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11. 发明专利

JPH10238952A REFLOW EQUIPMENT 失效
公开(公告)号：JPH10238952A
公开(公告)日：1998-09-11
申请号：JP3767697
申请日：1997-02-21
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： ABE TOSHIHIRO , MATSUMOTO KUNIYO , NONOMURA MASARU , CHIKAHISA NAOICHI
IPC分类号： F27B9/12 , F27B9/40 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide reflow equipment provided with a cooling part that cools the heated printed board for reflow soldering at any cooling speed. SOLUTION: The cooling part 2a of the reflow equipment is provided with a blower fan 5 and a cooler 6 for cooling printed boards 10 transferred from a heating part. The air blown by the blower fan 5 is cooled by the cooler 6, blown to the printed circuit boards and circulated inside a cooling part 2a. The cooling temperature is detected by a thermocouple 7 and according to the difference between the detected temperature and the predetermined cooling temperature being set based on the kinds of the printed boards 10 and the producing conditions, the blowing volume of the blower fan 5 and the cooling capacity of the cooler 6 are controlled.

12. 发明专利

JPH0775868A WAVE SOLDERING DEVICE 失效
公开(公告)号：JPH0775868A
公开(公告)日：1995-03-20
申请号：JP22005093
申请日：1993-09-03
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： INOMATA AKIO , MATSUMOTO KUNIYO , IKEDA OSAMU , ABE TOSHIHIRO
IPC分类号： B23K1/08 , B23K3/06 , H05K3/34
摘要： PURPOSE:To improve the cleanliness of the molten solder by suppressing the activation of the oxidizing reaction by the wave solder on the surface of the molten solder, and suppressing the quantity of produced unclean substance such as oxides to be deposited on the surface of the molten solder. CONSTITUTION:The cleanliness of the molten solder can be improved by providing wave solder receiving parts 12, 13 of the waved molten solder on a waving nozzle 11 of the molten solder, and flowing the molten solder in the horizontal direction with the speed of the molten solder in the vertical direction being zero to suppress the oxidizing reaction of the wave solder in a soldering tank 1 and suppress the quantity of oxide to be produced.

13. 发明专利

JP2000188465A HEATING DEVICE AND METHOD 失效
公开(公告)号：JP2000188465A
公开(公告)日：2000-07-04
申请号：JP29095199
申请日：1999-10-13
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： NONOMURA MASARU , ABE TOSHIHIRO , NAGAFUKU NOBUYASU , MATSUMOTO KUNIYO
IPC分类号： H05K3/34
摘要： PROBLEM TO BE SOLVED: To reduce power consumption when the heat treatment to a body to be joined is not required by reducing the amount of gas supply heat when the heat treatment of an object to be heated is not required as compared with a case when the heat treatment is required by a device for controlling the amount of gas supply heat. SOLUTION: A circuit substrate 2 that is a body to be joined where parts 2a are placed on cream solder is carried from an inlet to an outlet by a transport part 3. The transport part 3 is contained and a heating gas is supplied via a heater 9c. A heating chamber 7a is provided for supplying a gas with a specific flow rate and temperature onto the body to be joined as a heat source and for heating and melting an object to be heated such as solder on the body to be joined. In the starting/preparing process of a reflow device, the temperature of heated air in each chamber is controlled by controlling the heater 9c via a temperature controller 20 with a controller 21 that is joined to a temperature-monitoring sensor 17c corresponding to the heat content of the circuit substrate 2. When the circuit substrate 2 is not subjected to reflow treatment, the temperature of each chamber is maintained at a lower temperature than a specific heat-treatment temperature.

14. 发明专利

JPH10200254A HOT AIR HEATER AND HEATING METHOD 失效
公开(公告)号：JPH10200254A
公开(公告)日：1998-07-31
申请号：JP46697
申请日：1997-01-07
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： SAITO SUSUMU , MATSUMOTO KUNIYO , ABE TOSHIHIRO
IPC分类号： B23K1/008 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a hot air heater and a heating method in which difference of the temperature can be caused between both surfaces of a printed board and the temperature difference is set in conformity to the kind of substrate. SOLUTION: Hot air generating devices 8a and 9a are provided on both sides of a transporting path 2 with which a printed board 1 is transported. The printed board 1 is blown with the hot air generated by the hot air generating devices 8a and 9a, and a part of the blown air is circulated in respective casing. At least either one of the hot air generating devices 8a and 9a is provided with an external air mixing means which takes external air in the casing to mix with circulated air flow in the casing.

15. 发明专利

JPH07254776A FLUX APPLYING DEVICE 失效
公开(公告)号：JPH07254776A
公开(公告)日：1995-10-03
申请号：JP4404994
申请日：1994-03-15
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： INOMATA AKIO , IKEDA OSAMU , MATSUMOTO KUNIYO , ABE TOSHIHIRO
IPC分类号： B23K3/00 , H05K3/34
摘要： PURPOSE:To enable the flux coating requirements corresponding to the width directional dimension of printed board to be selected while enabling the whole surface of the printed board to be evenly and economically coated with the flux. CONSTITUTION:The dimension in the width direction of a printed board 3 is computed by the mutual interval between a pair of rails 6a, 6b arrayed in parallel two lines for guiding a pair of carrier conveyers 4a, 4b holding to carry both ends in the width direction of a printed board 3. On the other hand, a flux nozzle 1 is fitted to a shifting base 2 reciprocative in the intersecting direction to the carrier direction of the carrier conveyers 4a, 4b. In such a constitution, when the specific position of the central position, etc., is computed by the calculated value, the shifting base 2 is shifted to stop the nozzle 1 beneath the specific position for jetting the flux.

16. 发明专利

JPH04171791A HEATING DEVICE 失效
公开(公告)号：JPH04171791A
公开(公告)日：1992-06-18
申请号：JP29775090
申请日：1990-11-02
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： SAITO SUSUMU , ABE TOSHIHIRO , MATSUDA CHUICHI
IPC分类号： B65G17/18 , B23K1/00 , B23K3/04 , H05K3/34
摘要： PURPOSE:To eliminate the occurrence of smoking and fire by preventing boards from staying in a reflow device by more increasing a link plate width of a side pin equipped chain for carrying the board than the pitch of the side pin. CONSTITUTION:The width of a link plate 9 of a carrying chain used for a heating device is more increased than the pitches P of side pins 8 of the carrying chain. Thereupon, the step difference between the surface for carrying a printed circuit board and a link plate 9 end surface is set to be 5mm or more and the pin pitches P set 12.7mm or below. Hereby, even if the board is sharply warped with the amount of the warp being about 5mm, the board is prevented from touching a guide rail 10 beyond the link plate 9 of the carrying chain and hence from staying in the device.

17. 发明专利

JP2001326455A METHOD AND DEVICE FOR REFLOW 失效
公开(公告)号：JP2001326455A
公开(公告)日：2001-11-22
申请号：JP2000141471
申请日：2000-05-15
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： ABE TOSHIHIRO , NONOMURA MASARU , CHIKAHISA NAOICHI
IPC分类号： B23K1/00 , B23K1/008 , B23K3/04 , B23K101/42 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a reflow method and a reflow device which can reduce temperature dispersion of a circuit substrate by reducing stagnation of hot air when spraying hot air for heating to a circuit board, and perform good reflow treatment even for lead-free solder. SOLUTION: A circuit board 2, whereon an electronic component is mounted and wherein cream solder is applied to a junction position of an electronic component, is carried inside a furnace, and reflow soldering is carried out by spraying hot air toward the circuit board 2 from a plurality of pipe nozzles 42 disposed at a prescribed interval. At that time, a plurality of hot air spraying points by the pipe nozzle 42 are scattered plane to the circuit board 2, and the sprayed hot air is circulated inside a furnace through a flow path formed by a space between disposed pipe nozzles after rebounding from the circuit board 2.

18. 发明专利

JP2000188467A APPARATUS AND METHOD FOR HEATING 失效
公开(公告)号：JP2000188467A
公开(公告)日：2000-07-04
申请号：JP29097499
申请日：1999-10-13
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： SASAKI MASARU , NONOMURA MASARU , ABE TOSHIHIRO
IPC分类号： B23K1/00 , B23K1/008 , B23K1/012 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide an apparatus and a method in which power consumption is reduced and in which a circuit board can be heated stably to a prescribed temperature. SOLUTION: This heating apparatus is provided with a conveyance part 3 which conveys a circuit board 2 on which an electronic component 2a is mounted. In addition, it is provided with preheating chambers 6a, 6b and heating chambers 7a, 7b adjacent to one another in which the conveyance part 3 is contained, in which solder for reflow is heated on the circuit board 2 and melted or in which an adhesive for electronic-component fixation is hardened. In addition, it is provided with a cooling chamber 8 which is adjacent to the rear part in the conveyance direction of the heating chamber 7b, and in which the molten solder for reflow is cooled and solidified. In addition, it is provided with at least one, out of shielding plates 217a, 217b, which is situated just above rail parts 16a, 16b in the conveyance part 3 and which is situated in the boundary between the respective chambers.

19. 发明专利

JPH04169785A HEATER 失效
公开(公告)号：JPH04169785A
公开(公告)日：1992-06-17
申请号：JP29774990
申请日：1990-11-02
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： ABE TOSHIHIRO , SAITO SUSUMU , MATSUDA CHUICHI
IPC分类号： B23K1/008 , B23K3/04 , F27B9/36 , F27B9/40 , H02J9/00 , H05K3/34
摘要： PURPOSE:To prevent smoking, ignition in a heater by providing a power interruption detector and an auxiliary power source in the heater, driving a printed board conveyor by the power source, and conveying out a printed board out of the heater. CONSTITUTION:If a printed board 6 conveyed by a printed board conveyor 7 remains in a heater due to power interruption, a power interruption detector 3 detects power interruption, and switches an outer power source 5 to an auxiliary power source 4. Power is supplied to a driving motor 10 of the conveyor 7 by the power source 4 to drive the conveyor 7, thereby conveying out the board 6 in the heater.

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