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    • 12. 发明授权
    • Semiconductor lasers
    • 半导体激光器
    • US07310358B2
    • 2007-12-18
    • US11015990
    • 2004-12-17
    • Christopher L. ChuaMichael A. KneisslPatrick Y. MaedaNoble M. JohnsonRoss D. BringansJohn E. NorthrupDavid K. Biegelsen
    • Christopher L. ChuaMichael A. KneisslPatrick Y. MaedaNoble M. JohnsonRoss D. BringansJohn E. NorthrupDavid K. Biegelsen
    • H01S3/10H01S5/00H01S3/14
    • H01S5/0425H01S5/4031H01S5/4087
    • Lasers, such as in laser structures, can include two or more semiconductor structures that are substantially identical or that include the same semiconductor material and have substantially the same geometry, such as in closely spaced dual-spot two-beam or quad-spot four-beam lasers. The lasers can also include differently structured current flow or contact structures or different wavelength control structures. For example, current flow or contact structures can be differently structured to prevent or otherwise affect phase locking, such as by causing different threshold currents and different operating temperatures. Exemplary differences include that one laser's semiconductor structure can have an isolated area that does not receive electrical current from a covering conductive layer; conductive layers of two layers can have different thicknesses or lengths; one laser can have a patterned layer with high electrical resistance between its semiconductor structure and a conductive layer; or one laser's semiconductor structure can include regions of high electrical resistance adjacent its contact structure.
    • 诸如激光结构的激光器可以包括两个或更多个半导体结构,其基本相同或包括相同的半导体材料并具有基本上相同的几何形状,例如紧密间隔的双点双光束或四点四光束, 光束激光器。 激光器还可以包括不同结构的电流或接触结构或不同的波长控制结构。 例如,电流或接触结构可以被不同地构造以防止或以其他方式影响锁相,例如通过引起不同的阈值电流和不同的工作温度。 示例性差异包括一个激光器的半导体结构可以具有不从覆盖导电层接收电流的隔离区域; 两层的导电层可以具有不同的厚度或长度; 一个激光器可以具有在其半导体结构和导电层之间具有高电阻的图案层; 或者一个激光器的半导体结构可以包括邻近其接触结构的高电阻的区域。
    • 19. 发明申请
    • Method For Controlling The Structure And Surface Qualities Of A Thin Film And Product Produced Thereby
    • 用于控制薄膜的结构和表面质量的方法以及由此产生的产品
    • US20090053845A1
    • 2009-02-26
    • US12265379
    • 2008-11-05
    • William S. WongMichael A. KneisslMark Teepe
    • William S. WongMichael A. KneisslMark Teepe
    • H01L21/18
    • H01L33/0079B82Y20/00H01L21/30621H01S5/0213H01S5/0216H01S5/0217H01S5/32341H01S5/34333
    • A system and method for providing improved surface quality following removal of a substrate and template layers from a semiconductor structure provides an improved surface quality for a layer (such as a quantum well heterostructure active region) prior to bonding a heat sink/conductive substrate to the structure. Following the physical removal of a sapphire substrate, a sacrificial coating such as a spin-coat polymer photoresist is applied to an exposed GaN surface. This sacrificial coating provides a planar surface, generally parallel to the planes of the interfaces of the underlying layers. The sacrificial coating and etching conditions are selected such that the etch rate of the sacrificial coating approximately matches the etch rate of GaN and the underlying layers, so that the physical surface profile during etching approximates the physical surface profile of the sacrificial coating prior to etching. Following etching, a substrate is bonded to the exposed surface which acts as a heat sink and may be conductive providing for backside electrical contact to the active region.
    • 在从半导体结构去除衬底和模板层之后提供改进的表面质量的系统和方法在将散热器/导电衬底接合到衬底之前为层(例如量子阱异质结构有源区)提供改进的表面质量 结构体。 在物理去除蓝宝石衬底之后,将诸如旋涂聚合物光致抗蚀剂的牺牲涂层施加到暴露的GaN表面。 该牺牲涂层提供了一般平行于下层的界面的平面的平面。 选择牺牲涂层和蚀刻条件使得牺牲涂层的蚀刻速率近似与GaN和下面的层的蚀刻速率匹配,使得蚀刻期间的物理表面轮廓近似于蚀刻之前牺牲涂层的物理表面轮廓。 在蚀刻之后,衬底被结合到作为散热器的暴露表面,并且可以是导电的,用于与有源区域的背面电接触。