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11. 发明授权

US6157246A Load driving circuit with boosting timing control 失效
标题翻译：负载驱动电路具有升压时序控制
公开(公告)号：US6157246A
公开(公告)日：2000-12-05
申请号：US109732
申请日：1998-07-02
申请人： Mitsuhiro Saitou , Hiroyuki Ban
发明人： Mitsuhiro Saitou , Hiroyuki Ban
IPC分类号： B60R21/01 , G05F1/10
CPC分类号： B60R21/017
摘要： The present invention is aimed at avoiding noise generation accompanying switching actions in booster circuits for a load such as an air-bag driving circuit. In an air-bag driving circuit, which is designed to actuate an igniting transistor 13 in response to output of a collision detecting signal from a collision detector 7 for detecting a collision condition of a vehicle so as to supply an igniting current to a squib 11 based on a voltage boosted by booster circuits 4 and 5, the boosting operation of the booster circuits 4 and 5 is inhibited while the collision detecting signal is absent and started when the collision detecting signal is output from the collision detector 7.
摘要翻译：本发明旨在避免伴随诸如气囊驱动电路的负载的升压电路中的切换动作的噪声产生。在气囊驱动电路中，其被设计成响应来自碰撞检测器7的碰撞检测信号的输出来致动点火晶体管13，用于检测车辆的碰撞状况，以便向点火器11提供点火电流基于由升压电路4和5升压的电压，当碰撞检测信号从碰撞检测器7输出时，不存在冲突检测信号并开始升压电路4和5的升压操作。

12. 发明申请

US20050231925A1 Semiconductor device and method for manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US20050231925A1
公开(公告)日：2005-10-20
申请号：US11105548
申请日：2005-04-14
申请人： Yutaka Fukuda , Mitsuhiro Saitou , Toshihiro Nagaya , Kan Kinouchi , Sadahiro Akama , Koji Numazaki , Norihisa Imaizumi , Hiromasa Hayashi , Akihiro Fukatsu , Hirokazu Kasuya , Nobumasa Ueda
发明人： Yutaka Fukuda , Mitsuhiro Saitou , Toshihiro Nagaya , Kan Kinouchi , Sadahiro Akama , Koji Numazaki , Norihisa Imaizumi , Hiromasa Hayashi , Akihiro Fukatsu , Hirokazu Kasuya , Nobumasa Ueda
IPC分类号： H01F7/18 , H01L21/56 , H01L23/36 , H01L23/433 , H01L23/488 , H01L23/495 , H01L25/04 , H05K1/02 , H05K1/03 , H05K1/14 , H05K3/28 , H05K7/02
CPC分类号： H05K1/142 , H01L21/565 , H01L23/4334 , H01L23/4952 , H01L23/49562 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/4903 , H01L2224/49051 , H01L2224/49111 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/014 , H01L2924/09701 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/19107 , H01L2924/20752 , H01L2924/20753 , H01L2924/2076 , H01L2924/3011 , H01L2924/351 , H05K1/0263 , H05K1/0306 , H05K3/0061 , H05K3/284 , H05K2201/10924 , H05K2203/049 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An electric device includes: a first electric element; a second electric element capable of flowing large current therethrough so that heat is generated in the second electric element; a heat sink; and a first wiring board and a second wiring board, which are disposed on one side of the heat sink. The large current in the second electric element is larger than that in the first electric element. The first wiring board and the second wiring board are separated each other. The first electric element is disposed on the first wiring board, and the second electric element is disposed on the second wiring board.
摘要翻译：电气装置包括：第一电气元件; 第二电气元件，其能够流过大电流，使得在所述第二电气元件中产生热量; 散热器以及设置在散热器的一侧的第一布线板和第二布线板。第二电元件中的大电流大于第一电元件中的大电流。第一布线板和第二布线板彼此分离。第一电气元件设置在第一布线板上，第二电气元件设置在第二布线板上。

13. 发明申请

US20120326292A1 ELECTRONIC CONTROL UNIT 审中-公开
标题翻译：电子控制单元
公开(公告)号：US20120326292A1
公开(公告)日：2012-12-27
申请号：US13524149
申请日：2012-06-15
申请人： Yutaka OHASHI , Mitsuhiro Saitou , Yuta Uozaki
发明人： Yutaka OHASHI , Mitsuhiro Saitou , Yuta Uozaki
IPC分类号： H01L23/34
CPC分类号： H01L23/3677 , H01L2224/48091 , H01L2224/48247 , H01L2224/49109 , H01L2924/12032 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/00014 , H01L2924/00
摘要： An electronic control unit includes a substrate, a semiconductor module, a heat storage body, an insulator, and a heat sink. The substrate includes a wiring and a land. The semiconductor module includes a semiconductor chip working as a switching element, a terminal electrically coupled with the semiconductor chip and the wiring, a molded resin sealing the semiconductor chip and the terminal, and a heat radiation plate having a surface exposed from the molded resin and transferring heat generated at the semiconductor chip. The heat storage body has a heat capacity required to store the heat generated at the semiconductor chip. The heat storage body is coupled with the heat radiation plate. The insulator is in contact with the heat storage body or the semiconductor module. The heat sink is in contact with the insulator.
摘要翻译：电子控制单元包括基板，半导体模块，蓄热体，绝缘体和散热器。基板包括布线和焊盘。半导体模块包括用作开关元件的半导体芯片，与半导体芯片和布线电耦合的端子，密封半导体芯片和端子的模制树脂和具有从模制树脂露出的表面的散热板，以及传递在半导体芯片处产生的热量。蓄热体具有存储半导体芯片产生的热量所需的热容量。蓄热体与散热板连接。绝缘体与蓄热体或半导体模块接触。散热器与绝缘体接触。

14. 发明申请

US20050179463A1 Driving apparatus of H bridge circuit and protection method of the same 有权
标题翻译： H桥电路的驱动装置及其保护方法相同
公开(公告)号：US20050179463A1
公开(公告)日：2005-08-18
申请号：US11057786
申请日：2005-02-15
申请人： Hirokazu Kasuya , Koji Numazaki , Mitsuhiro Saitou , Yutaka Fukuda , Nobumasa Ueda
发明人： Hirokazu Kasuya , Koji Numazaki , Mitsuhiro Saitou , Yutaka Fukuda , Nobumasa Ueda
IPC分类号： H02P7/28 , H02H7/08 , H02P7/00 , H03K17/06 , H03K17/082 , H03K17/10 , H03K17/687 , H03K19/0175
CPC分类号： H03K17/14 , H02H7/0838 , H02P7/04 , H03K17/063 , H03K17/0822 , H03K17/102 , H03K17/6877
摘要： In order to protect semiconductor switching-devices employed in an H bridge circuit against an over-voltage without using a special protection circuit, a control circuit outputs a control signal to a driving circuit for driving the H bridge circuit in order to turn off FETs serving as the semiconductor switching-devices when an over-voltage detection circuit detects the over-voltage applied to the H bridge circuit.
摘要翻译：为了在不使用特殊保护电路的情况下保护H桥电路中使用的半导体开关器件免于过电压，控制电路将控制信号输出到用于驱动H桥电路的驱动电路，以便关断供电的FET 作为半导体开关器件，当过电压检测电路检测到施加到H桥电路的过电压时。

15. 发明授权

US5982604A Power supply apparatus for electronic control unit in automotive vehicle 失效
标题翻译：汽车电子控制单元供电装置
公开(公告)号：US5982604A
公开(公告)日：1999-11-09
申请号：US44258
申请日：1998-03-19
申请人： Akio Kojima , Mitsuhiro Saitou , Kiyoshi Yamamoto
发明人： Akio Kojima , Mitsuhiro Saitou , Kiyoshi Yamamoto
IPC分类号： B60R16/03 , H02J1/00 , H02J7/00 , H02J7/14 , H02M3/155 , H02M3/156 , H01H47/00 , G05F1/44 , H02M3/335
CPC分类号： H02M3/1563 , H02J7/0065 , H02J7/1438 , H02M1/36
摘要： A power supply apparatus is provided for energizing an electronic control unit mounted on a vehicle having a battery and a starter switch. The apparatus includes a coil connected to the power supply line, and a switch which operates for selectively enabling a current to flow through the coil and cutting off the current through the coil. A control circuit operates for selectively changing the switch between an ON state and an OFF state when the starter switch assumes an ON position. The ON and OFF states alternate in accordance with predetermined delays.
摘要翻译：一种供电装置，用于对安装在具有电池和起动开关的车辆上的电子控制单元进行通电。该装置包括连接到电源线的线圈和用于选择性地使电流流过线圈并切断通过线圈的电流的开关。当起动开关处于ON位置时，控制电路用于选择性地改变ON状态和OFF状态之间的开关。 ON和OFF状态根据预定的延迟交替。

16. 发明授权

US5917246A Semiconductor package with pocket for sealing material 失效
标题翻译：半导体封装带口袋密封材料
公开(公告)号：US5917246A
公开(公告)日：1999-06-29
申请号：US620580
申请日：1996-03-22
申请人： Hirokazu Kasuya , Kouji Numazaki , Takahisa Koyasu , Mitsuhiro Saitou
发明人： Hirokazu Kasuya , Kouji Numazaki , Takahisa Koyasu , Mitsuhiro Saitou
IPC分类号： H01L23/28 , H01L21/56 , H01L23/24 , H01L23/29 , H01L23/31 , H05K3/28 , H05K3/34
CPC分类号： H01L23/24 , H01L21/56 , H01L2224/45144 , H01L2224/48091 , H05K3/284 , H05K3/3405
摘要： A semiconductor package, which secures the protection of circuit elements from the external environment, is disclosed. A single in-line package (SIP) is constructed by fixingly sealing a hybrid integrated circuit component within a casing with epoxy resin. A sleeve is bonded on the surface of a ceramic substrate. The sleeve is formed with silicon rubber into a pocket shape so as to cover respective circuit elements of the hybrid integrated circuit component. In the sleeve is made an opening part. Silicon gel is poured into the sleeve as a fixingly sealing material and cured to seal the respective circuit elements. Terminals downwardly extends in parallel with each other from an end part of the ceramic substrate through an opening part of the casing.
摘要翻译：公开了一种确保电路元件与外部环境的保护的半导体封装。单个在线封装（SIP）是通过将环形树脂固定密封在壳体内的混合集成电路部件构成的。套筒结合在陶瓷基板的表面上。套筒由硅橡胶形成为袋形，以覆盖混合集成电路部件的各个电路元件。在袖子里打开了一部分。将硅胶作为固定密封材料倒入套筒中并固化以密封各个电路元件。端子从陶瓷基板的端部通过壳体的开口部向下平行地延伸。

17. 发明授权

US5593722A Method of producing thick multi-layer substrates 失效
标题翻译：生产厚多层基板的方法
公开(公告)号：US5593722A
公开(公告)日：1997-01-14
申请号：US599112
申请日：1996-02-09
申请人： Yuji Otani , Takashi Nagasaka , Mitsuhiro Saitou
发明人： Yuji Otani , Takashi Nagasaka , Mitsuhiro Saitou
IPC分类号： H01C17/242 , H01C17/30 , H01L21/70 , H05K1/09 , H05K1/16 , H05K3/46 , B05D5/12
CPC分类号： H05K1/167 , H01C17/242 , H01C17/30 , H01L21/705 , H01L2224/16225 , H01L2924/19105 , H05K1/092 , H05K2201/0195 , H05K2203/171 , H05K3/4664
摘要： A method is provided for easily producing thick multi-layer substrates maintaining highly accurate resistances with little variation. A thick-film resistor 6 on a ceramic substrate 1 is fired at a temperature higher than the temperature of firing a glass insulating layer 2 that is formed thereon in contact therewith. This makes it possible to decrease the change in the resistance in a subsequent high-temperature step of firing the glass insulating layers 2 to 4. Moreover, after the glass insulating layer 2 is formed on the thick-film resistor 6 on the ceramic substrate 1, laser trimming is effected through a window or the glass insulating layer 2 and, thereafter, the glass insulating layers 3 and 4 are formed. This makes it possible to decrease the change in the resistance of the thick-film resistor 6 after laser trimming and to reduce the laser output.
摘要翻译：提供了一种容易地生产具有很小变化的保持高精度电阻的厚多层基板的方法。陶瓷基板1上的厚膜电阻6在比与其形成的玻璃绝缘层2的烧成温度高的温度下烧成。这使得可以减少烧结玻璃绝缘层2至4的后续高温步骤中的电阻变化。此外，在玻璃绝缘层2形成在陶瓷基板1上的厚膜电阻器6上之后通过窗口或玻璃绝缘层2进行激光修整，然后形成玻璃绝缘层3和4。这使得可以减少激光微调后厚膜电阻6的电阻变化并减少激光输出。

18. 发明授权

US5439732A Ceramic multi-layer wiring board 失效
标题翻译：陶瓷多层接线板
公开(公告)号：US5439732A
公开(公告)日：1995-08-08
申请号：US184104
申请日：1994-01-21
申请人： Takashi Nagasaka , Yuji Ontani , Mitsuhiro Saitou
发明人： Takashi Nagasaka , Yuji Ontani , Mitsuhiro Saitou
IPC分类号： H05K1/09 , H01L21/48 , H01L23/498 , H01L23/538 , H05K1/03 , H05K3/24 , H05K3/40 , H05K3/46 , B32B9/00
CPC分类号： H01L23/49883 , H01L21/4867 , H01L23/5383 , H05K3/4061 , H01L2224/16225 , H01L2924/19105 , H05K1/0306 , H05K1/092 , H05K2201/035 , H05K2201/0352 , H05K2201/096 , H05K3/248 , H05K3/4053 , H05K3/4611 , H05K3/4629 , H05K3/4667 , Y10S428/901 , Y10T428/12507 , Y10T428/12514 , Y10T428/1284 , Y10T428/12896 , Y10T428/24917 , Y10T428/24926
摘要： In a ceramic multi-layer wiring board, a surface conductor layer is made of a copper-based material and an inner conductor in the ceramic multilayer is a non-copper metal having a melting point higher than a temperature at which the ceramic multilayer is fired, typically Ag. Cu and Ag form eutectic crystals when firing the surface conductor layer of Cu. This can be prevented by connecting the surface conductor layer and the inner conductor with Ag-Pd or a metal which is different from the materials of the surface wiring layer and the inner conductor and which does not form eutectic crystals with the material of the surface wiring layer at the temperature at which the surface wiring layer is fired.
摘要翻译：在陶瓷多层布线板中，表面导体层由铜基材料制成，并且陶瓷多层中的内部导体是熔点高于陶瓷多层烧制温度的非铜金属，通常为Ag。 Cu和Ag在烧制Cu的表面导体层时形成共晶晶体。这可以通过用与表面布线层和内部导体的材料不同的Ag-Pd或金属连接表面导体层和内部导体，并且不与表面布线的材料形成共晶体在表面布线层被烧制的温度下。

19. 发明授权

US09320178B2 Electronic control unit and method of manufacturing the same 有权
标题翻译：电子控制单元及其制造方法
公开(公告)号：US09320178B2
公开(公告)日：2016-04-19
申请号：US13611203
申请日：2012-09-12
申请人： Shinsuke Oota , Mitsuhiro Saitou , Yutaka Oohashi
发明人： Shinsuke Oota , Mitsuhiro Saitou , Yutaka Oohashi
IPC分类号： H05K7/20 , B60R16/023 , H01L23/36 , H01L23/367 , H01L23/40 , H01L23/42 , H01L25/16 , H05K1/02 , H01L23/34 , H05K5/00 , H05K3/00 , H05K3/42
CPC分类号： H05K7/20854 , B60R16/0239 , H01L23/36 , H01L23/3677 , H01L23/4006 , H01L23/42 , H01L25/165 , H01L2924/0002 , H01L2924/19105 , H05K1/0206 , H05K3/0061 , H05K3/42 , H05K5/0082 , H05K2201/0187 , H05K2201/09054 , H05K2201/10166 , H05K2201/1056 , Y10T29/49117 , H01L2924/00
摘要： An electronic control unit is disclosed. The electronic control unit includes: a resin board; a power device that is surface-mounted on the resin board; a microcomputer that is configured to control the power device; first heat radiation means for radiating heat, the first heat radiation means being disposed on an opposite side of the resin board from the power device; and first heat conduction means for conducting the heat generated by the power device to the first heat radiation means.
摘要翻译：公开了一种电子控制单元。电子控制单元包括：树脂板; 表面安装在树脂板上的功率器件; 微型计算机，被配置为控制所述功率器件; 第一散热装置，用于散热，第一散热装置设置在树脂板与动力装置相反的一侧; 以及第一热传导装置，用于将由功率装置产生的热量传导到第一散热装置。

20. 发明申请

US20100254093A1 ELECTRONIC CONTROL UNIT AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：电子控制单元及其制造方法
公开(公告)号：US20100254093A1
公开(公告)日：2010-10-07
申请号：US12752534
申请日：2010-04-01
申请人： Shinsuke Oota , Mitsuhiro Saitou , Yutaka Oohashi
发明人： Shinsuke Oota , Mitsuhiro Saitou , Yutaka Oohashi
IPC分类号： H05K7/20 , H01R43/00
CPC分类号： H05K7/20854 , B60R16/0239 , H01L23/36 , H01L23/3677 , H01L23/4006 , H01L23/42 , H01L25/165 , H01L2924/0002 , H01L2924/19105 , H05K1/0206 , H05K3/0061 , H05K3/42 , H05K5/0082 , H05K2201/0187 , H05K2201/09054 , H05K2201/10166 , H05K2201/1056 , Y10T29/49117 , H01L2924/00
摘要： An electronic control unit is disclosed. The electronic control unit includes: a resin board; a power device that is surface-mounted on the resin board; a microcomputer that is configured to control the power device; first heat radiation means for radiating heat, the first heat radiation means being disposed on an opposite side of the resin board from the power device; and first heat conduction means for conducting the heat generated by the power device to the first heat radiation means.
摘要翻译：公开了一种电子控制单元。电子控制单元包括：树脂板; 表面安装在树脂板上的功率器件; 微型计算机，被配置为控制所述功率器件; 第一散热装置，用于散热，所述第一散热装置设置在所述树脂板与所述动力装置相反的一侧; 以及第一热传导装置，用于将由功率装置产生的热量传导到第一散热装置。

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