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    • 12. 发明申请
    • Apparatus for Fabricating Thin Film Transistor
    • 薄膜晶体管制造装置
    • US20110139611A1
    • 2011-06-16
    • US12963193
    • 2010-12-08
    • Beong-Ju KimJi-Su AhnCheol-Ho YuSung-Chul Kim
    • Beong-Ju KimJi-Su AhnCheol-Ho YuSung-Chul Kim
    • C23C16/24C23C14/34C23C14/14
    • H01L21/67184H01L21/67196H01L21/67201
    • In an apparatus for fabricating a thin film transistor, amorphous silicon is deposited on a substrate in a first multi-chamber and is crystallized into polycrystalline silicon without using a separate process chamber or multi-chamber, and the substrate deposited with the amorphous silicon is loaded into a second multi-chamber for forming electrodes, thereby making it possible to minimize a characteristic deviation and improve fabrication process efficiency. The apparatus includes a first multi-chamber in which amorphous silicon is deposited on a substrate, a second multi-chamber in which electrodes are formed on the substrate, and a loading/unloading chamber interposed between the first multi-chamber and the second multi-chamber. The loading/unloading chamber includes a substrate holder on a lower side thereof and a power voltage supplier on an upper side thereof.
    • 在用于制造薄膜晶体管的装置中,非晶硅沉积在第一多腔中的衬底上,并且在不使用单独的处理室或多腔的情况下被结晶成多晶硅,并且将沉积有非晶硅的衬底加载 进入用于形成电极的第二多室中,从而使得可以使特性偏差最小化并提高制造工艺效率。 该装置包括:第一多腔室,其中非晶硅沉积在基底上;第二多腔室,其中在基底上形成电极;以及装载/卸载室,介于第一多腔室和第二多腔室之间, 房间。 装载/卸载室包括在其下侧的基板保持件和在其上侧的电源电压供应器。
    • 14. 发明授权
    • Electrostatic discharge protection guide rail system for printed circuit
board
    • 印刷电路板用静电放电保护导轨系统
    • US5708552A
    • 1998-01-13
    • US743253
    • 1996-11-04
    • Jae-Sup HanKyu-Sop SongSung-Chul KimNam-Il Her
    • Jae-Sup HanKyu-Sop SongSung-Chul KimNam-Il Her
    • H05K7/14H05K7/18H05K9/00
    • H05K7/1418H05K9/0016
    • An improved electrostatic discharge protection guide rail system for a PCB which is capable of providing an electrostatic discharge protection function so that a PCB of a plug-in unit disposed in a sub-rack of an electronic instrument from a damage due to an electrostatic discharge (ESD), which includes an ESD ground surface formed on the PCB, an engaging jaw portion formed in a lower portion of the guide rail and having a groove, and an insertion groove formed in a side portion of the guide rail in order for the ESD strip to be inserted therein, wherein the bent ESD strip is inserted into the insertion groove, the ESD ground surface contact portion and the ESD PCB contact portion are inserted into a groove formed in the engaging jaw portion of the guide rail, both ends of the ESD PCB having a copper plate are protruded beyond a side surface of a sub-rack and horizontally cross with respect to the parallel guide rails, and a ground cable is connected to both ends of the ESD PCB, respectively.
    • 一种用于PCB的改进的静电放电保护导轨系统,其能够提供静电放电保护功能,使得布置在电子仪器的子架中的插入单元的PCB免受由于静电放电的损坏( ESD),其包括形成在PCB上的ESD接地面,形成在导轨的下部中的具有凹槽的接合爪部分和形成在导轨的侧部中的插入槽,以便ESD 带状物插入其中,其中弯曲的ESD条插入到插入槽中,ESD接地表面接触部分和ESD PCB接触部分插入形成在导轨的接合爪部分中的槽中, 具有铜板的ESD PCB突出超过副架的侧表面并相对于平行的导轨水平交叉,并且接地电缆连接到ESD PCB的两端 活泼
    • 17. 发明授权
    • Sealant curing apparatus
    • 密封剂固化装置
    • US08927912B2
    • 2015-01-06
    • US13313499
    • 2011-12-07
    • Beong-Ju KimSung-Chul Kim
    • Beong-Ju KimSung-Chul Kim
    • H05B3/02H05B3/84C09K19/02
    • H05B3/84
    • A sealant curing apparatus is disclosed. In one embodiment, the apparatus includes a processing object panel, a panel supporting unit supporting the processing object panel and a voltage applying unit including a first electrode and a second electrode positioned on the panel supporting unit via the processing object panel interposed therebetween and having different polarities. The processing object panel includes: i) a conductive layer pattern including a heating unit that includes a lattice (grid) pattern, a connecting unit coupled to the first electrode and the second electrode, and a coupling unit connecting the heating unit and the connecting unit and ii) a sealant formed according to the heating unit.
    • 公开了一种密封剂固化装置。 在一个实施例中,该装置包括处理对象面板,支撑处理对象面板的面板支撑单元和电压施加单元,该电压施加单元包括位于面板支撑单元上的第一电极和第二电极, 极性 处理对象面板包括:i)包括包括格子(格栅)图案的加热单元,耦合到第一电极和第二电极的连接单元的导电层图案,以及连接加热单元和连接单元的耦合单元 和ii)根据加热单元形成的密封剂。