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    • 15. 发明授权
    • Embedded memory logic device using self-aligned silicide and manufacturing method therefor
    • 使用自对准硅化物的嵌入式存储器逻辑器件及其制造方法
    • US06214676B1
    • 2001-04-10
    • US09506840
    • 2000-02-18
    • In-kyun JunYoung-pil KimHyung-moo ParkMyeon-koo Kang
    • In-kyun JunYoung-pil KimHyung-moo ParkMyeon-koo Kang
    • H01L21336
    • H01L27/10894H01L27/10873H01L27/10888H01L27/11
    • The operating speed and refresh characteristics of an embedded memory logic device having a silicide layer is improved by excluding the silicide from the source/drain region between access gates and pass gates in a cell array region, thereby reducing leakage current. The source/drain region between access gates and pass gates are also lightly doped to further reduce leakage current. An embedded memory logic device fabricated in accordance with the present invention includes a semiconductor substrate including first and second regions. A first gate electrode is formed over the first region. A first drain region doped with a first impurity is formed in the semiconductor substrate on one side of the first gate electrode, and a first source doped with a second impurity is formed in the semiconductor substrate on the other side of the first gate electrode. A second gate electrode is formed on a second region of the semiconductor substrate, and second source/drain regions doped with a third impurity are formed in the semiconductor substrate on both sides of the second gate electrode. Also, a third gate electrode is formed on the second region of the semiconductor substrate, and third source/drain regions doped with a fourth impurity are formed on both sides of the third gate electrode. Metal silicide layers are formed on the first through third gate electrodes, on the first drain region, and on the second and third source/drain regions.
    • 具有硅化物层的嵌入式存储器逻辑器件的工作速度和刷新特性通过从栅极阵列区域中的栅极和栅极之间的源极/漏极区域排除硅化物来改善,从而减少漏电流。 存取栅极和栅极之间的源极/漏极区域也被轻掺杂,以进一步减少漏电流。 根据本发明制造的嵌入式存储器逻辑器件包括包括第一和第二区域的半导体衬底。 在第一区域上形成第一栅电极。 掺杂有第一杂质的第一漏区形成在第一栅电极的一侧的半导体衬底中,并且在第一栅电极的另一侧上的半导体衬底中形成掺杂有第二杂质的第一源。 第二栅电极形成在半导体衬底的第二区域上,并且掺杂有第三杂质的第二源极/漏极区域形成在第二栅电极两侧的半导体衬底中。 此外,在半导体衬底的第二区域上形成第三栅电极,在第三栅电极的两侧形成掺杂有第四杂质的第三源/漏区。 金属硅化物层形成在第一至第三栅极电极,第一漏极区域以及第二和第三源极/漏极区域上。
    • 16. 发明授权
    • Method for manufacturing capacitor of semiconductor memory device
    • 制造半导体存储器件的电容器的方法
    • US5631185A
    • 1997-05-20
    • US499327
    • 1995-07-07
    • Young-pil KimJong-bok KimKweon-jae Lee
    • Young-pil KimJong-bok KimKweon-jae Lee
    • H01L27/08H01L21/02H01L21/8242H01L27/06H01L27/108H01L21/70H01L27/00
    • H01L27/10852H01L27/10817H01L28/87
    • A method for manufacturing a capacitor of a semiconductor memory device is provided. A first insulating layer and a second insulating layer are formed in sequence on a semiconductor substrate on which a transistor including a source region, a drain region and a gate electrode, and a buried bit-line surrounded by insulating layer are formed. Then, a contact hole is formed by sequentially etching the layers stacked on the source region, by which the source region of the transistor is exposed, and a spacer made of an insulating substance is formed inside the contact hole, and a first conductive layer is formed on the whole surface of the resultant. Next, the first conductive layer and second insulating layer are etched, and a second conductive layer is formed on the whole surface of the resultant, and a storage electrode is formed by etching the second conductive layer using the first conductive layer as a mask. According to the method, the step for forming the contact hole is very simple and less photolithography steps are required since the first conductive layer is used as a mask for etching the second conductive layer, thereby simplifying the manufacturing process.
    • 提供一种制造半导体存储器件的电容器的方法。 在半导体衬底上依次形成第一绝缘层和第二绝缘层,在半导体衬底上形成包括源极区,漏极区和栅电极的晶体管,以及由绝缘层包围的掩埋位线。 然后,通过依次蚀刻堆叠在源区域上的层,形成晶体管的源极区域而暴露的层,并且在接触孔内部形成由绝缘物质构成的间隔物,并且第一导电层为 形成在所得物的整个表面上。 接下来,蚀刻第一导电层和第二绝缘层,并且在所得的整个表面上形成第二导电层,并且通过使用第一导电层作为掩模蚀刻第二导电层来形成存储电极。 根据该方法,用于形成接触孔的步骤非常简单,因为使用第一导电层作为用于蚀刻第二导电层的掩模,因此简化了制造工艺,因此需要较少的光刻步骤。
    • 18. 发明授权
    • Semiconductor integrated circuit device and related fabrication method
    • 半导体集成电路器件及相关制造方法
    • US08273620B2
    • 2012-09-25
    • US12793809
    • 2010-06-04
    • Jin-bum KimYoung-pil KimSi-young ChoiByeong-chan LeeJong-wook Lee
    • Jin-bum KimYoung-pil KimSi-young ChoiByeong-chan LeeJong-wook Lee
    • H01L21/8234
    • H01L21/823418H01L21/823456H01L27/105H01L27/1052
    • Embodiments of the invention provide a semiconductor integrated circuit device and a method for fabricating the device. The semiconductor device includes a semiconductor substrate having a cell region and a peripheral region, a cell active region formed in the cell region, and a peripheral active region formed in the peripheral region, wherein the cell active region and the peripheral active region are defined by isolation regions. The semiconductor device further includes a first gate stack formed on the cell active region, a second gate stack formed on the peripheral active region, a cell epitaxial layer formed on an exposed portion of the cell active region, and a peripheral epitaxial layer formed on an exposed portion of the peripheral active region, wherein the height of the peripheral epitaxial layer is greater than the height of the cell epitaxial layer.
    • 本发明的实施例提供一种半导体集成电路器件及其制造方法。 半导体器件包括具有单元区域和周边区域的半导体衬底,形成在单元区域中的单元有源区域和形成在周边区域中的外围有源区域,其中,电池有源区域和外围有源区域由 隔离区。 半导体器件还包括形成在单元有源区上的第一栅极堆叠,形成在外围有源区上的第二栅极堆叠,形成在电池有源区域的暴露部分上的电池外延层和形成在电池有源区上的外围外延层 所述周边有源区的暴露部分,其中所述外围外延层的高度大于所述电池外延层的高度。
    • 20. 发明授权
    • Semiconductor integrated circuit device and related fabrication method
    • 半导体集成电路器件及相关制造方法
    • US07755133B2
    • 2010-07-13
    • US11855529
    • 2007-09-14
    • Jin-bum KimYoung-pil KimSi-young ChoiByeong-chan LeeJong-wook Lee
    • Jin-bum KimYoung-pil KimSi-young ChoiByeong-chan LeeJong-wook Lee
    • H01L29/788
    • H01L21/823418H01L21/823456H01L27/105H01L27/1052
    • Embodiments of the invention provide a semiconductor integrated circuit device and a method for fabricating the device. The semiconductor device includes a semiconductor substrate having a cell region and a peripheral region, a cell active region formed in the cell region, and a peripheral active region formed in the peripheral region, wherein the cell active region and the peripheral active region are defined by isolation regions. The semiconductor device further includes a first gate stack formed on the cell active region, a second gate stack formed on the peripheral active region, a cell epitaxial layer formed on an exposed portion of the cell active region, and a peripheral epitaxial layer formed on an exposed portion of the peripheral active region, wherein the height of the peripheral epitaxial layer is greater than the height of the cell epitaxial layer.
    • 本发明的实施例提供一种半导体集成电路器件及其制造方法。 半导体器件包括具有单元区域和周边区域的半导体衬底,形成在单元区域中的单元有源区域和形成在周边区域中的外围有源区域,其中,电池有源区域和外围有源区域由 隔离区。 半导体器件还包括形成在单元有源区上的第一栅极堆叠,形成在外围有源区上的第二栅极堆叠,形成在电池有源区域的暴露部分上的电池外延层和形成在电池有源区上的外围外延层 所述周边有源区的暴露部分,其中所述外围外延层的高度大于所述电池外延层的高度。