专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

11. 发明授权

US5459368A Surface acoustic wave device mounted module 失效
标题翻译：表面声波装置安装模块
公开(公告)号：US5459368A
公开(公告)日：1995-10-17
申请号：US278905
申请日：1994-07-22
申请人： Keiji Onishi , Shunichi Seki , Yutaka Taguchi , Kazuo Eda
发明人： Keiji Onishi , Shunichi Seki , Yutaka Taguchi , Kazuo Eda
IPC分类号： H03H9/10 , H03H9/02 , H03H9/25 , H01L41/08
CPC分类号： H03H9/1071 , H03H9/0542 , H03H9/0557 , H03H9/059 , H03H9/1085 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2924/01046 , H01L2924/01079 , H01L2924/09701 , H01L2924/15192 , H01L2924/16152 , H01L2924/16195 , H01L2924/19105 , H01L2924/3011 , H01L2924/3025
摘要： This invention provides a surface acoustic wave device mounted module which is miniature, light, and highly reliable. The surface acoustic wave device mounted module also has excellent frequency characteristics. The surface acoustic wave device mounted module includes a multilayer substrate which has at least one layer of a shield pattern, input-output electrodes, grounding electrodes, through holes used for connecting electrodes, and a surface acoustic wave element. The surface acoustic wave element has metallic bumps, which are transfer-coated with a conductive resin, on electrode pads and an insulating resin around the surface acoustic wave element. The electrode pads are input-output terminals and grounding terminals formed on the surface acoustic wave element. Continuities between the input-output terminals and the input-output electrodes, and between the grounding terminals and the grounding electrodes are established by the through holes. An electrode pattern is formed on the surface of the multilayer substrate facing and surrounding the surface acoustic wave element. A metallic lid is attached to the electrode pattern by a solder or a conductive resin so that the surface acoustic wave element is sealed in an airtight condition. The electrode pattern is connected to the grounding electrodes by the through holes.
摘要翻译：本发明提供一种微型，轻型，高可靠性的表面声波装置安装模块。表面声波装置安装模块也具有优异的频率特性。表面声波装置安装模块包括具有至少一层屏蔽图案，输入输出电极，接地电极，用于连接电极的通孔和表面声波元件的多层基板。表面声波元件具有金属凸块，其在电极焊盘上传导涂覆有导电树脂，并在表面声波元件周围具有绝缘树脂。电极焊盘是形成在声表面波元件上的输入输出端子和接地端子。输入输出端子与输入输出电极之间以及接地端子与接地电极之间的连续性由通孔构成。在面对并围绕声表面波元件的多层基板的表面上形成电极图案。通过焊料或导电树脂将金属盖附接到电极图案，使得表面声波元件在气密状态下被密封。电极图案通过通孔与接地电极连接。

12. 发明授权

US5007066A Semiconductor laser apparatus 失效
标题翻译：半导体激光装置
公开(公告)号：US5007066A
公开(公告)日：1991-04-09
申请号：US464001
申请日：1990-01-12
申请人： Kazuo Eda
发明人： Kazuo Eda
IPC分类号： H01S3/10 , H01S5/00 , H01S5/14
CPC分类号： H01S3/10076 , H01S5/14 , H01S5/145
摘要： A semiconductor laser apparatus includes a semiconductor laser for emitting a light beam. The semiconductor laser has, as an external cavity, a quadruple light wave mixing optical phase conjugate element for inverting a spatial phase of an incident light beam. The apparatus further includes a pair of pump light sources which are arranged such that a superimposed portion of spectra of wavelengths of three light beams including two pump light beams emitted from the pair of pump light sources and entering into the optical phase conjugate element and another light beam emitted from the semiconductor laser is narrower than the spectral width of wavelengths of each of the three light beams. This enables the laser apparatus to generate an oscillating output wavelength of extremely narrow spectral width.
摘要翻译：半导体激光装置包括用于发射光束的半导体激光器。半导体激光器具有用于反射入射光束的空间相位的四重光波混合光学相位共轭元件作为外部空腔。该装置还包括一对泵浦光源，其被布置成使得包括从该对泵浦光源发射并进入光学相位共轭元件的两个泵浦光束的三个光束的波长的光谱的重叠部分和另一个光从半导体激光器发射的光束比三个光束中的每个光束的波长的光谱宽度窄。这使得激光装置能够产生非常窄的光谱宽度的振荡输出波长。

13. 发明授权

US4169071A Voltage-dependent resistor and method of making the same 失效
标题翻译：电压相关电阻及其制作方法
公开(公告)号：US4169071A
公开(公告)日：1979-09-25
申请号：US852048
申请日：1977-11-16
申请人： Kazuo Eda , Makino Osamu , Inada Masanori , Iga Atsushi , Sakai Masayuki , Matsuoka Michio
发明人： Kazuo Eda , Makino Osamu , Inada Masanori , Iga Atsushi , Sakai Masayuki , Matsuoka Michio
IPC分类号： C04B35/453 , H01C7/10 , H01B1/08
CPC分类号： H01C7/10
摘要： A voltage-dependent resistor comprising a sintered body comprising ZnO as a major part and additives wherein at least 10 weight percent of the ZnO is composed of ZnO grains having a grain size in the range from 100 to 500 microns; and method of making the same wherein the starting mixture comprises ZnO grains having a grain size in the range from 20 to 200 microns. This voltage-dependent resistor has both a low C-value and a high surge energy withstanding capability. It also has a low leakage current at a high temperature due to the addition of an antimony component as a spinel type polycrystalline Zn.sub.7/3 Sb.sub.2/3 O.sub.4.
摘要翻译：一种电压依赖电阻器，其包含以ZnO为主要部分的烧结体，其中至少10重量％的ZnO由具有100-500微米的晶粒尺寸的ZnO晶粒构成; 及其制备方法，其中起始混合物包含粒度在20至200微米范围内的ZnO颗粒。该电压相关电阻具有低C值和高浪涌能量承受能力。由于添加作为尖晶石型多晶Zn7 / 3Sb2 / 3O4的锑成分，因此在高温下也具有低的漏电流。

14. 发明授权

US06569512B2 Mounting structure for an electronic component and method for producing the same 失效
公开(公告)号：US06569512B2
公开(公告)日：2003-05-27
申请号：US09965768
申请日：2001-09-27
申请人： Hiroaki Takezawa , Tsutomu Mitani , Minehiro Itagaki , Yoshihiro Bessho , Kazuo Eda
发明人： Hiroaki Takezawa , Tsutomu Mitani , Minehiro Itagaki , Yoshihiro Bessho , Kazuo Eda
IPC分类号： B32B1508
CPC分类号： H05K3/321 , B32B7/02 , B32B7/12 , H05K2201/09909 , H05K2201/10636 , H05K2201/10984 , H05K2203/0783 , H05K2203/121 , Y02P70/611 , Y10S428/901 , Y10T29/4913 , Y10T29/49147 , Y10T428/24066 , Y10T428/24917 , Y10T428/2495 , Y10T428/24975 , Y10T428/269 , Y10T428/31678 , Y10T428/31681
摘要： In a mounting structure including a first electrode and a second electrode electrically connected to each other via a conductive adhesive, the periphery of an adhesion portion between at least one of the electrodes and the conductive adhesive is covered with an electrical insulating layer, whereby the adhesion portion is reinforced from the periphery. The electrical insulating layer may be formed by dissolving a binder resin component of the conductive adhesive in a solvent. This increases the concentration of a conductive filler in the conductive adhesive, so that the conductivity of the adhesion portion is also enhanced.

15. 发明授权

US6120917A Hybrid magnetic substrate and method for producing the same 失效
标题翻译：混合磁性基板及其制造方法
公开(公告)号：US6120917A
公开(公告)日：2000-09-19
申请号：US909353
申请日：1997-08-11
申请人： Kazuo Eda
发明人： Kazuo Eda
IPC分类号： G02B6/42 , G02F1/09 , G02F1/095 , H01F10/24 , H01F10/26 , H01F10/28 , H01F10/30 , H01F41/14 , H01L21/20 , H03H2/00
CPC分类号： H01F41/14 , G02B6/42 , G02B6/4208 , G02F1/0955 , H01F10/245 , H01F10/26 , H01F10/28 , H01F10/30 , H01L21/2007 , H03H2/001 , G02F1/093 , Y10T156/10
摘要： According to the present invention, a hybrid magnetic substrate is provided, which includes: a magnetic substrate; and a holding substrate directly bonded to the magnetic substrate through at least one of a hydrogen bond and a covalent bond. Furthermore, a method for producing a hybrid magnetic substrate having the magnetic substrate and the holding substrate is provided, which includes the steps of: cleaning a surface of the magnetic substrate to be bonded and a surface of the holding substrate to be bonded; allowing the cleaned surfaces to be subjected to a hydrophilic treatment; and attaching the surfaces, which are subjected to the hydrophilic treatment, to each other to directly bond the magnetic substrate to the holding substrate.
摘要翻译：根据本发明，提供一种混合磁性基板，其包括：磁性基板; 以及通过氢键和共价键中的至少一个直接键合到磁性基板上的保持基板。此外，提供一种具有磁性基板和保持基板的混合磁性基板的制造方法，其特征在于，包括以下步骤：清洗待接合的磁性基板的表面和待粘合的保持基板的表面; 使清洁的表面经受亲水处理; 并且将经过亲水处理的表面彼此附接以将磁性基板直接接合到保持基板。

16. 发明授权

US5998907A Surface acoustic wave devices and their manufacturing method 失效
标题翻译：表面声波器件及其制造方法
公开(公告)号：US5998907A
公开(公告)日：1999-12-07
申请号：US087079
申请日：1998-05-29
申请人： Yutaka Taguchi , Kazuo Eda , Osamu Kawasaki , Yosihiro Tomita , Keiji Onishi , Shun-ichi Seki , Akihiko Namba , Hiroki Sato , Tetsuyosi Ogura
发明人： Yutaka Taguchi , Kazuo Eda , Osamu Kawasaki , Yosihiro Tomita , Keiji Onishi , Shun-ichi Seki , Akihiko Namba , Hiroki Sato , Tetsuyosi Ogura
IPC分类号： H03H9/145 , H03H9/02 , H03H9/25 , H03H9/64
CPC分类号： H03H9/02834 , H03H9/02574 , H03H9/02921
摘要： A surface acoustic wave device has a main substrate; a comb-like electrode formed on one of the main surfaces of said main substrate; and a supplementary substrate joined with the other main surface of said main substrate, wherein said supplementary substrate has a smaller thermal expansion coefficient and a larger thickness than said main substrate.
摘要翻译：表面声波装置具有主基板; 形成在所述主基板的一个主表面上的梳状电极; 以及与所述主基板的另一个主表面接合的辅助基板，其中所述辅助基板具有比所述主基板更小的热膨胀系数和更大的厚度。

17. 发明授权

US5982010A Piezoelectric device and method of manufacturing the same 失效
标题翻译：压电元件及其制造方法
公开(公告)号：US5982010A
公开(公告)日：1999-11-09
申请号：US976452
申请日：1997-11-25
申请人： Akihiko Namba , Tetsuyoshi Ogura , Yoshihiro Tomita , Kazuo Eda
发明人： Akihiko Namba , Tetsuyoshi Ogura , Yoshihiro Tomita , Kazuo Eda
IPC分类号： H01L41/22 , H01L41/312 , H01L41/338 , H03H3/02 , H01L29/84
CPC分类号： H03H3/02 , H01L41/312 , H01L41/338
摘要： A piezoelectric device is manufactured by: (1) mirror finishing surfaces of a first substrate and a second substrate made of a piezoelectric element; (2) forming grooves on at least one of the two surfaces of the first and second substrates; (3) joining the mirror-finished surfaces of the first substrate and the second substrate; (4) applying heat to the joined substrates and bonding them; (5) forming an opening on the first substrate so that a part of the exposed areas of the second substrate is exposed through the opening; (6) forming piezoelectric devices by forming electrodes on at least one of the second substrate through the opening and a corresponding area to the exposed area on the rear side of the second substrate; and (7) dividing the bonded substrates into portions each having one of the piezoelectric devices. Through this manufacturing method, piezoelectric devices with high yield ratios and high reliability can be obtained.
摘要翻译：压电器件通过以下制造：（1）第一衬底和由压电元件制成的第二衬底的镜面精加工表面; （2）在第一和第二基板的两个表面中的至少一个上形成凹槽; （3）连接第一基板和第二基板的镜面抛光面; （4）向接合的基片施加热量并将其粘合; （5）在所述第一基板上形成开口，使得所述第二基板的所述暴露区域的一部分通过所述开口露出; （6）通过在所述第二基板中的至少一个上通过所述开口形成电极并形成与所述第二基板的后侧上的暴露区域相对应的区域来形成压电装置; 和（7）将接合的衬底分成各自具有一个压电器件的部分。通过该制造方法，可以获得高屈服比和高可靠性的压电装置。

18. 发明授权

US5821665A Surface acoustic wave device and method of manufacture 失效
标题翻译：声表面波装置及其制造方法
公开(公告)号：US5821665A
公开(公告)日：1998-10-13
申请号：US646716
申请日：1996-05-08
申请人： Keiji Onishi , Shun-ichi Seki , Yutaka Taguchi , Kazuo Eda
发明人： Keiji Onishi , Shun-ichi Seki , Yutaka Taguchi , Kazuo Eda
IPC分类号： H03H3/08 , H03H9/05 , H03H9/25 , H01L41/08
CPC分类号： H03H9/1071 , H03H9/02937 , H03H9/059 , H03H9/1092 , H01L2224/1134 , H01L2224/13082 , H01L2224/13144 , H01L2224/1329 , H01L2224/133 , H01L2224/45144 , H01L2924/00013 , H01L2924/09701 , Y10T29/42
摘要： A compact, low height, low cost, and high reliability surface acoustic wave device, and its method of manufacture. The surface acoustic wave device consists of a substrate, a comb-electrode disposed on the main surface of the substrate, plural electrode pads disposed around the comb-electrode, protecting means covering the comb-electrode through a closed space produced by combining the comb-electrode and the electrode pads with the substrate by using substantially covalent bonding force acting between conductive bumps formed on the electrode bumps, a conductive adhesive layer disposed at least on the top of the conductive bumps, and a package adhered on the conductive bumps by means of the conductive adhesive, and insulation adhesive filled into the package contacting the conductive adhesive, the conductive bumps and the protective means.
摘要翻译：紧凑，低高，低成本，高可靠性的声表面波器件及其制造方法。表面声波装置由基板，设置在基板的主表面上的梳状电极，设置在梳状电极周围的多个电极焊盘构成，保护装置通过将梳状电极组合而形成的闭合空间覆盖梳状电极，通过使用作用在形成在电极凸点上的导电凸起之间的基本上共价的结合力，至少设置在导电凸块的顶部上的导电粘合剂层，以及通过以下方式附着在导电凸块上的封装，导电粘合剂和填充到包装中的绝缘粘合剂接触导电粘合剂，导电凸块和保护装置。

19. 发明授权

US5729186A Resonator ladder surface acoustic wave filter suppressing spurious signals 失效
标题翻译：谐振器梯形声波滤波器抑制杂散信号
公开(公告)号：US5729186A
公开(公告)日：1998-03-17
申请号：US629978
申请日：1996-04-09
申请人： Shun-ichi Seki , Kazuo Eda , Yutaka Taguchi , Keiji Onishi , Hiroki Sato , Osamu Kawasaki
发明人： Shun-ichi Seki , Kazuo Eda , Yutaka Taguchi , Keiji Onishi , Hiroki Sato , Osamu Kawasaki
IPC分类号： H03H9/145 , H03H9/64
CPC分类号： H03H9/6483 , H03H9/1452
摘要： A resonator ladder surface acoustic wave (SAW) filter, which has a wide and flat pass band without spurious signals therein is provided. An input electrode, a serial arm SAW resonator, an output electrode, a parallel arm SAW resonator and a ground electrode are respectively formed on a 41.degree.-rotated Y-cut X-propagation lithium niobate substrate. The serial arm SAW resonator comprises a pair of interdigital transducers (IDTs) to excite SAW, one of which is connected to the input electrode. The output electrode is connected to the other IDT of the serial arm SAW resonator. The parallel arm SAW resonator comprises a pair of IDTs to excite SAW, one of which is connected to the output electrode. And the ground electrode is connected to the other IDT of the parallel arm SAW resonator. The IDTs are metal films of Al or Al-based alloy, and the thickness of the metal films ranges from 2.5% to 7.5% of the electrode cycle of the IDT of the parallel arm SAW resonator.
摘要翻译：提供了一种谐振器梯形声表面波（SAW）滤波器，其具有宽而平坦的通带，无杂散信号。分别在41°旋转的Y切X传播铌酸锂基板上形成输入电极，串联臂SAW谐振器，输出电极，并联臂SAW谐振器和接地电极。串联臂SAW谐振器包括一对用于激励SAW的叉指式换能器（IDT），其中一个连接到输入电极。输出电极连接到串联臂SAW谐振器的另一IDT。并联臂SAW谐振器包括一对激励SAW的IDT，其中一个连接到输出电极。并且接地电极连接到并联臂SAW谐振器的另一个IDT。 IDT是Al或Al基合金的金属膜，金属膜的厚度在平行臂SAW谐振器的IDT的电极周期的2.5〜7.5的范围内。

20. 发明授权

US5698471A Method of manufacturing a composite substrate and a piezoelectric device using the substrate 失效
标题翻译：使用该基板的复合基板和压电元件的制造方法
公开(公告)号：US5698471A
公开(公告)日：1997-12-16
申请号：US646451
申请日：1996-05-07
申请人： Akihiko Namba , Tetsuyoshi Ogura , Yoshihiro Tomita , Kazuo Eda
发明人： Akihiko Namba , Tetsuyoshi Ogura , Yoshihiro Tomita , Kazuo Eda
IPC分类号： H01L41/312 , H01L41/39 , H03H3/02 , H03H9/05 , H03H9/19 , H01L21/56 , H01L21/463
CPC分类号： H03H9/0519 , H01L41/312 , H03H3/04 , H03H9/19 , Y10S148/012 , Y10T156/1052 , Y10T156/1082
摘要： A method of manufacturing a composite substrate and the composite substrate manufactured thereby wherein surfaces of first and second substrates having different thermal expansion coefficients are mirror finished and layered on each other. A first heat treatment is applied after which a part of the second substrate is removed to a depth sufficient to expose the first substrate. A final second heat treatment directly bonds the substrates.
摘要翻译：一种制造复合基板的方法和由此制造的复合基板，其中具有不同热膨胀系数的第一和第二基板的表面被镜面化并且彼此层叠。施加第一热处理之后，将第二基板的一部分去除足以露出第一基板的深度。最终的第二次热处理直接粘合基材。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式