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11. 发明授权

US06888344B2 Test probe for semiconductor devices, method of manufacturing of the same, and member for removing foreign matter 有权
标题翻译：用于半导体器件的测试探针，其制造方法和用于除去异物的部件
公开(公告)号：US06888344B2
公开(公告)日：2005-05-03
申请号：US10285625
申请日：2002-11-01
申请人： Shigeki Maekawa , Megumi Takemoto , Kazunobu Miki , Mutsumi Kano , Takahiro Nagata , Yoshihiro Kashiba
发明人： Shigeki Maekawa , Megumi Takemoto , Kazunobu Miki , Mutsumi Kano , Takahiro Nagata , Yoshihiro Kashiba
IPC分类号： G01R1/067 , G01R3/00 , G01R1/04
CPC分类号： G01R1/06738 , G01R1/06755 , G01R3/00
摘要： A test probe for semiconductor devices, the test probe having a tip portion which is pressed against a test pad of a semiconductor device to establish electrical contact between the tip portion and the pad for testing the operation of the semiconductor device, wherein the probe is formed to have a tip shape with an angle of not less than 15 degrees formed at the surface of the pad between a tangential line with respect to a tip face of the probe and the pad surface when the probe is pressed against the pad, the tip shape of the probe having a spherical surface meeting the relationship of: θ=cos−1(1−t/R)≧15° where the radius of curvature of the spherical surface is R, the thickness of the pad is t, and the angle formed at the pad surface between the tangential line with respect to the probe tip face and the pad surface when the probe is pressed against the pad is θ, the probe have a flat portion at an end of the tip portion. Accordingly, a contact surface can be established between the probe trip and the pad with a sufficient degree of electrical continuity, and when the the probe level is adjusted in the probing, a time required for positioning the probe prior to the start of measurement is cut down and variation in measurement are reduced.
摘要翻译：一种用于半导体器件的测试探针，所述测试探针具有被压靠在半导体器件的测试焊盘上的尖端部分，以建立所述尖端部分和所述焊盘之间的电接触，以测试所述半导体器件的操作，其中形成所述探针在探针被压靠在衬垫上时，具有相对于探针的尖端面的切线与衬垫表面之间形成有不小于15度的角度的尖端形状，具有满足以下关系的球面的探针：<？in-line-formula description =“In-line Formulas”end =“lead”？> theta = cos（1-t） / R）> = 15°<？in-line-formula description =“在线公式”end =“tail”？>其中球面的曲率半径为R，垫的厚度为t，当探针被按压时，形成在相对于探针尖端面的切线与焊盘表面之间的焊盘表面处的角度衬垫是θ，探针在尖端部分的端部具有平坦部分。因此，可以在探针跳闸和焊盘之间建立足够的电连续性的接触表面，并且当在探测中调整探针电平时，切割在测量开始之前定位探针所需的时间被切断降低了测量的变化。

12. 发明授权

US06794890B1 Test socket, method of manufacturing the test socket, test method using the test socket, and member to be tested 失效
标题翻译：测试插座，测试插座的制造方法，使用测试插座的测试方法和要测试的部件
公开(公告)号：US06794890B1
公开(公告)日：2004-09-21
申请号：US09625047
申请日：2000-07-24
申请人： Yasushi Tokumo , Shigeki Maekawa , Yoshihiro Kashiba , Shigeru Takada
发明人： Yasushi Tokumo , Shigeki Maekawa , Yoshihiro Kashiba , Shigeru Takada
IPC分类号： G01R1073
CPC分类号： G01R1/0466 , G01R1/06716 , G01R1/06738
摘要： Two resilient sections are connected to a tip end which is to be brought into contact with an external connection terminal of a contact belonging to a test socket of an electronic device or semiconductor package. The resilient sections provided opposite to each other and are bent so as to extend horizontally with respect to the tip end. The force exerted downward on the tip end is equally distributed between the plurality of resilient sections. The resilient sections are eventually deflected downwardly without involvement of horizontal sliding action. The force which is exerted on the tip end in reaction to the downward deflection of the curved portions brings the tip end into pressing contact with the external connection terminal without involvement of horizontal sliding action of the tip end with respect to the external connection terminal.
摘要翻译：两个弹性部分连接到要与属于电子装置或半导体封装的测试插座的触点的外部连接端子接触的尖端。弹性部分彼此相对设置并弯曲成相对于尖端水平延伸。向下施加在尖端上的力均等地分布在多个弹性部分之间。弹性部分最终向下偏转而不涉及水平滑动作用。与弯曲部分的向下偏转相对应地施加在尖端上的力使得尖端与外部连接端子压接，而不会引起尖端相对于外部连接端子的水平滑动。

13. 发明申请

US20050145842A1 Socket for testing a semiconductor device and a connecting sheet used for the same 审中-公开
标题翻译：用于测试半导体器件的插座和用于其的连接片
公开(公告)号：US20050145842A1
公开(公告)日：2005-07-07
申请号：US11057468
申请日：2005-02-15
申请人： Shigeki Maekawa , Yoshihiro Kashiba
发明人： Shigeki Maekawa , Yoshihiro Kashiba
IPC分类号： G01R31/26 , G01R1/04 , G01R31/02 , H01L23/58
CPC分类号： G01R1/0483
摘要： Probes 1 for testing and outer connecting terminals 14a are electrically connected to a-test socket for semiconductor devices. In use of a connecting sheet, fabricated by an elastically deformative insulating member and electrodes 202, flexibility is given, and good electrical contacts are obtainable. Further, because the connecting sheet 2 is exchangeable, contacting capability is recovered by exchange when solder debris is adhered and deposited to increase contact resistances. Accordingly, even though there is scattering of the heights of the outer connecting terminals, good electrical contact with the probes is obtainable, and even though the solder debris of the outer connecting terminals is adhered and deposited as a result of repeated usage, tests can be continuously conducted, wherein the test socket for semiconductor devices has good maintenance capability.
摘要翻译：用于测试的探针1和外部连接端子14a电连接到用于半导体器件的测试插座。在使用通过弹性变形绝缘构件和电极202制造的连接片材的情况下，给出柔性，并且可以获得良好的电接触。此外，由于连接片2是可交换的，所以当焊料残渣被附着和沉积以增加接触电阻时，通过交换来回收接触能力。因此，即使存在外部连接端子的高度的散射，也可以获得与探针的良好的电接触，并且即使由于重复使用而使外部连接端子的焊料残渣粘附和沉积，也可以是连续进行，其中半导体器件测试插座具有良好的维护能力。

14. 发明授权

US06882069B1 Vehicle AC generator with rectifier diode package disposed between cooling plates 有权
标题翻译：车载交流发电机，整流二极管封装设置在冷却板之间
公开(公告)号：US06882069B1
公开(公告)日：2005-04-19
申请号：US09705792
申请日：2000-11-06
申请人： Toshiaki Kashihara , Yoshihiro Kashiba , Shigeki Maekawa
发明人： Toshiaki Kashihara , Yoshihiro Kashiba , Shigeki Maekawa
IPC分类号： H02K9/06 , H01L23/433 , H01L25/11 , H02K9/28 , H02K11/04 , H02K19/22 , H02K19/36
CPC分类号： H02K11/046 , H01L23/4334 , H01L23/49562 , H01L24/33 , H01L25/074 , H01L25/115 , H01L2224/29111 , H01L2224/32245 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/12036 , H01L2924/15747 , H01L2924/181 , H01L2924/00 , H01L2924/00012
摘要： A vehicle AC generator having a rectifier unit with cooling plates for the positive-electrode and negative-electrode sides, each having principal planes opposing each other; and a diode package disposed between the cooling plates for the positive-electrode and negative-electrode sides. The diode package has a base for the positive-electrode side formed of a metallic plate and joined to a cathode face of the unidirectionally conducting element for the positive-electrode side; a base for the negative-electrode side formed of a metallic plate and joined to an anode face of the unidirectionally conducting element for the negative-electrode side; and an insulating resin provided so that the unidirectionally conducting elements for the positive-electrode and negative-electrode sides are embedded therein. The end face of the base for the positive-electrode side is joined to the principal plane of the cooling plate for the positive-electrode side while the end face of the base for the negative-electrode side is joined to the principal plane of the cooling plate for the negative-electrode side.
摘要翻译：一种车辆用交流发电机，具有整流单元，具有用于正极侧和负极侧的冷却板，各自具有彼此相对的主面。以及设置在用于正极和负极侧的冷却板之间的二极管封装。二极管封装具有由金属板形成的正极侧的基底，并与正极侧的单向导电元件的阴极面接合; 由负极侧形成的负极侧的基底，与负极侧的单向导电元件的阳极面接合; 以及设置成使得用于正极和负极侧的单向导电元件嵌入其中的绝缘树脂。用于正电极侧的基座的端面与用于正极侧的冷却板的主平面接合，而用于负极侧的基座的端面连接到冷却的主平面负极侧。

15. 发明授权

US06989681B2 Socket for testing a semiconductor device and a connecting sheet used for the same 失效
标题翻译：用于测试半导体器件的插座和用于其的连接片
公开(公告)号：US06989681B2
公开(公告)日：2006-01-24
申请号：US10659281
申请日：2003-09-11
申请人： Shigeki Maekawa , Yoshihiro Kashiba
发明人： Shigeki Maekawa , Yoshihiro Kashiba
IPC分类号： G01R31/02
CPC分类号： G01R1/0483
摘要： Probes 1 for testing and outer connecting terminals 14a are electrically connected to a test socket for semiconductor devices. In use of a connecting sheet, fabricated by an elastically deformative insulating member and electrodes 202, flexibility is given, and good electrical contacts are obtainable. Further, because the connecting sheet 2 is exchangeable, contacting capability is recovered by exchange when solder debris is adhered and deposited to increase contact resistances. Accordingly, even though there is scattering of the heights of the outer connecting terminals, good electrical contact with the probes is obtainable, and even though the solder debris of the outer connecting terminals is adhered and deposited as a result of repeated usage, tests can be continuously conducted, wherein the test socket for semiconductor devices has good maintenance capability.
摘要翻译：用于测试的探针1和外部连接端子14a被电连接到用于半导体器件的测试插座。在使用通过弹性变形绝缘构件和电极202制造的连接片材的情况下，给出柔性，并且可以获得良好的电接触。此外，由于连接片2是可交换的，所以当焊料残渣被附着和沉积以增加接触电阻时，通过交换来回收接触能力。因此，即使存在外部连接端子的高度的散射，也可以获得与探针的良好的电接触，并且即使由于重复使用而使外部连接端子的焊料残渣粘附和沉积，也可以是连续进行，其中半导体器件测试插座具有良好的维护能力。

16. 发明授权

US07112976B2 Test socket, method of manufacturing the test socket, test method using the test socket, and member to be tested 失效
标题翻译：测试插座，测试插座的制造方法，使用测试插座的测试方法和要测试的部件
公开(公告)号：US07112976B2
公开(公告)日：2006-09-26
申请号：US10842554
申请日：2004-05-11
申请人： Yasushi Tokumo , Shigeki Maekawa , Yoshihiro Kashiba , Shigeru Takada
发明人： Yasushi Tokumo , Shigeki Maekawa , Yoshihiro Kashiba , Shigeru Takada
IPC分类号： G01R1/067
CPC分类号： G01R1/0466 , G01R1/06716 , G01R1/06738
摘要： Two resilient sections are connected to a tip end which is to be brought into contact with an external connection terminal of a contact belonging to a test socket of an electronic device or semiconductor package. The resilient sections provided opposite to each other and are bent so as to extend horizontally with respect to the tip end. The force exerted downward on the tip end is equally distributed between the plurality of resilient sections. The resilient sections are eventually deflected downwardly without involvement of horizontal sliding action. The force which is exerted on the tip end in reaction to the downward deflection of the curved portions brings the tip end into pressing contact with the external connection terminal without involvement of horizontal sliding action of the tip end with respect to the external connection terminal.
摘要翻译：两个弹性部分连接到要与属于电子装置或半导体封装的测试插座的触点的外部连接端子接触的尖端。弹性部分彼此相对设置并弯曲成相对于尖端水平延伸。向下施加在尖端上的力均等地分布在多个弹性部分之间。弹性部分最终向下偏转而不涉及水平滑动作用。与弯曲部分的向下偏转相对应地施加在尖端上的力使得尖端与外部连接端子压接，而不会引起尖端相对于外部连接端子的水平滑动。

17. 发明授权

US5972069A Metallic material made from tungsten or molybdenum, method of producing the metallic material, and secondary product material using the metallic material 失效
标题翻译：由钨或钼制成的金属材料，金属材料的制造方法以及使用金属材料的二次制品
公开(公告)号：US5972069A
公开(公告)日：1999-10-26
申请号：US120367
申请日：1998-07-22
申请人： Shigeki Maekawa , Megumi Takemoto
发明人： Shigeki Maekawa , Megumi Takemoto
IPC分类号： B23H7/24 , B22F3/24 , C22C1/04 , C22C27/04 , C22F1/18 , C23C14/34 , H01K1/08 , C22C1/09
CPC分类号： H01K1/08 , C22C1/045 , C22F1/18 , C23C14/3414 , B22F2998/00 , B22F2998/10
摘要： A primary product comprising tungsten or molybdenum accommodated in a container 1 is heated at 500.degree. C. with 1000 atmospheric pressure in an Ar gas atmosphere and retained for 1 hour. According to the present invention, the crystal orientation in the (110) face can be 99% or more, and thus a material with a good electron radiation characteristic can be obtained.
摘要翻译：容纳在容器1中的包含钨或钼的初级产物在Ar气氛中在1000℃大气压下在500℃下加热并保持1小时。根据本发明，（110）面中的晶体取向可以为99％以上，因此可以获得具有良好电子辐射特性的材料。

18. 发明授权

US5433262A Method for manufacturing casting and apparatus for manufacturing a casting 失效
标题翻译：铸件的制造方法以及铸件的制造装置
公开(公告)号：US5433262A
公开(公告)日：1995-07-18
申请号：US22657
申请日：1993-03-01
申请人： Kenji Kawaguchi , Mikio Yamashita , Shigeki Maekawa
发明人： Kenji Kawaguchi , Mikio Yamashita , Shigeki Maekawa
IPC分类号： B22D17/12 , B22D17/00 , B22D17/22 , B22D17/32 , B22D18/02 , F04C18/02 , B22D27/11
CPC分类号： B22D17/00 , F04C18/0246
摘要： A process and an apparatus for manufacturing a cast product in which the cavity 2c is defined by a top die 1, a bottom die 2 and a slidable die insert 11 relative to the top die 1 and a pressure is applied to the die insert 11 by a hydraulic cylinder 13 before casting, injecting a molten metal 6 at a pressure higher than that on the die insert 11 to cause the die insert 11 to move rearward, whereby the molten metal 6 is additionally filled in the cavity 2c by an amount corresponding to the shrinkage due to pressurization, and a pressure on the molten metal 6 within the cavity 2c is maintained through the die insert 11 even after the molten metal 6 in the gate 2b has been solidified and the injection pressure has: not been transmitted anymore.
摘要翻译：用于制造铸造产品的工艺和装置，其中腔2c由顶模1，底模2和相对于顶模1的可滑动模插入件11限定，并且压力通过在铸造之前的液压缸13，以比模具插入件11上的压力更高的压力喷射熔融金属6，使模具插入件11向后移动，从而将熔融金属6另外填充在空腔2c中相当于即使在栅极2b中的熔融金属6已经固化并且注入压力已经不再传输之后，由于加压引起的收缩和腔体2c内的熔融金属6上的压力也被保持通过模插件11。

19. 发明授权

US07534979B2 Pressure-contact type rectifier with contact friction reducer 有权
标题翻译：带接触式减摩器的压接式整流器
公开(公告)号：US07534979B2
公开(公告)日：2009-05-19
申请号：US10585351
申请日：2004-05-14
申请人： Shinichi Ito , Shigeki Maekawa , Hiroya Ikuta , Shigeharu Nagai , Toshiaki Kashihara , Shinji Iwamoto , Takahiro Sonoda
发明人： Shinichi Ito , Shigeki Maekawa , Hiroya Ikuta , Shigeharu Nagai , Toshiaki Kashihara , Shinji Iwamoto , Takahiro Sonoda
IPC分类号： H05B1/02
CPC分类号： H01L24/01 , H01L23/051 , H01L24/72 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/07802 , H01L2924/13091 , H01L2924/00
摘要： An objective is to provide a pressure-contact type rectifier in which solder that increases the environmental load is not used, and neither burning nor breakage of a rectifying device occurs, even if temperature of the rectifying device increases due to current flowing or force towards outside the rectifying device is applied to a lead end, etc. By providing an electrically conductive friction reducer on at least one electrode face of the rectifying device, the temperature increase can be prevented, and the friction at the contact face can be reduced. Moreover, by providing a flexible portion on the lead end outside a cap, and fixing the flexible portion to the cap, the contact area between the lead and the rectifying device can be kept constant. As a result, a pressure-contact type rectifier in which neither burning nor breakage of the rectifying device occurs can be obtained.
摘要翻译：目的是提供一种不使用增加环境负荷的焊料的压力接触式整流器，即使整流装置的温度由于电流流动或朝向外部的力而升高，也不会发生整流装置的燃烧或破损整流装置被施加到引线端等。通过在整流装置的至少一个电极面上设置导电摩擦减小器，可以防止温度升高，并且可以减小接触面处的摩擦。此外，通过在帽的外部的引线端设置柔性部分，并且将柔性部分固定到盖上，引线和整流装置之间的接触面积可以保持恒定。结果，可以获得不会发生整流装置的烧灼或破损的压接式整流器。

20. 发明授权

US06344753B1 Test socket having improved contact terminals, and method of forming contact terminals of the test socket 失效
标题翻译：具有改进的接触端子的测试插座和形成测试插座的接触端子的方法
公开(公告)号：US06344753B1
公开(公告)日：2002-02-05
申请号：US09480945
申请日：2000-01-11
申请人： Shigeru Takada , Yasushi Tokumo , Shigeki Maekawa , Keiko Kaneko
发明人： Shigeru Takada , Yasushi Tokumo , Shigeki Maekawa , Keiko Kaneko
IPC分类号： G01R3102
CPC分类号： H05K7/1023 , G01R1/0466 , G01R1/06727 , G01R1/06738
摘要： On each of the contact terminals of a test socket, one or more contact projections having a radius of curvature within a specified range, such as 0.03 to 0.3 mm, are formed in the portion of the contact terminals which contacts the corresponding external connection terminal of an electronic device. Further, a plurality of protuberances and recesses are formed on the surface of the contact projection, and each of the protuberances is formed to assume a substantially spherical surface having a radius of curvature of 2 to 15 microns. The test socket is for use in testing an electrical characteristics of an electronic device or a semiconductor package, and stable electrical contact is ensured between contact terminals of the test socket and external connection terminals of an electronic device or a semiconductor package.
摘要翻译：在测试插座的每个接触端子上，在接触端子的与相应的外部连接端子接触的部分中形成一个或多个具有在指定范围内的曲率半径例如0.03至0.3mm的接触突起，电子设备。此外，在接触突起的表面上形成多个突起和凹部，并且每个突起形成为具有2至15微米的曲率半径的基本上球形的表面。测试插座用于测试电子设备或半导体封装的电气特性，并且确保测试插座的接触端子与电子设备或半导体封装的外部连接端子之间的稳定的电接触。

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