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11. 发明专利

JPH10189849A SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH10189849A
公开(公告)日：1998-07-21
申请号：JP34493496
申请日：1996-12-25
申请人： HITACHI LTD
发明人： ITO KAZUTOSHI , OHASHI TAKEYA , HONDA TAKU , HATORI KAZUO
IPC分类号： H01L23/34 , H01L21/50 , H01L23/48
摘要： PROBLEM TO BE SOLVED: To obtain a semiconductor device, in which the heat of a semiconductor element can be dissipated with good efficiency by a method, wherein a rust preventive film which is composed of two upper and lower layers as a compound film by an organic corrosion inhibitor and as an oxide film is formed on the rear of an element-mounting part in a lead frame. SOLUTION: A semiconductor element 2 is die-bonded by solder 3 so as to be mounted on a lead frame 1. The semiconductor element 2 and a lead frame 1 are wire-bonded b a Al wire 4, so as to be molded integrally by an armor resin 5. At this time, the rear of the lead frame 1 in an element-mounting part is molded in a state that it is exposed on the surface of the armor resin 5, and a rust preventive film 6 is formed in its exposed part. The rust preventive film 6 is oxidized and treated, after an organic corrosion inhibitor (benzotriazoles and the like) is brought into contact with the surface of a Cu alloy forming the lead frame so as to form a compound film on the surface, and a film which is composed of two upper and lower layers as the compound film and as an oxide film is formed. The semiconductor device which is superior in a close contact property and can display a heat-dissipating effect.

12. 发明专利

JPH0714952A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH0714952A
公开(公告)日：1995-01-17
申请号：JP15482593
申请日：1993-06-25
申请人： HITACHI LTD
发明人： YAMADA TOMIO , HOSHI AKIRO , HATORI KAZUO , MURAKAMI HAJIME , SHIMIZU KAZUO , ISHII SHIGERU
IPC分类号： H01L23/40
摘要： PURPOSE:To mount semiconductor device packages with radiating fins automatically on a wiring board in the same process as semiconductor devices without a radiating fin, while being mixed with the semiconductor devices without a radiating fin by installing the radiating fins due to magnetic force between a sealed section and the radiating fins. CONSTITUTION:Ferromagnetic material 61, that is, the material including at least one of a ferromagnetic phase and a ferrimagnetic phase is added locally or dispersedly to mold resin 6 which constitutes a sealed section of a semiconductor device and radiating fins 7. The ferromagnetic material 61 which is included in at least one of the mold resin 6 and the radiating fins 7 is magnetized with magnetization axes being faced in one specified direction. Then, the mold resin 6 and the radiating fins 7 are fastened with magnetic force. Therefore, no special space is required for installation of the radiating fins 7. In the assembly of the semiconductor device, the radiating fins 7 can be installed after mounting the device on a substrate.

13. 发明专利

JPH03112140A WIRE BONDING DEVICE 失效
公开(公告)号：JPH03112140A
公开(公告)日：1991-05-13
申请号：JP24912489
申请日：1989-09-27
申请人： HITACHI LTD
发明人： TAKEMURA MASATOSHI , ARAKI ISAO , HATORI KAZUO
IPC分类号： H01L21/60
摘要： PURPOSE:To increase the adhering strength of the intermediate part of a wire material to a lead by forming a cutout at the wire insertion hole opening edge of a capillary, and so forming the ceiling surface of the cutout as to be parallel to the end face of the capillary. CONSTITUTION:A cutout 26e in which a ceiling surface 26f is parallel to a flat surface 26b is cut on an inner oblique surface 26c of the end of a capillary 26. Accordingly, the intermediate part of a wire material 36 is pressed with a suitable area under a proper pressure to the flat surface of an inner part 11a of the lead. That is, even if the intermediate part of the material 36 is pressed by a strong pressing force, a predetermined collapsed thickness can be maintained at the cutout 26e, and adhered to a lead in a state having a predetermined tensile strength at the flat surface 26b. As a result, a wire 13 is connected to the lead at a bonding part 13b with satisfactory bondability.

14. 发明专利

JPH02244734A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH02244734A
公开(公告)日：1990-09-28
申请号：JP6504589
申请日：1989-03-17
申请人： HITACHI LTD , HITACHI TOBU SEMICONDUCTOR LTD , HITACHI TOKYO ELECTRONICS
发明人： ARAI KATSUO , DANNO TADATOSHI , HATORI KAZUO , ENOMOTO USUKE , HOSHI AKIRO , SATO YUKIHIRO , UTSUKI HIROMOTO , NISHIZAWA NOBUHIRO
IPC分类号： H01L21/60
摘要： PURPOSE:To improve productivity, and to prepare a plurality of standardized types for the same number of leads by dividing a semiconductor device into a body and an outer lead structure, preparing a plurality of types of outer lead structures, and suitably combining desired type of the structure with standardized body. CONSTITUTION:A plurality of types of standardized outer lead structures 15 having different profiles of supporting frames 16 and different profiles of outer leads 19 group are prepared. In a semiconductor device, the outer lead structure 15 corresponding to QFI.IC responsive to user's desire is selected and used. A body 1 is inserted into the supporting frame 16 of the structure 15 corresponding to the selected QFI.IC, the outer parts 7 of leads 5 of the body 1 are mounted therein in a state they are electrically connected to the leads 19, a resin filled layer 17 is filled in a gap between the body 1 and the structure 15 to be formed, and the body 1 is fixed to the structure 15.

15. 发明专利

JPH01256135A WIRE BONDING EQUIPMENT 失效
公开(公告)号：JPH01256135A
公开(公告)日：1989-10-12
申请号：JP8439188
申请日：1988-04-06
申请人： HITACHI LTD
发明人： HATORI KAZUO , CHUMA TOSHIO , ARAKI ISAO
IPC分类号： H01L21/60
摘要： PURPOSE:To maintain arc discharge of a discharge electrode, and prevent the decrease of bondability due to attaching and deposition of scattered fine grain on the discharge electrode, by installing a cooling means for the discharge electrode which compulsorily cools the discharge electrode to melt and form a ball at a wire tip. CONSTITUTION:The surface temperature of a discharge electrode 16 becomes high at the time of discharge. However, since a means 21 to compulsorily cool the discharge electrode is installed, the discharge electrode 16 is rapidly cooled at the same time when current is interrupted. Because there is the difference of thermal expansion coefficients between the material constituting the discharge electrode 16 and the material constituting a coating film attached and deposited on the surface of the discharge electrode 16, cracks exfoliation, etc., generate in the coating film. As a result, the surface of the discharge electrode 16 is always exposed, and an adequate condition for discharge between the discharge electrode and a wire is maintained. Thereby, discharging energy more than or equal to a specified value is maintained, so that an adequate ball is formed, and excellent bondability is obtained.

16. 发明专利

JPS62115729A ELECTRONIC DEVICE AND PRODUCTION EQUIPMENT THEREOF 失效
公开(公告)号：JPS62115729A
公开(公告)日：1987-05-27
申请号：JP25480385
申请日：1985-11-15
申请人： HITACHI LTD , HITACHI HOKKAI SEMICONDUCTOR
发明人： HATORI KAZUO , ARAKI ISAO , HOSHI AKIRO , FUJISAWA ATSUSHI
IPC分类号： H01L21/52 , H01L21/58
摘要： PURPOSE:To eliminate a cure baking process required when using a thermosetting resin, to bond a pellet onto a substrate in a short heat treatment time and to reduce the oxidation of the substrate by bonding the pellet onto the substrate by employing a thermoplastic resin. CONSTITUTION:A lead frame 3 in which small pieces 9a consisting of a thermoplastic resin are pushed and attached to tabs is fed intermittently to a bonding stage by a feeder 6. A bonding head 15 sucks and holds aligned pellets 2, and shifts them to the tabs in the lead frame 3 intermittently stopped on the bonding stage. The thermoplastic resin is softened and melted by the heating (350 deg.C) of a heat block 14 on the tabs and brought to the state in which it is applied uniformly at that time, thus equally bringing the pellets 2 into contact with the resins. Nitrogen gas is fed onto the bonding stage from a pipe 23 at that time, and the upper section of the bonding stage is filled with a reducing atmosphere, thus reducing the oxidation of the surface of the lead frame by heating in a short time (several sec).

17. 发明专利

JPS5910285A Semiconductor device with optical fiber 失效
标题翻译：具有光纤的半导体器件
公开(公告)号：JPS5910285A
公开(公告)日：1984-01-19
申请号：JP11857682
申请日：1982-07-09
申请人： Hitachi Ltd
发明人： HATORI KAZUO , YASUDA YOUICHI , KAWABATA TSUNETOSHI
IPC分类号： G02B6/42 , H01L33/62
CPC分类号： G02B6/4248 , G02B6/4202 , G02B6/4204 , H01L2224/48091 , H01L2224/48465 , H01L2924/00014 , H01L2924/00
摘要： PURPOSE:To improve the adhesion state of an Au plated film and thus enable the hermetic optical fiber fixing due to solder by improving the wetting property of the solder by a method wherein the end part for solder casting of an insertion hole is formed into a tapered hole. CONSTITUTION:The end part for casting the solder 13 of the insertion hole 10 wherein the optical fiber 9 of a near infrared ray light emitting diode device (IRED), etc. for optical communication purpose is inserted is formed into the tapered hole 16. At the time of Au plating, plating solution goes sufficiently into the part of circular cylindrical hole 15, and accordingly the Au plated film is uniformly formed over the entire region of the inner peripheral surface of the insertion hole 10. At the time of assembly when the optical fiber 9 is inserted into the insertion hole 10, and the Ag solder 13 is cast into the insertion hole 10, the Ag solder 13 runs sufficiently into the insertion hole 10. Thus, the optical fiber 9 can be hermetically fixed without generating voids in the solder 13 and at the interface between the solder 13 and the optical fiber 9 or the insertion hole inner peripheral surface.
摘要翻译：目的：为了改善镀Au膜的粘附状态，因此能够通过提高焊料的润湿性而使焊料的密封性光纤固定，其中插入孔的焊料铸造端部形成为锥形孔。构成：将用于光通信用的近红外线发光二极管装置（IRED）等的光纤9插入的插入孔10的焊料13的端部形成为锥形孔16.在镀Au时间，电镀液充分进入圆筒形孔15的部分，因此，在插入孔10的内周面的整个区域均匀地形成Au镀膜。在组装时，将光纤9插入到插入孔10中，并且Ag焊料13流入插入孔10中，Ag焊料13充分地延伸到插入孔10中。因此，光纤9可以气密地固定而不产生空隙焊料13和焊料13与光纤9之间的界面或插入孔内周面。

18. 发明专利

JPS57122547A Stem and manufacture thereof 失效
标题翻译：其制造及其制造
公开(公告)号：JPS57122547A
公开(公告)日：1982-07-30
申请号：JP795781
申请日：1981-01-23
申请人： Hitachi Ltd
发明人： HATORI KAZUO , ENOMOTO USUKE
IPC分类号： H01L23/12 , H01L21/50
CPC分类号： H01L21/50
摘要： PURPOSE:To reduce the manufacturing cost of a stem by partly coinciding the working temperature at which a buffer plate is fixedly soldered onto a heat sink engaged with an iron flange with that at which glass for passing and fixing a lead is melting, thereby reducing the number of steps. CONSTITUTION:In the steps of manufacturing a stem of a can sealing apparatus, a copper heat sink 2 is engaged with an engaging hole formed at a flange 1, is caulked and fixed. Then, a lead 4 is inserted into a glass bead inserted into the mounting hole of the flange 1, a buffer plate 9 made of Mo is placed via a solder material 7 on the heat sink 2, and is heat treated at 1,000 deg.C. subsequently, at the finish plating step, a copper-manganese series of solder material 7 having 950 deg.C of melting point is used, thereby simultaneously performing both the steps of fixing the lead 4 with the glass 3 and soldering fixedly the plate 9. In this manner, the number of steps of working can be reduced, and an inexpensive solder material 7 can be used, thereby reducing the cost.
摘要翻译：目的：通过将缓冲板固定焊接到与铁凸缘接合的散热器上的工作温度部分重合，从而降低阀杆的制造成本，使用于通过和固定铅的玻璃熔化，从而减少步数构成：在制造罐式密封装置的杆的步骤中，铜散热器2与形成在凸缘1处的接合孔接合，被铆接固定。然后，将引线4插入到插入凸缘1的安装孔中的玻璃珠中，由Mo制成的缓冲板9经由焊料7放置在散热片2上，并在1000℃热处理。随后，在精加工步骤中，使用具有950℃熔点的铜 - 锰系列的焊料7，从而同时执行将引线4与玻璃3固定并固定在板9上的两个步骤。以这种方式，可以减少加工步骤的数量，并且可以使用便宜的焊料7，从而降低成本。

19. 发明专利

JPS5650584A LIGHT EMITTING DEVICE WITH OPTICAL FIBER 失效
公开(公告)号：JPS5650584A
公开(公告)日：1981-05-07
申请号：JP12539779
申请日：1979-10-01
申请人： HITACHI LTD
发明人： ENOMOTO USUKE , HATORI KAZUO , YASUDA YOUICHI
IPC分类号： G02B6/42 , H01L33/48
摘要： PURPOSE:To precisely make the center of emitting a light of a light emitting diode coincide with the center of an optical fiber by rotatably retaining the optical fiber at eccentric position with respect to the sleeve. CONSTITUTION:An optical fiber 11 is arranged to confront a light emitting diode 12 secured onto a stem 13. An optical fiber 11 is secured eccentrically from a fiber holder 21, and is rotatably engaged with a sleeve 18 secured to a housing 6. In order to conicide at the center of the diode 12 with the center of the optical fiber 11, the fiber holder 12 may be rotated.

20. 发明专利

JPS54152969A CANNSEALED TRANSISTOR 失效
公开(公告)号：JPS54152969A
公开(公告)日：1979-12-01
申请号：JP6107578
申请日：1978-05-24
申请人： HITACHI LTD
发明人： MARUYAMA YASUO , MATSUMOTO HIROYUKI , YAMADA KOUICHIROU , HATORI KAZUO
IPC分类号： H01L23/04 , H01L21/56
摘要： PURPOSE:To prevent resin from flowing out to a cap connection part by resin-sealing a semiconductor pellet connection part made into a concave. CONSTITUTION:Header 1 has concavities of approximate 1mm in depth at its pellet connection part and circumference, and after pellet 1 is fixed, resin is applied by dropping. Consequently, no resin flows out of concavities, causing no hindrance to the cap connection.

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