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    • 16. 发明授权
    • Semiconductor memory device and manufacturing method thereof
    • 半导体存储器件及其制造方法
    • US07038304B2
    • 2006-05-02
    • US10895089
    • 2004-07-21
    • Naoki Tsuji
    • Naoki Tsuji
    • H01L23/58
    • H01L27/11568H01L27/115
    • A semiconductor memory device includes: a silicon substrate having a main surface; n+ diffusion layers formed on the main surface of the silicon substrate distanced from each other; HDP oxide films formed on the n+ diffusion layers and deposited on the main surface so as to protrude above the main surface; an ONO film (a stacked film of an oxide film, a nitride film, and an oxide film) as a charge holding layer formed between the HDP oxide films; and a gate electrode (a polysilicon film and a doped polysilicon film) extending over the ONO film and the HDP oxide films.
    • 半导体存储器件包括:具有主表面的硅衬底; 形成在硅基板的主表面上的扩散层彼此间隔开; 形成在n + +扩散层上并沉积在主表面上以便在主表面上方突出的HDP氧化物膜; 作为在HDP氧化膜之间形成的电荷保持层的ONO膜(氧化膜,氮化物膜,氧化物膜的层叠膜) 以及在ONO膜和HDP氧化物膜上延伸的栅电极(多晶硅膜和掺杂多晶硅膜)。
    • 17. 发明授权
    • Semiconductor device and manufacturing method thereof
    • 半导体装置及其制造方法
    • US06682985B2
    • 2004-01-27
    • US10040633
    • 2002-01-09
    • Kojiro YuzurihaNaoki Tsuji
    • Kojiro YuzurihaNaoki Tsuji
    • H01L2176
    • H01L21/76235H01L21/31053H01L21/31055
    • A semiconductor device as well as a method of manufacturing a semiconductor device wherein a wide trench separation band is formed without causing the scooping out of the silicon substrate can be gained. The process is provided with the step of forming a multilayer film on a silicon substrate, the step of patterning the multilayer film and of etching the silicon substrate so as to create a trench, the step of forming an inner wall silicon oxide film on the inner wall surface of the trench, the step of forming a trench oxide layer so as to fill in the trench, the step of polishing the trench oxide layer through CMP polishing so as to expose the silicon nitride layer and the step of etching the trench oxide film, which has undergone the CMP polishing, by a thickness no more than the thickness of the inner wall silicon oxide film.
    • 可以获得半导体器件以及制造半导体器件的方法,其中形成宽的沟槽分离带而不会从硅衬底引出舀出。该工艺提供了在硅衬底上形成多层膜的步骤 图案化多层膜和蚀刻硅衬底以形成沟槽的步骤,在沟槽的内壁表面上形成内壁氧化硅膜的步骤,形成沟槽氧化物层的步骤,以便 填充沟槽,通过CMP抛光来研磨沟槽氧化物层以暴露氮化硅层和蚀刻已经经过CMP抛光的沟槽氧化膜的步骤,其厚度不大于厚度 的内壁氧化硅膜。