授权

US06515371B2 Semiconductor device with elastic structure and wiring 有权
标题翻译：具有弹性结构和布线的半导体器件
公开(公告)号：US06515371B2
公开(公告)日：2003-02-04
申请号：US09983177
申请日：2001-10-23
申请人： Yukiharu Akiyama , Tomoaki Kudaishi , Takehiro Ohnishi , Noriou Shimada , Shuji Eguchi , Asao Nishimura , Ichiro Anjo , Kunihiro Tsubosaki , Chuichi Miyazaki , Hiroshi Koyama , Masanori Shibamoto , Akira Nagai , Masahiko Ogino
发明人： Yukiharu Akiyama , Tomoaki Kudaishi , Takehiro Ohnishi , Noriou Shimada , Shuji Eguchi , Asao Nishimura , Ichiro Anjo , Kunihiro Tsubosaki , Chuichi Miyazaki , Hiroshi Koyama , Masanori Shibamoto , Akira Nagai , Masahiko Ogino
IPC分类号： H01L2348
CPC分类号： H01L24/50 , H01L23/3114 , H01L23/49572 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/1433 , H01L2924/3025
摘要： A semiconductor device including a semiconductor chip having connection terminals in a peripheral part of a main surface thereof; an elastic body disposed on the main surface leaving the connection terminals exposed; an insulating tape formed on the elastic body and having openings in areas where the connection terminals are situated; plural leads formed on the top surface of the insulating tape, one end of each lead being connected to one of the connection terminals and the other end being disposed on the elastic body; plural bump electrodes formed on the other ends of the plural leads; and a resin body for sealing the connection terminals and one end of each of the leads, wherein the insulating tape protrudes beyond the chip where the plural connection terminals are arranged, and wherein the shape of the resin body is restricted by the protruding part of the insulating tape.
摘要翻译：一种半导体器件，包括在其主表面的周边部分中具有连接端子的半导体芯片; 设置在主表面上的弹性体，使连接端子露出; 绝缘带，形成在弹性体上并且在连接端子所在的区域中具有开口; 多个引线形成在绝缘带的顶表面上，每个引线的一端连接到一个连接端子，另一端设置在弹性体上; 形成在多个引线的另一端上的多个凸起电极; 以及用于密封连接端子和每个引线的一端的树脂体，其中绝缘带突出超过设置有多个连接端子的芯片，并且其中树脂体的形状受到绝缘胶带

2. 发明授权

US06639323B2 Semiconductor device and its manufacturing method 有权
公开(公告)号：US06639323B2
公开(公告)日：2003-10-28
申请号：US09983286
申请日：2001-10-23
申请人： Yukiharu Akiyama , Tomoaki Kudaishi , Takehiro Ohnishi , Noriou Shimada , Shuji Eguchi , Asao Nishimura , Ichiro Anjo , Kunihiro Tsubosaki , Chuichi Miyazaki , Hiroshi Koyama , Masanori Shibamoto , Akira Nagai , Masahiko Ogino
发明人： Yukiharu Akiyama , Tomoaki Kudaishi , Takehiro Ohnishi , Noriou Shimada , Shuji Eguchi , Asao Nishimura , Ichiro Anjo , Kunihiro Tsubosaki , Chuichi Miyazaki , Hiroshi Koyama , Masanori Shibamoto , Akira Nagai , Masahiko Ogino
IPC分类号： H01L2348
CPC分类号： H01L24/50 , H01L23/3114 , H01L23/49572 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/1433 , H01L2924/3025
摘要： A semiconductor device including a semiconductor chip having connection terminals in a peripheral part of a main surface thereof; an elastic body disposed on the main surface leaving the connection terminals exposed; an insulating tape formed on the elastic body and having openings in areas where the connection terminals are situated; plural leads formed on the top surface of the insulating tape, one end of each lead being connected to one of the connection terminals and the other end being disposed on the elastic body; plural bump electrodes formed on the other ends of the plural leads; and a resin body for sealing the connection terminals and one end of each of the leads, wherein the insulating tape protrudes beyond the chip where the plural connection terminals are arranged, and wherein the shape of the resin body is restricted by the protruding part of the insulating tape.

3. 发明授权

US06307269B1 Semiconductor device with chip size package 失效
标题翻译：具有芯片尺寸封装的半导体器件
公开(公告)号：US06307269B1
公开(公告)日：2001-10-23
申请号：US09113500
申请日：1998-07-10
申请人： Yukiharu Akiyama , Tomoaki Kudaishi , Takehiro Ohnishi , Noriou Shimada , Shuji Eguchi , Asao Nishimura , Ichiro Anjo , Kunihiro Tsubosaki , Chuichi Miyazaki , Hiroshi Koyama , Masanori Shibamoto , Akira Nagai , Masahiko Ogino
发明人： Yukiharu Akiyama , Tomoaki Kudaishi , Takehiro Ohnishi , Noriou Shimada , Shuji Eguchi , Asao Nishimura , Ichiro Anjo , Kunihiro Tsubosaki , Chuichi Miyazaki , Hiroshi Koyama , Masanori Shibamoto , Akira Nagai , Masahiko Ogino
IPC分类号： H01L2348
CPC分类号： H01L24/50 , H01L23/3114 , H01L23/49572 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/1433 , H01L2924/3025
摘要： A semiconductor device including a semiconductor chip having connection terminals in a peripheral part of a main surface thereof; an elastic body disposed on the main surface leaving the connection terminals exposed; an insulating tape formed on the elastic body and having openings in areas where the connection terminals are situated; plural leads formed on the top surface of the insulating tape, one end of each lead being connected to one of the connection terminals and the other end being disposed on the elastic body; plural bump electrodes formed on the other ends of the plural leads; and a resin body for sealing the connection terminals and one end of each of the leads, wherein the insulating tape protrudes beyond the chip where the plural connection terminals are arranged, and wherein the shape of the resin body is restricted by the protruding part of the insulating tape.
摘要翻译：一种半导体器件，包括在其主表面的周边部分中具有连接端子的半导体芯片; 设置在主表面上的弹性体，使连接端子露出; 绝缘带，形成在弹性体上并且在连接端子所在的区域中具有开口; 多个引线形成在绝缘带的顶表面上，每个引线的一端连接到一个连接端子，另一端设置在弹性体上; 形成在多个引线的另一端上的多个凸起电极; 以及用于密封连接端子和每个引线的一端的树脂体，其中绝缘带突出超过设置有多个连接端子的芯片，并且其中树脂体的形状受到绝缘胶带

4. 发明授权

US07091620B2 Semiconductor device and manufacturing method thereof 有权
公开(公告)号：US07091620B2
公开(公告)日：2006-08-15
申请号：US11116209
申请日：2005-04-28
申请人： Chuichi Miyazaki , Yukiharu Akiyama , Masnori Shibamoto , Tomoaki Kudaishi , Ichiro Anjoh , Kunihiko Nishi , Asao Nishimura , Hideki Tanaka , Ryosuke Kimoto , Kunihiro Tsubosaki , Akio Hasebe , Takehiro Ohnishi , Noriou Shimada , Shuji Eguchi , Hiroshi Koyama , Akira Nagai , Masahiko Ogino
发明人： Chuichi Miyazaki , Yukiharu Akiyama , Masnori Shibamoto , Tomoaki Kudaishi , Ichiro Anjoh , Kunihiko Nishi , Asao Nishimura , Hideki Tanaka , Ryosuke Kimoto , Kunihiro Tsubosaki , Akio Hasebe , Takehiro Ohnishi , Noriou Shimada , Shuji Eguchi , Hiroshi Koyama , Akira Nagai , Masahiko Ogino
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/50 , H01L23/3114 , H01L23/3128 , H01L23/49572 , H01L23/49816 , H01L23/49827 , H01L23/4985 , H01L24/06 , H01L24/45 , H01L24/48 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/06136 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/4824 , H01L2224/48465 , H01L2224/50 , H01L2224/85951 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2924/00015 , H01L2224/05599
摘要： A semiconductor device includes a semiconductor chip formed with connection terminals, an elastic structure interposed between a main surface of the chip and a wiring substrate formed with wirings connected at first ends thereof to the connection terminals, and bump electrodes connected to the other ends of the wirings. The connection terminals may be at a center part or in peripheral part(s) of the chip main surface and both the elastic structure and wiring substrate are not provided at locations of connection terminals. A resin body seals at least the connection terminals and the exposed first ends of wirings (leads). In a scheme in which the connection terminals are located in a peripheral part of the chip main surface, the wiring substrate protrudes beyond the chip boundary where the connection terminals are arranged, and the resin body shape is restricted by the protruding part of the wiring substrate.

5. 发明申请

US20050200019A1 Semiconductor device and manufacturing method thereof 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US20050200019A1
公开(公告)日：2005-09-15
申请号：US11116209
申请日：2005-04-28
申请人： Chuichi Miyazaki , Yukiharu Akiyama , Masnori Shibamoto , Tomoaki Kudaishi , Ichiro Anjoh , Kunihiko Nishi , Asao Nishimura , Hideki Tanaka , Ryosuke Kimoto , Kunihiro Tsubosaki , Akio Hasebe , Takehiro Ohnishi , Noriou Shimada , Shuji Eguchi , Hiroshi Koyama , Akira Nagai , Masahiko Ogino
发明人： Chuichi Miyazaki , Yukiharu Akiyama , Masnori Shibamoto , Tomoaki Kudaishi , Ichiro Anjoh , Kunihiko Nishi , Asao Nishimura , Hideki Tanaka , Ryosuke Kimoto , Kunihiro Tsubosaki , Akio Hasebe , Takehiro Ohnishi , Noriou Shimada , Shuji Eguchi , Hiroshi Koyama , Akira Nagai , Masahiko Ogino
IPC分类号： H01L23/31 , H01L23/495 , H01L23/498 , H01L23/48 , H01L21/44
CPC分类号： H01L24/50 , H01L23/3114 , H01L23/3128 , H01L23/49572 , H01L23/49816 , H01L23/49827 , H01L23/4985 , H01L24/06 , H01L24/45 , H01L24/48 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/06136 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/4824 , H01L2224/48465 , H01L2224/50 , H01L2224/85951 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2924/00015 , H01L2224/05599
摘要： A semiconductor device includes a semiconductor chip formed with connection terminals, an elastic structure interposed between a main surface of the chip and a wiring substrate formed with wirings connected at first ends thereof to the connection terminals, and bump electrodes connected to the other ends of the wirings. The connection terminals may be at a center part or in peripheral part(s) of the chip main surface and both the elastic structure and wiring substrate are not provided at locations of connection terminals. A resin body seals at least the connection terminals and the exposed first ends of wirings (leads). In a scheme in which the connection terminals are located in a peripheral part of the chip main surface, the wiring substrate protrudes beyond the chip boundary where the connection terminals are arranged, and the resin body shape is restricted by the protruding part of the wiring substrate.
摘要翻译：半导体器件包括形成有连接端子的半导体芯片，插入在芯片的主表面之间的弹性结构和形成有连接到连接端子的布线的布线基板，以及连接到连接端子的另一端的凸起电极布线。连接端子可以在芯片主表面的中心部分或周边部分，并且弹性结构和布线基板都不设置在连接端子的位置处。树脂体至少密封连接端子和暴露的布线的第一端（引线）。在连接端子位于芯片主表面的周边部分的方案中，布线基板突出超过布置有连接端子的芯片边界，并且树脂体形状被布线基板的突出部分限制。

6. 发明申请

US20050212142A1 Semiconductor device and manufacturing metthod thereof 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：US20050212142A1
公开(公告)日：2005-09-29
申请号：US11116308
申请日：2005-04-28
申请人： Chuichi Miyazaki , Yukiharu Akiyama , Masnori Shibamoto , Tomoaki Kudaishi , Ichiro Anjoh , Kunihiko Nishi , Asao Nishimura , Hideki Tanaka , Ryosuke Kimoto , Kunihiro Tsubosaki , Akio Hasebe , Takehiro Ohnishi , Noriou Shimada , Shuji Eguchi , Hiroshi Koyama , Akira Nagai , Masahiko Ogino
发明人： Chuichi Miyazaki , Yukiharu Akiyama , Masnori Shibamoto , Tomoaki Kudaishi , Ichiro Anjoh , Kunihiko Nishi , Asao Nishimura , Hideki Tanaka , Ryosuke Kimoto , Kunihiro Tsubosaki , Akio Hasebe , Takehiro Ohnishi , Noriou Shimada , Shuji Eguchi , Hiroshi Koyama , Akira Nagai , Masahiko Ogino
IPC分类号： H01L23/31 , H01L23/495 , H01L23/498 , H01L23/48 , H01L21/44
CPC分类号： H01L24/50 , H01L23/3114 , H01L23/3128 , H01L23/49572 , H01L23/49816 , H01L23/49827 , H01L23/4985 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/86 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/06136 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/4824 , H01L2224/48465 , H01L2224/50 , H01L2224/85951 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2924/00015 , H01L2224/05599
摘要： A semiconductor device includes a semiconductor chip formed with connection terminals, an elastic structure interposed between a main surface of the chip and a wiring substrate formed with wirings connected at first ends thereof to the connection terminals, and bump electrodes connected to the other ends of the wirings. The connection terminals may be at a center part or in peripheral part(s) of the chip main surface and both the elastic structure and wiring substrate are not provided at locations of connection terminals. A resin body seals at least the connection terminals and the exposed first ends of wirings (leads). In a scheme in which the connection terminals are located in a peripheral part of the chip main surface, the wiring substrate protrudes beyond the chip boundary where the connection terminals are arranged, and the resin body shape is restricted by the protruding part of the wiring substrate.
摘要翻译：半导体器件包括形成有连接端子的半导体芯片，插入在芯片的主表面之间的弹性结构和形成有连接到连接端子的布线的布线基板，以及连接到连接端子的另一端的凸起电极布线。连接端子可以在芯片主表面的中心部分或周边部分，并且弹性结构和布线基板都不设置在连接端子的位置处。树脂体至少密封连接端子和暴露的布线的第一端（引线）。在连接端子位于芯片主表面的周边部分的方案中，布线基板突出超过布置有连接端子的芯片边界，并且树脂体形状被布线基板的突出部分限制。

7. 发明授权

US5482412A Cutting tool 失效
标题翻译：切割用具
公开(公告)号：US5482412A
公开(公告)日：1996-01-09
申请号：US241859
申请日：1994-05-12
申请人： Yoshihisa Ueda , Syouji Takiguchi , Akira Kanaboshi , Takehiro Ohnishi
发明人： Yoshihisa Ueda , Syouji Takiguchi , Akira Kanaboshi , Takehiro Ohnishi
IPC分类号： B23B51/08 , B23B51/10 , B23C3/05 , B23B41/06
CPC分类号： B23B51/106 , B23C3/055 , Y10T408/375 , Y10T408/38 , Y10T408/62 , Y10T408/8588
摘要： A slider 16 having a cutting insert 5A is slidably mounted in a groove 11 formed along the generatrix dimension of a substantially conical tool body 1. Serrations 12 and 16a, which are brought into close contact with each other for engagement, are formed on one side surface 11a of the groove 11 and on one side surface of the slide 16 opposite thereto. A wedge member 13 is detachably mounted between the other side surface 11b of the groove 11 and the slider 16 and is pressed against the side surface 11a so as to cause the serrations 12 and 16 to be engaged with each other. No special shaping accuracy is needed for the groove 11 or the slider 16 since any shaping error in these members can be absorbed so that a sufficient mounting accuracy is ensured for the slider 16. Thus, it is possible to reduce the requisite labor, etc. for the shaping of these members while maintaining the requisite positional accuracy for the cutting insert 5A.
摘要翻译：具有切削刀片5A的滑块16可滑动地安装在沿着基本上圆锥形的工具主体1的母线尺寸形成的凹槽11中。彼此紧密接触以进行接合的锯齿12和16a形成在一侧槽11的表面11a和与其相对的滑块16的一个侧表面上。楔形构件13可拆卸地安装在槽11的另一侧面11b和滑块16之间，并且被压靠在侧面11a上，以使锯齿12和16彼此接合。凹槽11或滑块16不需要特殊的成型精度，因为可以吸收这些构件中的任何成形误差，从而确保滑块16的足够的安装精度。因此，可以减少所需的劳动等。用于这些构件的成形，同时保持切削刀片5A的必要的位置精度。

8. 发明授权

US06867123B2 Semiconductor integrated circuit device and its manufacturing method 失效
标题翻译：半导体集成电路器件及其制造方法
公开(公告)号：US06867123B2
公开(公告)日：2005-03-15
申请号：US10250939
申请日：2001-11-30
申请人： Mitsuaki Katagiri , Yuji Shirai , Kunihiko Nishi , Takehiro Ohnishi
发明人： Mitsuaki Katagiri , Yuji Shirai , Kunihiko Nishi , Takehiro Ohnishi
IPC分类号： H01L23/31 , H01L23/485 , H01L23/525 , H01L27/02 , H01L27/105 , H01L21/44
CPC分类号： H01L24/02 , H01L23/3114 , H01L23/525 , H01L24/10 , H01L24/13 , H01L27/0207 , H01L27/105 , H01L2224/0401 , H01L2224/05008 , H01L2224/05022 , H01L2224/05569 , H01L2224/05571 , H01L2224/13 , H01L2224/13022 , H01L2224/13024 , H01L2224/13099 , H01L2224/16 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/05042 , H01L2924/12042 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/3011 , H01L2924/351 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor wafer which has finished formation of a relocating wiring layer thereon is stored and after determination of a design, solder bumps are formed over bump lands (one end of the relocating wiring layer) in accordance with a pattern which differs with a design, whereby a function or characteristic depending on the design is selected. The semiconductor wafer is then cut into a plurality of semiconductor chips, whereby a wafer level CSP is available.
摘要翻译：存储已经完成其上定向布线层的半导体晶片，并且在设计确定之后，根据设计不同的图案，在凸起焊盘（重定位布线层的一端）上形成焊料凸点，由此选择根据设计的功能或特性。然后将半导体晶片切割成多个半导体芯片，由此可获得晶片级CSP。

9. 发明授权

US5427479A Cutting tool 失效
标题翻译：切割用具
公开(公告)号：US5427479A
公开(公告)日：1995-06-27
申请号：US231640
申请日：1994-04-22
申请人： Yoshihisa Ueda , Syouji Takiguchi , Akira Kanaboshi , Takehiro Ohnishi
发明人： Yoshihisa Ueda , Syouji Takiguchi , Akira Kanaboshi , Takehiro Ohnishi
IPC分类号： B23B29/03 , B23B29/00 , B23B29/034 , B23C3/05 , B23B51/00
CPC分类号： B23C3/055 , B23B29/00 , Y10T408/85 , Y10T408/8588 , Y10T82/125
摘要： A substantially conical tool body 1 has a groove 11 extending in the direction of generating line. The groove 11 slidably receives a slider 16 carrying a cutting insert 5A. A spacer 12 having serration grooves 12a is interposed between one wall surface 11a of the groove and the slider 16. Serration grooves 16a are formed in one side surface of the slider 16. A wedge member 13 is detachably interposed between the wall surface 11b of the groove 11 and the slider 16 so as to press the slider 16 to bring the serration grooves 12a16a into engagement with each other. Any wear and deformation due to cutting load appear on the spacer 12 and the wedge member 13, so that original mounting and positional precision of the slider 16 can easily be recovered by renewing these members, thus maintaining a required level of machining precision.
摘要翻译：大致圆锥形的工具主体1具有在发电线的方向上延伸的槽11。槽11可滑动地容纳承载切削刀片5A的滑块16。具有锯齿槽12a的间隔件12插入在槽的一个壁表面11a和滑块16之间。在滑块16的一个侧表面中形成有锯齿槽16a。楔形构件13可拆卸地插入在槽11和滑块16，以便按压滑块16使锯齿槽12a + B，16a彼此接合。由于切割负荷引起的任何磨损和变形出现在间隔件12和楔形件13上，从而通过更新这些构件可以容易地恢复滑块16的原始安装和位置精度，从而保持所需的加工精度水平。

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