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11. 发明授权

US07659497B2 On demand circuit function execution employing optical sensing 失效
标题翻译：使用光学传感的按需电路功能执行
公开(公告)号：US07659497B2
公开(公告)日：2010-02-09
申请号：US11275058
申请日：2005-12-06
申请人： Wagdi W. Abadeer , James W. Adkisson , Jeffrey S. Brown , Kiran V. Chatty , Robert J. Gauthier, Jr. , Michael J. Hauser , Jed H. Rankin , William R. Tonti
发明人： Wagdi W. Abadeer , James W. Adkisson , Jeffrey S. Brown , Kiran V. Chatty , Robert J. Gauthier, Jr. , Michael J. Hauser , Jed H. Rankin , William R. Tonti
IPC分类号： G01J1/44 , H01L23/62
CPC分类号： H01L23/5256 , H01L23/525 , H01L27/14609 , H01L2924/0002 , H01L2924/00
摘要： Disclosed is a method of executing an electrical function, such as a fusing operation, by activation through a chip embedded photodiode through spectrally selected external light activation, and corresponding structure and circuit. The present invention is based on having incident light with specific intensity/wave length characteristics, in conjunction with additional circuit elements to an integrated circuit, perform the implementation of repairs, i.e., replacing failing circuit elements with redundant ones for yield and/or reliability. Also to perform disconnection of ESD protection device from input pad once the packaged chip is placed in system. No additional pins on the package are necessary.
摘要翻译：公开了通过光谱选择的外部光激活通过芯片嵌入式光电二极管的激活以及相应的结构和电路来执行诸如定影操作之类的电功能的方法。本发明基于将具有特定强度/波长特性的入射光结合到集成电路的附加电路元件，执行维修的实现，即用冗余电路代替故障电路元件以获得和/或可靠性。一旦封装的芯片放置在系统中，也可以将ESD保护装置从输入焊盘断开。不需要额外的引脚。

12. 发明授权

US06472258B1 Double gate trench transistor 失效
标题翻译：双栅沟槽晶体管
公开(公告)号：US06472258B1
公开(公告)日：2002-10-29
申请号：US09711725
申请日：2000-11-13
申请人： James W. Adkisson , Paul D. Agnello , Arne W. Ballantine , Rama Divakaruni , Erin C. Jones , Jed H. Rankin
发明人： James W. Adkisson , Paul D. Agnello , Arne W. Ballantine , Rama Divakaruni , Erin C. Jones , Jed H. Rankin
IPC分类号： H01L2130
CPC分类号： H01L29/785 , H01L29/42384 , H01L29/4908 , H01L29/66818
摘要： A field effect transistor is formed with a sub-lithographic conduction channel and a dual gate which is formed by a simple process by starting with a silicon-on-insulator wafer, allowing most etching processes to use the buried oxide as an etch stop. Low resistivity of the gate, source and drain is achieved by silicide sidewalls or liners while low gate to junction capacitance is achieved by recessing the silicide and polysilicon dual gate structure from the source and drain region edges.
摘要翻译：场效应晶体管由亚光刻导电沟道和双栅极形成，该双栅极通过简单的工艺由绝缘体上硅晶片开始形成，允许大多数蚀刻工艺使用掩埋氧化物作为蚀刻停止。通过硅化物侧壁或衬垫实现栅极，源极和漏极的低电阻率，而通过从源极和漏极区域边缘凹陷硅化物和多晶硅双栅极结构来实现低栅极至结电容。

13. 发明申请

US20100096536A1 ON DEMAND CIRCUIT FUNCTION EXECUTION EMPLOYING OPTICAL SENSING 有权
标题翻译：使用光电传感器的需求电路功能执行
公开(公告)号：US20100096536A1
公开(公告)日：2010-04-22
申请号：US12646292
申请日：2009-12-23
申请人： Wagdi W. Abadeer , James W. Adkisson , Jeffrey S. Brown , Kiran V. Chatty , Robert J. Gauthier, JR. , Michael J. Hauser , Jed H. Rankin , William R. Tonti
发明人： Wagdi W. Abadeer , James W. Adkisson , Jeffrey S. Brown , Kiran V. Chatty , Robert J. Gauthier, JR. , Michael J. Hauser , Jed H. Rankin , William R. Tonti
IPC分类号： G01J1/44
CPC分类号： H01L23/5256 , H01L23/525 , H01L27/14609 , H01L2924/0002 , H01L2924/00
摘要： Disclosed is a method of executing an electrical function, such as a fusing operation, by activation through a chip embedded photodiode through spectrally selected external light activation, and corresponding structure and circuit. The present invention is based on having incident light with specific intensity/wave length characteristics, in conjunction with additional circuit elements to an integrated circuit, perform the implementation of repairs, i.e., replacing failing circuit elements with redundant ones for yield and/or reliability. Also to perform disconnection of ESD protection device from input pad one the packaged chip is placed in system. No additional pins on the package are necessary.
摘要翻译：公开了通过光谱选择的外部光激活通过芯片嵌入式光电二极管的激活以及相应的结构和电路来执行诸如定影操作之类的电功能的方法。本发明基于将具有特定强度/波长特性的入射光结合到集成电路的附加电路元件，执行维修的实现，即用冗余电路替换故障电路元件以获得和/或可靠性。此外，为了将ESD保护装置与输入板断开，将封装的芯片放置在系统中。不需要额外的引脚。

14. 发明授权

US07265417B2 Method of fabricating semiconductor side wall fin 有权
公开(公告)号：US07265417B2
公开(公告)日：2007-09-04
申请号：US10867772
申请日：2004-06-16
申请人： James W. Adkisson , Paul D. Agnello , Arne W. Ballantine , Rama Divakaruni , Erin C. Jones , Edward J. Nowak , Jed H. Rankin
发明人： James W. Adkisson , Paul D. Agnello , Arne W. Ballantine , Rama Divakaruni , Erin C. Jones , Edward J. Nowak , Jed H. Rankin
IPC分类号： H01L27/01
CPC分类号： H01L29/785 , H01L21/84 , H01L27/1203 , H01L29/42384 , H01L29/66484 , H01L29/66795 , H01L29/78654 , H01L29/78687
摘要： A double gated silicon-on-insulator (SOI) MOSFET is fabricated by forming epitaxially grown channels, followed by a damascene gate. The double gated MOSFET features narrow channels, which increases current drive per layout width and provides low out conductance.

15. 发明授权

US06858889B2 Polysilicon capacitor having large capacitance and low resistance 失效
标题翻译：具有大电容和低电阻的多晶硅电容器
公开(公告)号：US06858889B2
公开(公告)日：2005-02-22
申请号：US09878117
申请日：2001-06-08
申请人： James W. Adkisson , John A. Bracchitta , Jed H. Rankin , Anthony K. Stamper
发明人： James W. Adkisson , John A. Bracchitta , Jed H. Rankin , Anthony K. Stamper
IPC分类号： H01L21/02 , H01L21/314 , H01L21/334 , H01L21/8242 , H01L29/78 , H01L33/00
CPC分类号： H01L28/75 , H01L21/3144 , H01L28/91
摘要： A process for forming capacitors in a semiconductor device. In one embodiment, a first insulating layer is deposited on the semiconductor device; a trench is formed in the insulating layer; a first low resistance metal layer is formed covering the interior surface of the trench; a first polysilicon layer is formed over the first low resistance metal layer; a first dielectric layer is formed over the first polysilicon layer; a second polysilicon layer is formed over the first dielectric layer; a second low resistance metal layer is formed over the second polysilicon layer; a third polysilicon layer is formed over the second low resistance metal layer; a second dielectric layer is formed over the third polysilicon layer; a fourth polysilicon layer is formed over the second dielectric layer; a third low resistance metal layer is formed over the fourth polysilicon layer until the trench is filled; the semiconductor device is planarized until the first, second and third low resistance metal layers are exposed above the trench; finally, capacitor leads are formed to the first, second, and third low resistance metal layers.
摘要翻译：一种用于在半导体器件中形成电容器的工艺。在一个实施例中，第一绝缘层沉积在半导体器件上; 在绝缘层中形成沟槽; 形成覆盖沟槽内表面的第一低电阻金属层; 在第一低电阻金属层上形成第一多晶硅层; 第一介电层形成在第一多晶硅层上; 在第一介电层上形成第二多晶硅层; 在第二多晶硅层上形成第二低电阻金属层; 在第二低电阻金属层上形成第三多晶硅层; 在所述第三多晶硅层上形成第二电介质层; 在第二介电层上形成第四多晶硅层; 第四低电阻金属层形成在第四多晶硅层上，直到沟槽被填充; 半导体器件被平坦化，直到第一，第二和第三低电阻金属层暴露在沟槽上方; 最后，对第一，第二和第三低电阻金属层形成电容器引线。

16. 发明授权

US07163864B1 Method of fabricating semiconductor side wall fin 有权
标题翻译：制造半导体侧壁翅片的方法
公开(公告)号：US07163864B1
公开(公告)日：2007-01-16
申请号：US09691353
申请日：2000-10-18
申请人： James W. Adkisson , Paul D. Agnello , Arne W. Ballantine , Rama Divakaruni , Erin C. Jones , Edward J. Nowak , Jed H. Rankin
发明人： James W. Adkisson , Paul D. Agnello , Arne W. Ballantine , Rama Divakaruni , Erin C. Jones , Edward J. Nowak , Jed H. Rankin
IPC分类号： H01L21/336
CPC分类号： H01L29/785 , H01L21/84 , H01L27/1203 , H01L29/42384 , H01L29/66484 , H01L29/66795 , H01L29/78654 , H01L29/78687
摘要： A double gated silicon-on-insulator (SOI) MOSFET is fabricated by forming epitaxially grown channels, followed by a damascene gate. The double gated MOSFET features narrow channels, which increases current drive per layout width and provides low out conductance.
摘要翻译：通过形成外延生长的通道，随后是镶嵌栅极，制造双栅极绝缘体上硅（SOI）MOSFET。双门控MOSFET具有窄通道，这增加了每个布局宽度的电流驱动，并提供了低导通电压。

17. 发明授权

US06261895B1 Polysilicon capacitor having large capacitance and low resistance and process for forming the capacitor 失效
标题翻译：具有大电容和低电阻的多晶硅电容器和用于形成电容器的工艺
公开(公告)号：US06261895B1
公开(公告)日：2001-07-17
申请号：US09225043
申请日：1999-01-04
申请人： James W. Adkisson , John A. Bracchitta , Jed H. Rankin , Anthony K. Stamper
发明人： James W. Adkisson , John A. Bracchitta , Jed H. Rankin , Anthony K. Stamper
IPC分类号： H01L218242
CPC分类号： H01L28/75 , H01L21/3144 , H01L28/91
摘要： A process for forming capacitors in a semiconductor device. In one embodiment, a first insulating layer is deposited on the semiconductor device; a trench is formed in the insulating layer; a first low resistance metal layer is formed covering the interior surface of the trench; a first polysilicon layer is formed over the first low resistance metal layer; a first dielectric layer is formed over the first polysilicon layer; a second polysilicon layer is formed over the first dielectric layer; a second low resistance metal layer is formed over the second polysilicon layer; a third polysilicon layer is formed over the second low resistance metal layer; a second dielectric layer is formed over the third polysilicon layer; a fourth polysilicon layer is formed over the second dielectric layer; a third low resistance metal layer is formed over the fourth polysilicon layer until the trench is filled; the semiconductor device is planarized until the first, second and third low resistance metal layers are exposed above the trench; finally, capacitor leads are formed to the first, second, and third low resistance metal layers.
摘要翻译：一种用于在半导体器件中形成电容器的工艺。在一个实施例中，第一绝缘层沉积在半导体器件上; 在绝缘层中形成沟槽; 形成覆盖沟槽内表面的第一低电阻金属层; 在第一低电阻金属层上形成第一多晶硅层; 第一介电层形成在第一多晶硅层上; 在第一介电层上形成第二多晶硅层; 在第二多晶硅层上形成第二低电阻金属层; 在第二低电阻金属层上形成第三多晶硅层; 在所述第三多晶硅层上形成第二电介质层; 在第二介电层上形成第四多晶硅层; 第四低电阻金属层形成在第四多晶硅层上，直到沟槽被填充; 半导体器件被平坦化，直到第一，第二和第三低电阻金属层暴露在沟槽上方; 最后，对第一，第二和第三低电阻金属层形成电容器引线。

18. 发明授权

US07217968B2 Recessed gate for an image sensor 有权
标题翻译：嵌入式门用于图像传感器
公开(公告)号：US07217968B2
公开(公告)日：2007-05-15
申请号：US10905097
申请日：2004-12-15
申请人： James W. Adkisson , John Ellis-Monaghan , Mark D. Jaffe , Jerome B. Lasky
发明人： James W. Adkisson , John Ellis-Monaghan , Mark D. Jaffe , Jerome B. Lasky
IPC分类号： H01L31/062
CPC分类号： H01L27/14603 , H01L27/14601 , H01L27/14689 , H01L29/66621
摘要： A novel image sensor cell structure and method of manufacture. The imaging sensor comprises a substrate, a gate comprising a dielectric layer and gate conductor formed on the dielectric layer, a collection well layer of a first conductivity type formed below a surface of the substrate adjacent a first side of the gate conductor, a pinning layer of a second conductivity type formed atop the collection well at the substrate surface, and a diffusion region of a first conductivity type formed adjacent a second side of the gate conductor, the gate conductor forming a channel region between the collection well layer and the diffusion region. Part of the gate conductor bottom is recessed below the surface of the substrate. Preferably, a portion of the gate conductor is recessed at or below a bottom surface of the pinning layer to a depth such that the collection well intersects the channel region.
摘要翻译：一种新颖的图像传感器单元结构及其制造方法。成像传感器包括基板，包括电介质层和形成在电介质层上的栅极导体的栅极，形成在与栅极导体的第一侧相邻的基板的表面下面的第一导电类型的收集阱层，钉扎层在基板表面上形成在集合阱顶部的第二导电类型的第一导电类型的扩散区和在栅极导体的第二侧附近形成的第一导电类型的扩散区，栅极导体在集电阱层和扩散区之间形成沟道区。栅极导体底部的一部分凹陷在基板的表面下方。优选地，栅极导体的一部分在钉扎层的底表面处或下方凹陷到使得收集阱与沟道区相交的深度。

19. 发明授权

US07572701B2 Recessed gate for a CMOS image sensor 有权
标题翻译： CMOS图像传感器的嵌入式门
公开(公告)号：US07572701B2
公开(公告)日：2009-08-11
申请号：US11735223
申请日：2007-04-13
申请人： James W. Adkisson , John Ellis-Monaghan , Mark D. Jaffe , Jerome B. Lasky
发明人： James W. Adkisson , John Ellis-Monaghan , Mark D. Jaffe , Jerome B. Lasky
IPC分类号： H01L21/02 , H01L31/113
CPC分类号： H01L27/14603 , H01L27/14601 , H01L27/14689 , H01L29/66621
摘要： A novel CMOS image sensor cell structure and method of manufacture. The imaging sensor comprises a substrate having an upper surface, a gate comprising a dielectric layer formed on the substrate and a gate conductor formed on the gate dielectric layer, a collection well layer of a first conductivity type formed below a surface of the substrate adjacent a first side of the gate conductor, a pinning layer of a second conductivity type formed atop the collection well at the substrate surface, and a diffusion region of a first conductivity type formed adjacent a second side of the gate conductor, the gate conductor forming a channel region between the collection well layer and the diffusion region. A portion of the bottom of the gate conductor is recessed below the surface of the substrate. Preferably, a portion of the gate conductor is recessed at or below a bottom surface of the pinning layer to a depth such that the collection well intersects the channel region thereby eliminating any potential barrier interference caused by the pinning layer.
摘要翻译：一种新颖的CMOS图像传感器单元结构及其制造方法。成像传感器包括具有上表面的基板，包括形成在基板上的电介质层的栅极和形成在栅极电介质层上的栅极导体，形成在基板表面附近的第一导电类型的集合阱层栅极导体的第一侧，形成在基板表面上的集电阱顶部的第二导电类型的钉扎层，以及邻近栅极导体的第二侧形成的第一导电类型的扩散区域，栅极导体形成沟道收集阱层和扩散区域之间的区域。栅极导体的底部的一部分在衬底的表面下方凹进。优选地，栅极导体的一部分在钉扎层的底表面处或下方凹陷到深度，使得收集阱与沟道区相交，从而消除由钉扎层引起的任何潜在的屏障干扰。

20. 发明授权

US07459360B2 Method of forming pixel sensor cell having reduced pinning layer barrier potential 有权
标题翻译：形成具有降低的钉扎层势垒势垒的像素传感器单元的方法
公开(公告)号：US07459360B2
公开(公告)日：2008-12-02
申请号：US11681454
申请日：2007-03-02
申请人： James W. Adkisson , Andres Bryant , John Ellis-Monaghan , Jeffrey P. Gambino , Mark D. Jaffe , Jerome B. Lasky , Richard A. Phelps
发明人： James W. Adkisson , Andres Bryant , John Ellis-Monaghan , Jeffrey P. Gambino , Mark D. Jaffe , Jerome B. Lasky , Richard A. Phelps
IPC分类号： H01L21/8238
CPC分类号： H01L27/14689 , H01L27/14603 , H01L27/14609 , H01L31/0352
摘要： A method of forming a pixel sensor cell structure. The method of forming the pixel cell comprises forming a doped layer adjacent to a first side of a transfer gate structure for coupling a collection well region and a channel region. Potential barrier interference to charge transfer caused by a pinning layer is reduced.
摘要翻译：一种形成像素传感器单元结构的方法。形成像素单元的方法包括形成与传输栅极结构的第一侧相邻的掺杂层，用于耦合收集阱区和沟道区。减少了由钉扎层引起的对电荷转移的电势障碍干扰。

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