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11. 发明授权

US07427806B2 Semiconductor component emitting and/or receiving electromagnetic radiation, and housing base for such a component 有权
标题翻译：发射和/或接收电磁辐射的半导体部件和用于这种部件的壳体基座
公开(公告)号：US07427806B2
公开(公告)日：2008-09-23
申请号：US11179028
申请日：2005-07-18
申请人： Karlheinz Arndt , Georg Bogner , Bert Braune , Günter Waitl
发明人： Karlheinz Arndt , Georg Bogner , Bert Braune , Günter Waitl
IPC分类号： H01L23/20
CPC分类号： H01L33/486 , H01L33/52 , H01L33/54 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2924/1815 , H01L2924/19107 , H01L2924/00014 , H01L2924/00
摘要： Disclosed is a radiation emitting and/or receiving semiconductor component comprising at least one radiation emitting and/or receiving semiconductor chip (1), which is disposed in a recess (2) of a housing base body (3) and is there encapsulated with an encapsulant (4) that is readily transparent to electromagnetic radiation emitted and/or received by the semiconductor chip (1). The recess (2) comprises a chip well (21) in which the semiconductor chip (1) is secured, and a trench (22) that runs at least partway around the chip well (21) inside the recess (2), such that between the chip well (21) and the trench (22) the housing base body (3) comprises a wall (23) whose apex, viewed from a bottom face of the chip well (21), lies below the level of the surface of the housing base body (3) from which the recess (2) leads into the housing base body (3), and the encapsulant (4) extends outward from the chip well (21) over the wall into the trench (22). A corresponding housing base body is also disclosed.
摘要翻译：公开了一种辐射发射和/或接收半导体部件，其包括至少一个辐射发射和/或接收半导体芯片（1），其布置在壳体基体（3）的凹部（2）中，并且被封装有对由半导体芯片（1）发射和/或接收的电磁辐射容易透明的密封剂（4）。凹部（2）包括其中固定有半导体芯片（1）的芯片阱（21）和在凹部（2）内部至少沿芯片阱（21）延伸的沟槽（22），使得在芯片井（21）和沟槽（22）之间，壳体基体（3）包括壁（23），其从芯片井（21）的底面观察其顶点位于下表面的水平面所述壳体基体（3）从所述凹部（2）引导到所述壳体基体（3）中，并且所述密封剂（4）从所述芯片孔（21）向外延伸到所述壁上进入所述沟槽（22）。还公开了相应的壳体基体。

12. 发明授权

US07193299B2 Conductor frame and housing for a radiation-emitting component, radiation-emitting component and display and/or illumination system using radiation-emitting components 有权
标题翻译：用于辐射发射部件的导体框架和壳体，辐射发射部件以及使用辐射发射部件的显示和/或照明系统
公开(公告)号：US07193299B2
公开(公告)日：2007-03-20
申请号：US10487576
申请日：2002-08-02
申请人： Karlheinz Arndt , Georg Bogner , Gunter Waitl
发明人： Karlheinz Arndt , Georg Bogner , Gunter Waitl
IPC分类号： H01L23/495 , H01L31/0203
CPC分类号： H01L33/62 , H01L33/483 , H01L33/60 , H01L2924/0002 , H01L2924/12041 , H01L2924/00
摘要： A leadframe for a surface-mountable radiation-emitting component, preferably a light-emitting diode component, having at least one chip connection region and at least one external connection strip. The leadframe is formed in planar fashion and a deformation element, preferably a spring element, is arranged between the chip connection region and the external connection strip. The deformation element enables an elastic or plastic deformation of the leadframe in the plane of the leadframe. A housing, a surface-mountable component and an arrangement having a plurality of such components are furthermore specified.
摘要翻译：用于可表面安装的辐射发射部件的引线框架，优选地是具有至少一个芯片连接区域和至少一个外部连接条的发光二极管部件。引线框架以平面方式形成，并且在芯片连接区域和外部连接带之间布置有变形元件，优选弹簧元件。变形元件使得引线框架在引线框平面中的弹性或塑性变形。进一步规定了外壳，表面安装部件和具有多个这种部件的布置。

13. 发明申请

US20060049477A1 Optoelectronic component 有权
标题翻译：光电元件
公开(公告)号：US20060049477A1
公开(公告)日：2006-03-09
申请号：US10535794
申请日：2003-11-27
申请人： Karlheinz Arndt , Georg Bogner , Gunter Waitl , Matthias Winter
发明人： Karlheinz Arndt , Georg Bogner , Gunter Waitl , Matthias Winter
IPC分类号： H01L31/0203
CPC分类号： H01L33/62 , H01L33/486 , H01L2224/48247 , H01L2224/48465 , H01L2924/00
摘要： The invention relates to an optoelectronic component containing an optoelectronic chip (1) and containing a chip carrier (2) that has a central region (3) on which the chip is fixed and that comprises terminals (41, 42, 43, 44) extending outwardly from the central region of the chip carrier (2) to the outside, wherein the chip and portions of the chip carrier are enveloped by a body (5) and wherein the projection of the body and that of each of the longitudinal axes of the terminals onto the contact plane between the chip and the chip carrier are substantially point-symmetrical with respect to the central point of the chip. The invention further relates to an arrangement comprising said component. The advantage of the symmetrical configuration of the component is that the risk of thermomechanically induced failures of the component is reduced.
摘要翻译：本发明涉及一种含有光电子芯片（1）并包含芯片载体（2）的光电子部件，芯片载体（2）具有芯片固定在其上的中心区域（3），并且包括端子（41,42,43,44）向外从芯片载体（2）的中心区域延伸至外部，其中芯片和芯片载体的部分被主体（5）包围，并且其中主体的突起和纵向轴线的突出部分在芯片和芯片载体之间的接触平面上的端子相对于芯片的中心点基本上是点对称的。本发明还涉及包括所述部件的装置。组件的对称构型的优点在于降低了组织的热力学诱导故障的风险。

14. 发明授权

US06848819B1 Light-emitting diode arrangement 有权
标题翻译：发光二极管布置
公开(公告)号：US06848819B1
公开(公告)日：2005-02-01
申请号：US10009656
申请日：2000-05-12
申请人： KarlHeinz Arndt , Guenter Waitl , Georg Bogner
发明人： KarlHeinz Arndt , Guenter Waitl , Georg Bogner
IPC分类号： F21V19/00 , F21S8/00 , F21S8/04 , F21S8/10 , F21V29/00 , F21V29/74 , F21V31/03 , F21W101/12 , F21W101/14 , F21Y115/10 , G09F13/22 , G09F21/04 , H01L33/64 , H05K3/00 , F21V21/00
CPC分类号： F21V29/004 , F21S10/06 , F21S43/14 , F21S45/47 , F21V29/74 , F21W2111/00 , F21Y2115/10 , G09F13/22 , G09F21/04 , H01L33/64 , H01L2924/0002 , H05K3/0061 , H05K2201/10106 , Y10S362/80 , H01L2924/00
摘要： An LED array surface-mounted on a circuit board and applied to a cooling member, such that any generated heat is optimally eliminated. The cooling member can be in any desired shape so that motor vehicle lights, such as blinkers, can be adapted to the outside contour of the vehicle. For a rotating light, the circuit board can be applied around a cooling member fashioned as a hollow cylindrical member which is adapted to rotate.
摘要翻译：一种LED阵列，其表面安装在电路板上并被施加到冷却构件上，使得任何产生的热量被最佳地消除。冷却构件可以是任何期望的形状，使得诸如指示灯的机动车辆灯可以适应车辆的外部轮廓。对于旋转的光，电路板可以围绕适于旋转的中空圆柱形构件的冷却构件施加。

15. 发明申请

US20100270578A1 Light Emitting Diode Chip with Overvoltage Protection 有权
标题翻译：具有过压保护功能的发光二极管芯片
公开(公告)号：US20100270578A1
公开(公告)日：2010-10-28
申请号：US12742064
申请日：2008-12-09
申请人： Joerg Erich Sorg , Stefan Gruber , Georg Bogner
发明人： Joerg Erich Sorg , Stefan Gruber , Georg Bogner
IPC分类号： H01L33/62 , H01L33/00
CPC分类号： H01L25/167 , H01L23/60 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A light emitting diode chip includes a device for protection against overvoltages, e.g., an ESD protection device. The ESD protection device is integrated into a carrier, on which the semiconductor layer sequence of the light emitting diode chip is situated, and is based on a specific doping of specific regions of said carrier. By way of example, the ESD protection device is embodied as a Zener diode that is connected to the semiconductor layer sequence by means of an electrical conductor structure.
摘要翻译：发光二极管芯片包括用于防止过电压的装置，例如ESD保护装置。 ESD保护器件集成在发光二极管芯片的半导体层序列所在的载体上，并且基于对所述载体的特定区域的特定掺杂。作为示例，ESD保护装置被实施为通过电导体结构连接到半导体层序列的齐纳二极管。

16. 发明授权

US09159889B2 Radiation-emitting component and method for producing radiation-emitting components 有权
标题翻译：辐射发射部件和用于产生辐射发射部件的方法
公开(公告)号：US09159889B2
公开(公告)日：2015-10-13
申请号：US13811846
申请日：2011-07-15
申请人： Karl Weidner , Johann Ramchen , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Stefan Gruber , Georg Bogner
发明人： Karl Weidner , Johann Ramchen , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Stefan Gruber , Georg Bogner
IPC分类号： H01L33/60 , H01L33/20 , H01L33/38 , H01L33/58 , G02F1/1335 , H01L25/075 , H01L33/40 , H01L33/46
CPC分类号： H01L33/60 , G02F1/133603 , H01L25/0753 , H01L25/0756 , H01L33/20 , H01L33/38 , H01L33/405 , H01L33/46 , H01L33/58 , H01L2924/0002 , H01L2924/00
摘要： A radiation-emitting component includes a semiconductor chip which has a first main surface, a second main surface on an opposite side from the first main surface and an active region that generates radiation; a carrier on which the semiconductor chip is fixed on the side of the second main surface; an output layer arranged on the first main surface of the semiconductor chip and forming a lateral output surface spaced apart from the semiconductor chip in a lateral direction, a recess tapering in a direction of the semiconductor chip being, formed in the output layer and deflecting radiation emerging from the first main surface during operation into the direction of the lateral output surface.
摘要翻译：辐射发射部件包括半导体芯片，其具有第一主表面，与第一主表面相对的第二主表面和产生辐射的有源区域; 半导体芯片固定在第二主表面侧的载体; 输出层，布置在半导体芯片的第一主表面上，并在横向上形成与半导体芯片间隔开的横向输出表面，在输出层中形成在半导体芯片的方向上渐缩的凹部和偏转辐射在运行过程中从第一主表面向侧向输出表面的方向出现。

17. 发明授权

US08237192B2 Light emitting diode chip with overvoltage protection 有权
标题翻译：具有过压保护功能的发光二极管芯片
公开(公告)号：US08237192B2
公开(公告)日：2012-08-07
申请号：US12742064
申请日：2008-12-09
申请人： Joerg Erich Sorg , Stefan Gruber , Georg Bogner
发明人： Joerg Erich Sorg , Stefan Gruber , Georg Bogner
IPC分类号： H01L28/74 , H01L31/111
CPC分类号： H01L25/167 , H01L23/60 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A light emitting diode chip includes a device for protection against overvoltages, e.g., an ESD protection device. The ESD protection device is integrated into a carrier, on which the semiconductor layer sequence of the light emitting diode chip is situated, and is based on a specific doping of specific regions of said carrier. By way of example, the ESD protection device is embodied as a Zener diode that is connected to the semiconductor layer sequence by means of an electrical conductor structure.
摘要翻译：发光二极管芯片包括用于防止过电压的装置，例如ESD保护装置。 ESD保护器件集成在发光二极管芯片的半导体层序列所在的载体上，并且基于对所述载体的特定区域的特定掺杂。作为示例，ESD保护装置被实施为通过电导体结构连接到半导体层序列的齐纳二极管。

18. 发明申请

US20110002587A1 Housing for an Optoelectronic Component and Arrangement of an Optoelectronic Component in a Housing 有权
标题翻译：光电元件住房和房屋中光电元件的布置
公开(公告)号：US20110002587A1
公开(公告)日：2011-01-06
申请号：US12521352
申请日：2008-01-09
申请人： Georg Bogner , Stefan Gruber , Thomas Zeiler , Markus Kirsch
发明人： Georg Bogner , Stefan Gruber , Thomas Zeiler , Markus Kirsch
IPC分类号： G02B6/36
CPC分类号： H01L33/483 , H01L25/0753 , H01L25/167 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2224/48464 , H01L2224/73265 , H01L2924/00014
摘要： A plastic housing is arranged on a carrier element and is provided with a recess in which an optoelectronic component is arranged. On the side facing away from the carrier element, the recess has an opening to the outside which can be provided with a transparent cover. One or more structures can be provided on the plastic housing in order to orient the cover and/or optical components relative to the optoelectronic component.
摘要翻译：塑料外壳设置在载体元件上，并设置有凹部，光电元件布置在该凹部中。在背离载体元件的一侧上，该凹部具有可以设置有透明盖的外部开口。可以在塑料壳体上提供一个或多个结构，以便相对于光电子部件定向盖和/或光学部件。

19. 发明授权

US08994047B2 Arrangement comprising at least one optoelectronics semiconductor component 有权
标题翻译：包括至少一个光电半导体组件的布置
公开(公告)号：US08994047B2
公开(公告)日：2015-03-31
申请号：US12808165
申请日：2008-11-19
申请人： Georg Bogner , Stefan Gruber , Michael Zitzlsperger
发明人： Georg Bogner , Stefan Gruber , Michael Zitzlsperger
IPC分类号： H01L33/00 , H01L33/48 , H01L33/44 , H01L25/075
CPC分类号： H01L33/486 , H01L25/0753 , H01L33/44 , H01L2224/48091 , H01L2224/48464 , H01L2924/00014
摘要： An arrangement having at least one optoelectronic semiconductor component includes a carrier element suitable for carrying the at least one optoelectronic semiconductor component. The arrangement comprises a housing body formed from a light-absorbing plastic. The housing body is arranged at the carrier element The housing body comprises an elevated region and a recessed region. An oblique flank is formed between the elevated and recessed regions. The recessed region reaches as far as the optoelectronic semiconductor component in order to reduce reflections.
摘要翻译：具有至少一个光电子半导体部件的布置包括适于承载至少一个光电子半导体部件的载体元件。该装置包括由吸光塑料形成的壳体。壳体设置在承载元件处。壳体包括升高区域和凹陷区域。在凸起和凹陷区域之间形成一个斜面。为了减少反射，凹陷区域达到光电子半导体部件的距离。

20. 发明授权

US08916900B2 Optoelectronic module and method of producing an optoelectronic module 有权
标题翻译：光电子模块及其制造方法
公开(公告)号：US08916900B2
公开(公告)日：2014-12-23
申请号：US13318504
申请日：2010-04-28
申请人： Georg Bogner , Stefan Gruber
发明人： Georg Bogner , Stefan Gruber
IPC分类号： H01L33/26 , H05K1/18 , H01L25/16
CPC分类号： H05K1/183 , H01L25/167 , H01L2224/48091 , H01L2224/48227 , H05K1/181 , H05K2201/10106 , H05K2201/10515 , H05K2201/10674 , H05K2201/10977 , H05K2203/049 , Y02P70/611 , H01L2924/00014
摘要： An optoelectronic module includes a radiation-emitting semiconductor component, an electrical component and a carrier substrate. The carrier substrate includes a top and a bottom, wherein first electrical connections are arranged on the bottom and second electrical connections are arranged on the top. The electrical component is arranged on the top of the carrier substrate and is electrically conductively connected with the first electrical connections. The radiation-emitting semiconductor component is arranged on the side of the electrical component remote from the carrier substrate. The radiation-emitting semiconductor component furthermore includes conductive structures electrically conductively connected with the second electrical connections.
摘要翻译：光电子模块包括辐射发射半导体部件，电子部件和载体基板。载体基板包括顶部和底部，其中第一电连接布置在底部上，而第二电连接布置在顶部。电气部件布置在载体基板的顶部上并与第一电连接导电连接。辐射发射半导体部件布置在远离载体基板的电子部件侧。辐射发射半导体部件还包括与第二电连接导电连接的导电结构。

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