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11. 发明授权

US06864568B2 Packaging device for holding a plurality of semiconductor devices to be inspected 失效
标题翻译：用于保持待检查的多个半导体器件的封装装置
公开(公告)号：US06864568B2
公开(公告)日：2005-03-08
申请号：US10252546
申请日：2002-09-24
申请人： Ryuji Kohno , Hiroya Shimizu , Masatoshi Kanamaru , Atsushi Hosogane , Toshio Miyatake , Hideo Miura , Tatsuya Nagata , Yoshishige Endo , Masaaki Namba , Yuji Wada
发明人： Ryuji Kohno , Hiroya Shimizu , Masatoshi Kanamaru , Atsushi Hosogane , Toshio Miyatake , Hideo Miura , Tatsuya Nagata , Yoshishige Endo , Masaaki Namba , Yuji Wada
IPC分类号： G01R31/26 , G01R1/04 , G01R1/073 , H01L21/66 , H01L23/02
CPC分类号： G01R1/0483 , H01L2924/0002 , H01L2924/00
摘要： A packaging device for holding thereon a plurality of semiconductor devices to be inspected on an inspection device including a probe to be electrically connected to an electrode of each of the semiconductor devices, comprises, holes for respectively receiving detachably therein the semiconductor devices to keep a positional relationship among the semiconductor devices and a positional relationship between the packaging device and each of the semiconductor devices constant with a spacing between the semiconductor devices, in a direction perpendicular to a thickness direction of the semiconductor devices, and electrically conductive members adapted to be connected respectively to the electrodes of the semiconductor devices, and extending to an exterior of the packaging device so that the probe is connected to each of the electrically conductive members.
摘要翻译：一种用于在其上保持要检查的多个待检查的半导体器件的封装装置，包括：电连接到每个半导体器件的电极的探针，包括：用于分别接收半导体器件中的可分离地接收的孔，以保持位置半导体器件之间的关系以及在与半导体器件的厚度方向垂直的方向上半导体器件之间的间隔恒定的封装器件和每个半导体器件之间的位置关系以及适于分别连接的导电部件并且延伸到包装装置的外部，使得探针连接到每个导电构件。

12. 发明授权

US06465264B1 Method for producing semiconductor device and apparatus usable therein 失效
标题翻译：用于制造半导体器件的方法和可用于其中的装置
公开(公告)号：US06465264B1
公开(公告)日：2002-10-15
申请号：US09654612
申请日：2000-09-01
申请人： Ryuji Kohno , Hiroya Shimizu , Masatoshi Kanamaru , Atsushi Hosogane , Toshio Miyatake , Hideo Miura , Tatsuya Nagata , Yoshishige Endo , Masaaki Namba , Yuji Wada
发明人： Ryuji Kohno , Hiroya Shimizu , Masatoshi Kanamaru , Atsushi Hosogane , Toshio Miyatake , Hideo Miura , Tatsuya Nagata , Yoshishige Endo , Masaaki Namba , Yuji Wada
IPC分类号： G01R3126
CPC分类号： G01R1/0483 , H01L2924/0002 , H01L2924/00
摘要： A packaging device for holding thereon a plurality of semiconductor devices to be inspected on an inspection device including a probe to be electrically connected to an electrode of each of the semiconductor devices, comprises, holes for respectively receiving detachably therein the semiconductor devices to keep a positional relationship among the semiconductor devices and a positional relationship between the packaging device and each of the semiconductor devices constant with a spacing between the semiconductor devices, in a direction perpendicular to a thickness direction of the semiconductor devices, and electrically conductive members adapted to be connected respectively to the electrodes of the semiconductor devices, and extending to an exterior of the packaging device so that the probe is connected to each of the electrically conductive members.
摘要翻译：一种用于在其上保持要检查的多个待检查的半导体器件的封装装置，包括：电连接到每个半导体器件的电极的探针，包括：用于分别接收半导体器件中的可分离地接收的孔，以保持位置半导体器件之间的关系以及在与半导体器件的厚度方向垂直的方向上半导体器件之间的间隔恒定的封装器件和每个半导体器件之间的位置关系以及适于分别连接的导电部件并且延伸到包装装置的外部，使得探针连接到每个导电构件。

13. 发明授权

US06496023B1 Semiconductor-device inspecting apparatus and a method for manufacturing the same 失效
标题翻译：半导体装置检查装置及其制造方法
公开(公告)号：US06496023B1
公开(公告)日：2002-12-17
申请号：US09722484
申请日：2000-11-28
申请人： Masatoshi Kanamaru , Yoshishige Endo , Takanorr Aono , Ryuji Kohno , Toshio Miyatake , Hideyuki Aoki , Naoto Ban
发明人： Masatoshi Kanamaru , Yoshishige Endo , Takanorr Aono , Ryuji Kohno , Toshio Miyatake , Hideyuki Aoki , Naoto Ban
IPC分类号： G01R3102
CPC分类号： G01R1/07357 , Y10S977/874
摘要： A structure is provided such that a plural cantilevers are formed on a first board formed of silicon, probes are respectively formed on the individual cantilevers at positions each offset perpendicularly to a longitudinal center line of the cantilever, and wiring connected continuously from each probe to a secondary electrode pad portion through an insulating layer. A structure is alternatively adopted such that by using a both-ends supported beam formed of silicon as the beam, each probe is formed at a position offset toward a supported portion side of the both-ends supported beam.
摘要翻译：提供一种结构，使得在由硅形成的第一板上形成多个悬臂，在各个悬臂分别在垂直于悬臂的纵向中心线偏移的位置处形成探针，并且从每个探针连续连接到每个探针次级电极焊盘部分穿过绝缘层。可替代地采用结构，使得通过使用由硅形成的两端支撑梁作为梁，每个探针形成在朝向两端支撑梁的支撑部分侧偏移的位置。

14. 发明授权

US06774654B2 Semiconductor-device inspecting apparatus and a method for manufacturing the same 失效
标题翻译：半导体装置检查装置及其制造方法
公开(公告)号：US06774654B2
公开(公告)日：2004-08-10
申请号：US10316828
申请日：2002-12-12
申请人： Masatoshi Kanamaru , Yoshishige Endo , Takanorr Aono , Ryuji Kohno , Toshio Miyatake , Hideyuki Aoki , Naoto Ban
发明人： Masatoshi Kanamaru , Yoshishige Endo , Takanorr Aono , Ryuji Kohno , Toshio Miyatake , Hideyuki Aoki , Naoto Ban
IPC分类号： G01R3102
CPC分类号： G01R1/07357 , Y10S977/874
摘要： A semiconductor inspecting apparatus having a plurality of electrical connection boards arranged in the inspecting apparatus and a plurality of probes respectively provided on a plurality of beams formed on a first board of said plurality of electrical connection boards, the probes being adapted to be individually brought into contact with a plurality of electrode pads of a semiconductor device for inspection, so as to inspect the semiconductor device while establishing electrical connection therebetween. A one-end supported beam is used as each of the beams, and each of the probes is formed at a portion shifted in a rectangular direction to a center line of a longitudinal direction of the one-end supported beam.
摘要翻译：一种具有布置在检查装置中的多个电连接板和分别设置在形成在所述多个电连接板的第一板上的多个梁上的多个探针的半导体检查装置，所述探针适于单独地进入与用于检查的半导体器件的多个电极焊盘接触，以便在其间建立电连接的同时检查半导体器件。使用一端支撑梁作为每个梁，并且每个探针形成在沿着矩形方向偏移到一端支撑梁的纵向方向的中心线的部分。

15. 发明授权

US06864695B2 Semiconductor device testing apparatus and semiconductor device manufacturing method using it 失效
标题翻译：半导体器件测试装置及其使用的半导体器件制造方法
公开(公告)号：US06864695B2
公开(公告)日：2005-03-08
申请号：US09925375
申请日：2001-08-10
申请人： Ryuji Kohno , Hideo Miura , Masatoshi Kanamaru , Hiroya Shimizu , Naoto Ban
发明人： Ryuji Kohno , Hideo Miura , Masatoshi Kanamaru , Hiroya Shimizu , Naoto Ban
IPC分类号： G01R1/073 , G01R3/00 , G01R31/28 , H01L21/66 , G01R31/02
CPC分类号： G01R3/00 , G01R1/07357
摘要： Since each wiring line is formed on one surface of the associated beam at a prescribed width over the entire length of the beam, the beam has the same sectional shape taken in the width direction at any point along an arbitrary longitudinal direction of the beam. As a result, the second moment of area, which is determined by the shapes of the beam and the wiring line, is uniform. This prevents a problem of the curvature of a beam varying locally when the beam is bent by a prescribed amount due to contact of the probe with a pad of a subject body. This, in turn, prevents local concentration of stress in the beams and thereby prevents breakage of the beam. Therefore, the probe structure can be miniaturized while the strength of the beams is kept at a required level, whereby a semiconductor device testing apparatus capable of accommodating many probes can be realized.
摘要翻译：由于每个布线在波束的整个长度上以规定的宽度形成在相关联的光束的一个表面上，所以光束在沿着光束的任意纵向方向的任何点处具有在宽度方向上取下的截面形状。结果，由光束和布线的形状确定的面积的第二时刻是均匀的。这防止了当由于探针与被检体的垫接触而使光束弯曲预定量时局部变化的光束曲率的问题。这反过来又防止梁中的局部应力集中，从而防止梁的断裂。因此，能够将光束的强度保持在所要求的水平，能够使探头结构小型化，能够实现容纳多个探针的半导体装置的测试装置。

16. 发明授权

US06828810B2 Semiconductor device testing apparatus and method for manufacturing the same 失效
标题翻译：半导体器件测试装置及其制造方法
公开(公告)号：US06828810B2
公开(公告)日：2004-12-07
申请号：US10207145
申请日：2002-07-30
申请人： Masatoshi Kanamaru , Yoshishige Endo , Takanori Aono , Ryuji Kohno , Hiroya Shimizu , Naoto Ban , Hideyuki Aoki
发明人： Masatoshi Kanamaru , Yoshishige Endo , Takanori Aono , Ryuji Kohno , Hiroya Shimizu , Naoto Ban , Hideyuki Aoki
IPC分类号： G01R3102
CPC分类号： G01R1/0466
摘要： A semiconductor device testing apparatus is realized, which allows contactors to be positioned throughout the wafer surface highly accurately for uniform contact, testing a large-sized wafer, and cost reduction. A plurality of divided contactor blocks is formed with a positioning groove. The groove is used to position the plurality of contactor blocks with a positioning frame. Because the contactor blocks are divided into plurals, it is less likely that a partial surface distortion affects other portions to impair surface flatness as compared with the case where a plurality of non-divided contactors is formed integrally, and the plurality of contactor blocks can be brought into contact with a wafer to be tested uniformly. Additionally, even though abnormality is generated in a part of the contactor blocks, only the part of the contactor blocks is replaced. Therefore, replacement costs can be reduced as compared with the case where a plurality of non-divided contactors is formed integrally.
摘要翻译：实现半导体器件测试装置，其允许接触器高精度地定位在整个晶片表面，用于均匀接触，测试大尺寸晶片以及降低成本。多个分开的接触器块形成有定位槽。凹槽用于定位具有定位框架的多个接触器块。由于接触器块被分成多个，与多个非分隔接触器形成为一体的情况相比，部分表面变形对其他部分的影响较小可能损害表面平坦度，并且多个接触器块可以与待测试的晶片均匀接触。此外，即使在接触器块的一部分中产生异常，仅更换接触器块的一部分。因此，与多个非分割接触器一体形成的情况相比，可以降低更换成本。

17. 发明授权

US06955870B2 Method of manufacturing a semiconductor device 失效
标题翻译：制造半导体器件的方法
公开(公告)号：US06955870B2
公开(公告)日：2005-10-18
申请号：US10274422
申请日：2002-10-17
申请人： Ryuji Kohno , Hideo Miura , Masatoshi Kanamaru , Hiroya Shimizu , Hideyuki Aoki
发明人： Ryuji Kohno , Hideo Miura , Masatoshi Kanamaru , Hiroya Shimizu , Hideyuki Aoki
IPC分类号： G01R1/06 , G01R1/073 , G01R31/28 , H01L21/66 , G03C5/00
CPC分类号： G01R1/07314
摘要： A method of manufacturing a semiconductor device has forming process for forming a semiconductor device on a major surface of a wafer, and testing process for testing defect of the semiconductor device formed on the wafer. The testing process includes a step bringing a testing apparatus into contact with test electrodes of the semiconductor device. The testing apparatus has a contactor including a plurality of probes that come into contact with the test electrodes of the semiconductor device to be tested, and secondary electrodes electrically connected to the probes and disposed on a surface opposite to the probes; a substrate on which electrodes electrically communicated to the contactor by a conducting device. The conducting device is so formed that stress applied to the conducting device in the state where the probes are in contact with the test electrodes is larger than stress applied to the conducting device in the state where the probes are not in contact with the test electrodes.
摘要翻译：制造半导体器件的方法具有在晶片的主表面上形成半导体器件的形成工艺和用于测试形成在晶片上的半导体器件的缺陷的测试过程。测试过程包括使测试设备与半导体器件的测试电极接触的步骤。测试装置具有接触器，该接触器包括与待测半导体器件的测试电极接触的多个探针，以及与探针电连接并设置在与探针相对的表面上的二次电极; 电极通过导电装置与接触器电连通的基板。导电装置形成为在探针与测试电极接触的状态下施加到导电装置的应力大于在探针不与测试电极接触的状态下施加到导电装置的应力。

18. 发明授权

US06952110B2 Testing apparatus for carrying out inspection of a semiconductor device 有权
标题翻译：用于对半导体器件进行检查的测试装置
公开(公告)号：US06952110B2
公开(公告)日：2005-10-04
申请号：US10934046
申请日：2004-09-03
申请人： Ryuji Kohno , Hideo Miura , Masatoshi Kanamaru , Hiroya Shimizu , Hideyuki Aoki
发明人： Ryuji Kohno , Hideo Miura , Masatoshi Kanamaru , Hiroya Shimizu , Hideyuki Aoki
IPC分类号： G01R1/06 , G01R1/073 , G01R31/28 , H01L21/66 , G01R31/02
CPC分类号： G01R1/07314
摘要： A method of manufacturing a semiconductor device has forming process for forming a semiconductor device on a major surface of a wafer, and testing process for testing defect of the semiconductor device. The testing process includes bringing a testing apparatus into contact with test electrodes of the semiconductor device. The testing apparatus has a contactor including probes that come into contact with the test electrodes of the semiconductor device, and secondary electrodes electrically connected to the probes and disposed on a surface opposite to the probes; and a substrate on which electrodes electrically communicated to the contactor by a conducting device. The conducting device is so formed that stress applied to the conducting device in the state where the probes are in contact with the test electrodes is larger than stress applied to the conducting device in the state where the probes are not in contact with the test electrodes.
摘要翻译：制造半导体器件的方法具有在晶片的主表面上形成半导体器件的形成工艺和用于测试半导体器件的缺陷的测试过程。测试过程包括使测试设备与半导体器件的测试电极接触。测试装置具有接触器，其包括与半导体器件的测试电极接触的探针，以及与探针电连接并设置在与探针相对的表面上的次级电极; 以及电极通过导电装置与接触器电连通的基板。导电装置形成为在探针与测试电极接触的状态下施加到导电装置的应力大于在探针不与测试电极接触的状态下施加到导电装置的应力。

19. 发明申请

US20050032252A1 Testing apparatus for carrying out inspection of a semiconductor device 有权
标题翻译：用于对半导体器件进行检查的测试装置
公开(公告)号：US20050032252A1
公开(公告)日：2005-02-10
申请号：US10934046
申请日：2004-09-03
申请人： Ryuji Kohno , Hideo Miura , Masatoshi Kanamaru , Hiroya Shimizu , Hideyuki Aoki
发明人： Ryuji Kohno , Hideo Miura , Masatoshi Kanamaru , Hiroya Shimizu , Hideyuki Aoki
IPC分类号： G01R1/06 , G01R1/073 , G01R31/28 , H01L21/66 , G01R31/02 , G01R31/26
CPC分类号： G01R1/07314
摘要： A method of manufacturing a semiconductor device has forming process for forming a semiconductor device on a major surface of a wafer, and testing process for testing defect of the semiconductor device formed on the wafer. The testing process includes a step bringing a testing apparatus into contact with test electrodes of the semiconductor device. The testing apparatus has a contactor including a plurality of probes that come into contact with the test electrodes of the semiconductor device to be tested, and secondary electrodes electrically connected to the probes and disposed on a surface opposite to the probes; a substrate on which electrodes electrically communicated to the contactor by a conducting device. The conducting device is so formed that stress applied to the conducting device in the state where the probes are in contact with the test electrodes is larger than stress applied to the conducting device in the state where the probes are not in contact with the test electrodes.
摘要翻译：制造半导体器件的方法具有在晶片的主表面上形成半导体器件的形成工艺和用于测试形成在晶片上的半导体器件的缺陷的测试过程。测试过程包括使测试设备与半导体器件的测试电极接触的步骤。测试装置具有接触器，该接触器包括与待测半导体器件的测试电极接触的多个探针，以及与探针电连接并设置在与探针相对的表面上的二次电极; 电极通过导电装置与接触器电连通的基板。导电装置形成为在探针与测试电极接触的状态下施加到导电装置的应力大于在探针不与测试电极接触的状态下施加到导电装置的应力。

20. 发明授权

US5276573A Slider unit controllably actuated at a surface of a moving information recording medium 失效
标题翻译：滑块单元可控制地在移动信息记录介质的表面上致动
公开(公告)号：US5276573A
公开(公告)日：1994-01-04
申请号：US801352
申请日：1991-12-02
申请人： Takeshi Harada , Masatoshi Kanamaru , Atsushi Hosogane , Akiomi Kohno , Kenji Mori
发明人： Takeshi Harada , Masatoshi Kanamaru , Atsushi Hosogane , Akiomi Kohno , Kenji Mori
IPC分类号： G11B5/60 , G11B21/21
CPC分类号： G11B5/6005 , G11B21/21 , G11B5/483
摘要： A slider unit having a reading or reproducing head, with the head being adapted to float over a surface of an information recording disc. The slider unit includes a slider body having a flying height sensor with float surfaces on an underside thereof to generate a lifting force. A piezoelectrically or electrostatically controlled valve layer may be positioned over a vent communicating between an upper surface of the slider, with the vent opening to a recess for generating a negative lift component at an underside of the slider unit. The slider body is made from a ceramic base portion and includes a semiconductive insert portion of, for example, silicon or a photosensitive glass with an adjustment device being formed by utilization of microfabrication techniques such as deposition and etching.
摘要翻译：具有读取或再现头的滑块单元，其头部适于在信息记录盘的表面上浮动。滑块单元包括具有飞行高度传感器的滑块体，浮体表面在其下侧以产生提升力。压电或静电控制的阀层可以位于在滑块的上表面之间连通的通风口上，通气口通向凹槽，用于在滑块单元的下侧产生负提升部件。滑块体由陶瓷基部制成，并且包括例如硅或感光玻璃的半导体插入部分，其中调整装置通过利用诸如沉积和蚀刻的微细加工技术形成。

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