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    • 11. 发明授权
    • Method of making connections in a back-lit circuit
    • 在背光电路中进行连接的方法
    • US08053353B2
    • 2011-11-08
    • US12431439
    • 2009-04-28
    • François Roy
    • François Roy
    • H01L21/4763
    • H01L27/14689H01L21/76898H01L23/481H01L27/14636H01L27/1464H01L2924/0002H01L2924/00
    • A method for forming, on a surface of a thinned-down semiconductor substrate, a contact connected to a metal track of an interconnect stack formed on the opposite surface of the thinned-down substrate, including the steps of: forming, on the side of a first surface of a substrate, an insulating region penetrating into the substrate and coated with a conductive region and with an insulating layer crossed by conductive vias, the vias connecting a metal track of the interconnect stack to the conductive region; gluing the external surface of the interconnect stack on a support and thinning down the substrate; etching the external surface of the thinned-down substrate and stopping on the insulating region; etching the insulating region and stopping on the conductive region; and filling the etched opening with a metal.
    • 在薄型半导体衬底的表面上形成连接到形成在薄型衬底的相对表面上的互连叠层的金属轨道的接触的方法,包括以下步骤:在 衬底的第一表面,穿透到衬底中并涂覆有导电区域并且具有由导电通孔交叉的绝缘层的绝缘区域,将互连叠层的金属轨道连接到导电区域的通孔; 将互连叠层的外表面胶合在支撑件上并使基板变薄; 蚀刻薄的衬底的外表面并停止在绝缘区上; 蚀刻绝缘区域并停止在导电区域上; 并用金属填充蚀刻开口。
    • 17. 发明授权
    • Very small image sensor
    • 非常小的图像传感器
    • US08193479B2
    • 2012-06-05
    • US12429413
    • 2009-04-24
    • François RoyBenoît Ramadout
    • François RoyBenoît Ramadout
    • H01L27/00H01L31/101
    • H01L27/14687H01L27/1463H01L27/14641H01L27/14643
    • An image sensor formed in a semiconductor stack of a lower region of a first conductivity type and of an upper region of a second conductivity type, including: a photodiode formed of a first portion of the stack; a read area formed of a second portion of the stack; a trench with insulated walls filled with a conductive material, the trench surrounding the photodiode and the read area and being interrupted, all along its height, on a portion facing the photodiode and the read area; and first connection mechanism associated with the conductive material of the trench and capable of being connected to a reference bias voltage.
    • 一种形成在第一导电类型的下区域和第二导电类型的上区域的半导体堆叠中的图像传感器,包括:由所述堆叠的第一部分形成的光电二极管; 由堆叠的第二部分形成的读取区域; 具有填充有导电材料的绝缘壁的沟槽,围绕光电二极管和读取区域的沟槽,并且全部沿其高度中断面对光电二极管和读取区域的部分; 以及与沟槽的导电材料相关联并且能够连接到参考偏置电压的第一连接机构。
    • 20. 发明授权
    • Photodetector array
    • 光电检测器阵列
    • US07279729B2
    • 2007-10-09
    • US10849094
    • 2004-05-19
    • François Roy
    • François Roy
    • H01L31/113
    • H01L27/14603H01L27/14632H01L27/14636
    • A photodetector array made in monolithic form, in which transistors are formed in a semiconductor substrate coated with several metallization levels and photodiodes are formed above a last metallization level, each photodiode having an upper region of a first conductivity type common to all photodiodes and an individual lower region forming a junction with the upper region in contact with a metallization of the last level, wherein each lower region is separated from the neighboring lower regions by an insulating material and is connected to the metallization through a via formed in at least one insulating layer.
    • 在最后的金属化水平上形成以单体形式制成的光电检测器阵列,其中晶体管形成在涂覆有若干金属化水平的半导体衬底和光电二极管中,每个光电二极管具有所有光电二极管共同的第一导电类型的上部区域和个体 下部区域与上部区域形成与最后一层的金属化接触的结,其中每个下部区域通过绝缘材料与相邻的下部区域分离,并且通过在至少一个绝缘层中形成的通孔连接到金属化层 。