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1. 发明授权

US08957678B2 Sensor unit and magnetic flux concentrating module 有权
标题翻译：传感器单元和磁通集中模块
公开(公告)号：US08957678B2
公开(公告)日：2015-02-17
申请号：US13042665
申请日：2011-03-08
申请人： Shinsuke Oota
发明人： Shinsuke Oota
IPC分类号： G01R33/06 , G01L3/10 , G01R33/00 , G01R33/07
CPC分类号： G01L3/104 , G01R33/0011 , G01R33/072
摘要： A sensor unit includes a printed circuit board, a Hall IC, a terminal member, and a capacitor. The printed circuit board has a conductive pattern. The Hall IC is disposed on the printed circuit board. The Hall IC includes an element part that detects magnetic flux. The element part is arranged in parallel with the printed circuit board and is away from the conductive pattern. The terminal member is disposed on an end portion of the printed circuit board and is configured to be electrically coupled with an external device. The capacitor is disposed on the printed circuit board.
摘要翻译：传感器单元包括印刷电路板，霍尔IC，端子构件和电容器。印刷电路板具有导电图案。霍尔IC布置在印刷电路板上。霍尔IC包括检测磁通的元件部分。元件部分与印刷电路板平行布置并远离导电图案。端子构件设置在印刷电路板的端部上并且被配置为与外部设备电耦合。电容器设置在印刷电路板上。

2. 发明授权

US08467193B2 Electronic control unit 有权
标题翻译：电子控制单元
公开(公告)号：US08467193B2
公开(公告)日：2013-06-18
申请号：US13199609
申请日：2011-09-02
申请人： Shinsuke Oota
发明人： Shinsuke Oota
IPC分类号： H05K5/00 , H05K7/04
CPC分类号： H05K7/20854 , H05K5/006
摘要： A resin board is fixed to a plate member made of metal by a fixing member. A semi-conductor module and a capacitor are mounted on a first surface of the resin board. A first ground pattern is formed on the first surface and electrically connected to the plate member by means of the fixing member. A connector is also provided on the first surface such that the first ground pattern is interposed between the semi-conductor module and the connector. The heat from the semi-conductor module and the capacitor is transmitted to the plate member via the first ground pattern and the fixing member.
摘要翻译：树脂板通过固定构件固定到由金属制成的板构件。半导体模块和电容器安装在树脂板的第一表面上。第一接地图案形成在第一表面上，并通过固定构件与板构件电连接。在第一表面上还设置连接器，使得第一接地图案插入在半导体模块和连接器之间。来自半导体模块和电容器的热量经由第一接地图案和固定构件传递到板构件。

3. 发明申请

US20110090625A1 ELECTRONIC CONTROL APPARATUS 有权
标题翻译：电子控制装置
公开(公告)号：US20110090625A1
公开(公告)日：2011-04-21
申请号：US12905305
申请日：2010-10-15
申请人： Shinsuke OOTA
发明人： Shinsuke OOTA
IPC分类号： H05K5/02
CPC分类号： H05K5/0047 , B62D5/04 , B62D5/0406 , H05K5/069
摘要： An electronic control apparatus includes a housing, a lid, a fastener, and a controller. The lid covers the opening of the housing to form a closed space defined by the lid and the housing. The fastener fixes the lid to the housing. The controller is located in the space. An isolation member is provided with an outer surface of one of the lid and the bottom of the housing. The outer surface has a liquid drip area where liquid is expected to drip. The isolation member causes the liquid dripped on the liquid drip area to flow down the outer surface in such a manner that the liquid avoids the fastener.
摘要翻译：电子控制装置包括壳体，盖子，紧固件和控制器。盖子覆盖壳体的开口以形成由盖子和壳体限定的封闭空间。紧固件将盖子固定到壳体上。控制器位于空间中。隔离构件设置有盖的一个的外表面和壳体的底部。外表面具有液体滴注区域，液体预期会滴落。隔离构件使得滴落在液滴区域上的液体以使得液体避免紧固件的方式沿着外表面流下。

4. 发明授权

US09449893B2 Semiconductor module 有权
标题翻译：半导体模块
公开(公告)号：US09449893B2
公开(公告)日：2016-09-20
申请号：US13607872
申请日：2012-09-10
申请人： Shinsuke Oota
发明人： Shinsuke Oota
IPC分类号： H01L29/10 , H01L23/36 , H01L23/047 , H01L23/433 , H01L23/495 , H01L25/11
CPC分类号： H01L23/36 , H01L23/047 , H01L23/4334 , H01L23/49562 , H01L25/115 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor module includes a semiconductor chip having a switching function, a resin portion that covers the chip, terminals, and a heat dissipation portion. The resin portion includes first and second surfaces, which are opposed to each other and expand generally parallel to an imaginary plane; and a substrate is located on a first surface-side of the resin portion. The terminals project from the resin portion in a direction of the imaginary plane and are soldered onto the substrate. The heat dissipation portion is disposed on a second surface-side of the resin portion to release heat generated in the chip. One of the terminals is connected to the heat dissipation portion such that heat is transmitted from the one of the terminals to the heat dissipation portion.
摘要翻译：半导体模块包括具有开关功能的半导体芯片，覆盖芯片的树脂部分，端子和散热部分。树脂部分包括第一和第二表面，它们彼此相对并且大致平行于假想平面膨胀; 并且衬底位于树脂部分的第一表面侧上。端子从假想平面的方向从树脂部分突出并焊接到基板上。散热部设置在树脂部的第二表面侧，以释放在芯片中产生的热量。其中一个端子连接到散热部分，使得热量从一个端子传递到散热部分。

5. 发明授权

US08867222B2 Electric control device 有权
标题翻译：电控装置
公开(公告)号：US08867222B2
公开(公告)日：2014-10-21
申请号：US13202855
申请日：2010-09-27
申请人： Shinsuke Oota
发明人： Shinsuke Oota
IPC分类号： H05K5/03 , H05K5/00
CPC分类号： H05K5/0052 , B62D5/0406
摘要： An electric control device includes: an accommodation element (10) having an opening and a bottom; a cover element (20) for covering the opening of the accommodation element (10) so that accommodation space (15) is formed between the cover element (20) and the accommodation element (10); a hook (11) integrated with the accommodation element (10) for swaging the cover element (20); and a control element (30) formed in the accommodation space (15), wherein an electric element (32-35) is arranged on a substrate (31) so that the control element (30) is prepared. The substrate (31) includes a notch concavity (311) on a periphery of the substrate (31) so as to face the hook (11).
摘要翻译：电气控制装置包括：具有开口和底部的容纳元件（10）; 覆盖元件（20），用于覆盖容纳元件（10）的开口，使得容纳空间（15）形成在盖元件（20）和容纳元件（10）之间; 与所述容纳元件（10）成一体的钩（11），用于模锻所述盖元件（20）; 以及形成在所述容纳空间（15）中的控制元件（30），其中，在基板（31）上布置有电气元件（32-35），从而准备所述控制元件（30）。基板（31）在基板（31）的周围具有面向钩（11）的切口凹部（311）。

6. 发明申请

US20120039054A1 ELECTRIC CONTROL DEVICE 有权
标题翻译：电控装置
公开(公告)号：US20120039054A1
公开(公告)日：2012-02-16
申请号：US13202855
申请日：2010-09-27
申请人： Shinsuke Oota
发明人： Shinsuke Oota
IPC分类号： H05K5/03
CPC分类号： H05K5/0052 , B62D5/0406
摘要： An electric control device includes: an accommodation element (10) having an opening and a bottom; a cover element (20) for covering the opening of the accommodation element (10) so that accommodation space (15) is formed between the cover element (20) and the accommodation element (10); a hook (11) integrated with the accommodation element (10) for swaging the cover element (20); and a control element (30) formed in the accommodation space (15), wherein an electric element (32-35) is arranged on a substrate (31) so that the control element (30) is prepared. The substrate (31) includes a notch concavity (311) on a periphery of the substrate (31) so as to face the hook (11).
摘要翻译：电气控制装置包括：具有开口和底部的容纳元件（10）; 覆盖元件（20），用于覆盖容纳元件（10）的开口，使得容纳空间（15）形成在盖元件（20）和容纳元件（10）之间; 与所述容纳元件（10）成一体的钩（11），用于模锻所述盖元件（20）; 以及形成在所述容纳空间（15）中的控制元件（30），其中，在基板（31）上布置有电气元件（32-35），从而准备所述控制元件（30）。基板（31）在基板（31）的周围具有面向钩（11）的切口凹部（311）。

7. 发明授权

US08632139B2 Electric control device 有权
标题翻译：电控装置
公开(公告)号：US08632139B2
公开(公告)日：2014-01-21
申请号：US13202848
申请日：2010-09-27
申请人： Shinsuke Oota
发明人： Shinsuke Oota
IPC分类号： A47B81/00
CPC分类号： H05K5/0056 , B62D5/0406 , H05K5/0052 , H05K5/0213
摘要： An electronic control device includes: an accommodation element; a cover element; a connection element for fixing the cover element to the accommodation element; an extending protrusion extending and protruding to an outside from a contact portion between the cover element and the accommodation element; and a control element formed in the accommodation space. The extending protrusion includes a protrusion portion, which protrudes toward a bottom side or a cover element side and is formed to cover the contact portion. A clearance having predetermined dimensions is formed between the protrusion portion and one of an outer wall of the cover element and an outer wall of the accommodation element, which is near the contact portion.
摘要翻译：电子控制装置包括：容纳元件; 盖元件用于将盖元件固定到容纳元件的连接元件; 从所述盖元件和所述容纳元件之间的接触部分延伸并突出到外部的延伸突起; 以及形成在容纳空间中的控制元件。延伸突起包括突出部分，突出部分朝向底侧或覆盖元件侧突出并且形成为覆盖接触部分。具有预定尺寸的间隙形成在突出部分与覆盖元件的外壁中的一个和接触部分附近的容纳元件的外壁之间。

8. 发明授权

US08355254B2 Electronic control unit 有权
标题翻译：电子控制单元
公开(公告)号：US08355254B2
公开(公告)日：2013-01-15
申请号：US12834950
申请日：2010-07-13
申请人： Shinsuke Oota
发明人： Shinsuke Oota
IPC分类号： H05K7/20
CPC分类号： B62D5/0406 , H01L25/115 , H01L25/16 , H01L2924/0002 , H02K11/33 , H05K7/20463 , H05K7/20854 , H01L2924/00
摘要： An electronic control unit includes a circuit board, multiple circuit patterns, multiple semiconductor devices, multiple leads, and at least one thermal-conduction limiting portion. Each of the semiconductor devices is installed to the corresponding circuit pattern formed on the circuit board. Each of the leads electrically and mechanically connects each of the semiconductor devices to the corresponding circuit pattern. The thermal-conduction limiting portion, which can limit conduction of heat generated from the semiconductor devices, is placed between corresponding two of the circuit patterns.
摘要翻译：电子控制单元包括电路板，多个电路图案，多个半导体器件，多个引线和至少一个导热限制部分。每个半导体器件安装到形成在电路板上的对应电路图案。每个引线电和机械地将每个半导体器件连接到相应的电路图案。可以限制从半导体器件产生的热的传导的热传导限制部分被放置在相应的两个电路图案之间。

9. 发明申请

US20130003306A1 ELECTRONIC CONTROL UNIT AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：电子控制单元及其制造方法
公开(公告)号：US20130003306A1
公开(公告)日：2013-01-03
申请号：US13611203
申请日：2012-09-12
申请人： Shinsuke Oota , Mitsuhiro Saitou , Yutaka Oohashi
发明人： Shinsuke Oota , Mitsuhiro Saitou , Yutaka Oohashi
IPC分类号： H05K7/20
CPC分类号： H05K7/20854 , B60R16/0239 , H01L23/36 , H01L23/3677 , H01L23/4006 , H01L23/42 , H01L25/165 , H01L2924/0002 , H01L2924/19105 , H05K1/0206 , H05K3/0061 , H05K3/42 , H05K5/0082 , H05K2201/0187 , H05K2201/09054 , H05K2201/10166 , H05K2201/1056 , Y10T29/49117 , H01L2924/00
摘要： An electronic control unit is disclosed. The electronic control unit includes: a resin board; a power device that is surface-mounted on the resin board; a microcomputer that is configured to control the power device; first heat radiation means for radiating heat, the first heat radiation means being disposed on an opposite side of the resin board from the power device; and first heat conduction means for conducting the heat generated by the power device to the first heat radiation means.
摘要翻译：公开了一种电子控制单元。电子控制单元包括：树脂板; 表面安装在树脂板上的功率器件; 微型计算机，被配置为控制所述功率器件; 第一散热装置，用于散热，第一散热装置设置在树脂板与动力装置相反的一侧; 以及第一热传导装置，用于将由功率装置产生的热量传导到第一散热装置。

10. 发明申请

US20120057318A1 Electronic control unit 有权
标题翻译：电子控制单元
公开(公告)号：US20120057318A1
公开(公告)日：2012-03-08
申请号：US13199609
申请日：2011-09-02
申请人： Shinsuke Oota
发明人： Shinsuke Oota
IPC分类号： H05K7/04
CPC分类号： H05K7/20854 , H05K5/006
摘要： A resin board is fixed to a plate member made of metal by a fixing member. A semi-conductor module and a capacitor are mounted on a first surface of the resin board. A first ground pattern is formed on the fist surface and electrically connected to the plate member by means of the fixing member. A connector is also provided on the first surface such that the first ground pattern is interposed between the semi-conductor module and the connector. The heat from the semi-conductor module and the capacitor is transmitted to the plate member via the first ground pattern and the fixing member.
摘要翻译：树脂板通过固定构件固定到由金属制成的板构件。半导体模块和电容器安装在树脂板的第一表面上。在第一表面上形成第一接地图案，并通过固定构件与板构件电连接。在第一表面上还设置连接器，使得第一接地图案插入在半导体模块和连接器之间。来自半导体模块和电容器的热量经由第一接地图案和固定构件传递到板构件。

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