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    • 11. 发明授权
    • Method for manufacturing a semiconductor device with sinker contact region
    • 制造具有沉降片接触区域的半导体器件的方法
    • US06806159B2
    • 2004-10-19
    • US10262211
    • 2002-09-30
    • Angelo PintoJeffrey A. BabcockMichael SchoberScott G. BalsterChristoph Dirnecker
    • Angelo PintoJeffrey A. BabcockMichael SchoberScott G. BalsterChristoph Dirnecker
    • H01L21331
    • H01L29/66272H01L29/41708
    • A method for manufacturing a semiconductor device includes forming a buried layer of a semiconductor substrate. An active region is formed adjacent at least a portion of the buried layer. A first isolation structure is formed adjacent at least a portion of the buried layer. A second isolation structure is formed adjacent at least a portion of the active region. A base layer is formed adjacent at least a portion of the active region. A dielectric layer is formed adjacent at least a portion of the base layer, and then at least part of the dielectric layer is removed at an emitter contact location and at a sinker contact location. An emitter structure is formed at the emitter contact location. Forming the emitter structure includes etching the semiconductor device at the sinker contact location to form a sinker contact region. The sinker contact region has a first depth. The method may also include forming a gate structure. Forming the gate structure includes etching the sinker contact region thereby increasing the first depth of the sinker contact region to a second depth.
    • 半导体器件的制造方法包括形成半导体衬底的掩埋层。 在掩埋层的至少一部分附近形成有源区。 在掩埋层的至少一部分附近形成第一隔离结构。 在活性区域的至少一部分附近形成第二隔离结构。 在活性区域的至少一部分附近形成基底层。 在基底层的至少一部分附近形成电介质层,然后在发射极接触位置和沉降片接触位置移除介电层的至少一部分。 发射极结构形成在发射极接触位置。 形成发射极结构包括在沉降片接触位置蚀刻半导体器件以形成沉降片接触区域。 沉降片接触区域具有第一深度。 该方法还可以包括形成栅极结构。 形成栅极结构包括蚀刻沉降片接触区域,从而将沉降片接触区域的第一深度增加到第二深度。
    • 14. 发明授权
    • Lateral heterojunction bipolar transistor
    • 横向异质结双极晶体管
    • US06927428B2
    • 2005-08-09
    • US10818931
    • 2004-04-06
    • Jeffrey A. BabcockAngelo PintoGregory E. Howard
    • Jeffrey A. BabcockAngelo PintoGregory E. Howard
    • H01L21/84H01L27/12H01L29/423H01L29/73H01L29/737
    • H01L21/84H01L27/1203H01L29/42304H01L29/7317
    • A heterojunction bipolar transistor (30) in a silicon-on-insulator (SOI) structure is disclosed. The transistor collector (28), heterojunction base region (20), and intrinsic emitter region (25) are formed in the thin film silicon layer (6) overlying the buried insulator layer (4). A base electrode (10) is formed of polysilicon, and has a polysilicon filament (10f) that extends over the edge of an insulator layer (8) to contact the silicon layer (6). After formation of insulator filaments (12) along the edges of the base electrode (10) and insulator layer (8), the thin film silicon layer (6) is etched through, exposing an edge. An angled ion implantation then implants the heterojunction species, for example germanium and carbon, into the exposed edge of the thin film silicon layer (6), which after anneal forms the heterojunction base region (20). Polysilicon plugs for the emitter (24e) and collector (24c) are then formed, from which dopant diffuses to form the intrinsic emitter (25) and subcollector (22) of the device.
    • 公开了一种绝缘体上硅(SOI)结构中的异质结双极晶体管(30)。 在覆盖在掩埋绝缘体层(4)上的薄膜硅层(6)中形成晶体管集电极(28),异质结基极区(20)和本征发射极区(25)。 基极(10)由多晶硅形成,并且具有在绝缘体层(8)的边缘上延伸以接触硅层(6)的多晶硅细丝(10f)。 沿着基极(10)和绝缘体层(8)的边缘形成绝缘体细丝(12)之后,将薄膜硅层(6)蚀刻通过边缘露出。 然后,成角度的离子注入将异质结物质(例如锗和碳)注入到薄膜硅层(6)的暴露边缘中,其在退火后形成异质结基极区域(20)。 然后形成用于发射极(24e)和集电极(24c)的多晶硅插头,掺杂剂从该多晶硅插塞扩散以形成器件的本征发射极(25)和子集电极(22)。