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11. 发明专利

JP2010157753A Adhesive for connecting circuit member 有权
标题翻译：用于连接电路组件的粘合剂
公开(公告)号：JP2010157753A
公开(公告)日：2010-07-15
申请号：JP2010030417
申请日：2010-02-15
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： WATANABE ITSUO , TAKEMURA KENZO , NAGAI AKIRA , ISAKA KAZUHIRO , WATANABE OSAMU , KOJIMA KAZUYOSHI
IPC分类号： H01L21/60 , C09J7/00 , C09J11/04 , C09J133/00 , C09J163/00 , C09J201/00
摘要： PROBLEM TO BE SOLVED: To provide an adhesive capable of manufacturing a circuit board whose connection reliability is greatly improved without increasing connection resistance and without peeling off the adhesive at a connection part. SOLUTION: A solution is prepared by dissolving phenoxy resin and acrylic rubber in ethyl acetate. A liquid epoxy containing a microcapsule type latent curing agent is added to the solution and stirred to prepare a fused silica and nickel particle film coating solution, and an adhesive film is prepared from the solution. The average thermal expansion coefficient of the adhesive film at 110 to 130°C, which is measured by a TMA method, is 115 ppm. The adhesive film is stuck to a Ni/Au plated Cu circuit printed board, a chip is placed facing the circuit board, and the bump of the chip and the Ni/Au plated Cu circuit printed board are positioned, heated, pressed and connected. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够制造电路板的粘合剂，其连接可靠性大大提高而不增加连接电阻并且不会在连接部分剥离粘合剂。解决方案：通过将苯氧基树脂和丙烯酸橡胶溶解在乙酸乙酯中制备溶液。将含有微胶囊型潜在固化剂的液态环氧树脂加入到溶液中并搅拌以制备熔融二氧化硅和镍颗粒膜涂布溶液，并从溶液中制备粘合剂膜。通过TMA法测定的110〜130℃下的粘合膜的平均热膨胀系数为115ppm。将粘合膜粘贴到镀Ni / Au的Cu电路印刷电路板上，将芯片放置在面向电路板的位置，并且芯片的凸块和镀Ni / Au的Cu电路印刷电路板被定位，加热，按压和连接。版权所有（C）2010，JPO＆INPIT

12. 发明专利

JP2010016383A Circuit member connecting adhesive, circuit board, and its manufacturing method 有权
标题翻译：电路板连接电路板及其制造方法
公开(公告)号：JP2010016383A
公开(公告)日：2010-01-21
申请号：JP2009158970
申请日：2009-07-03
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： WATANABE ITSUO , TAKEMURA KENZO , NAGAI AKIRA , ISAKA KAZUHIRO , WATANABE OSAMU , KOJIMA KAZUYOSHI
IPC分类号： H01L21/60 , C09J7/00 , C09J9/02 , C09J11/04 , C09J109/02 , C09J163/00 , C09J201/00 , G02F1/1345 , H01B1/22 , H05K1/14 , H05K3/32 , H05K3/36
CPC分类号： H01L2224/16225 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2924/01005 , H01L2924/07811 , H01L2924/0665 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a circuit member connecting adhesive whereby neither increase of connection resistance nor peeling of an adhesive is caused, and connection reliability is substantially improved; a connected circuit board, and its manufacturing method. SOLUTION: This circuit member connecting adhesive intervenes between circuit electrodes 11, 31 facing each other to electrically connect the circuit electrodes 11, 31 facing each other by pressing them. It contains the adhesive 40 and an inorganic filler, or conductive particles 41 in addition to them, and contains 10-200 pts.wt. of the insulating inorganic filler in 100 weight pts.wt. of the adhesive 40. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供连接粘合剂的电路部件，由此不会引起连接电阻的增加或粘合剂的剥离，并且连接可靠性大大提高; 连接电路板及其制造方法。解决方案：该电路构件连接粘合剂介于彼此面对的电路电极11和31之间，以通过按压它们来电连接彼此面对的电路电极11和31。除了它们之外，它还含有粘合剂40和无机填料或导电颗粒41，并且含有10-200重量份。绝缘无机填料100重量重量的粘合剂40.版权所有（C）2010，JPO＆INPIT

13. 发明专利

JP2009299079A Connecting member for circuit, and circuit board 审中-公开
标题翻译：电路连接器和电路板
公开(公告)号：JP2009299079A
公开(公告)日：2009-12-24
申请号：JP2009225011
申请日：2009-09-29
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： WATANABE ITSUO , TAKEMURA KENZO , NAGAI AKIRA , ISAKA KAZUHIRO , WATANABE OSAMU , KOJIMA KAZUYOSHI
IPC分类号： C09J163/00 , C09J5/06 , C09J7/00 , C09J9/02 , C09J11/00 , C09J11/08 , C09J171/10
摘要： PROBLEM TO BE SOLVED: To provide a connecting member for a circuit which is used for connection of an electronic component to a circuit board, is capable of relaxing a stress on a circuit connection boundary surface, and shows remarkably enhanced reliability without causing increase of connection resistance and separation of an adhesive agent in the connection part even after a reliability test, and to provide a circuit board showing excellent reliability.
SOLUTION: The connecting member for the circuit electrically connecting circuit electrodes in a pressing direction to each other by heating and pressing the electrodes facing to each other includes an adhesive composition composed of an epoxy resin (A) in which there is dispersed an acrylic rubber particle obtained by polymerizing a (meth)acrylate-based monomer, having a diameter of 0.02 to 1 μm and occupying not less than 70 vol% of the whole rubber particles, a latent curing agent (B) for the epoxy resin, and a conductive particle (C) having an average particle diameter of 1 to 18 μm as essential components.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供用于将电子部件连接到电路板的电路的连接部件，能够缓和电路连接边界面上的应力，并且显示出显着增强的可靠性，而不会引起即使在可靠性测试之后，连接部分中的连接电阻的增加和粘合剂的分离，并且提供显示出优异的可靠性的电路板。解决方案：通过对彼此面对的电极进行加热和加压将电路电极彼此按压方向彼此电连接的电路用连接构件包括由环氧树脂（A）构成的粘合剂组合物，其中分散有通过聚合直径为0.02〜1μm，占全部橡胶粒子的70体积％以上的（甲基）丙烯酸酯系单体，环氧树脂的潜在性固化剂（B））而得到的丙烯酸系橡胶粒子，以及作为必要成分的平均粒径为1〜18μm的导电性粒子（C）。版权所有（C）2010，JPO＆INPIT

14. 发明专利

JP2009203478A Adhesive for connecting circuit member 审中-公开
标题翻译：用于连接电路组件的粘合剂
公开(公告)号：JP2009203478A
公开(公告)日：2009-09-10
申请号：JP2009120029
申请日：2009-05-18
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： WATANABE ITSUO , TAKEMURA KENZO , NAGAI AKIRA , ISAKA KAZUHIRO , WATANABE OSAMU , KOJIMA KAZUYOSHI
IPC分类号： C09J163/00 , C09J7/00 , C09J11/04 , C09J11/06 , C09J11/08 , H01L21/60 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide an adhesive for manufacturing a circuit board drastically improving connection reliability without increasing connection resistance or peeling the adhesive in a connecting part.
SOLUTION: An adhesive for connecting an circuit member placed between circuit electrodes facing to each other and applying pressure to the circuit electrodes facing to each other to electrically connect both electrodes in the pressure applied direction, in which the adhesive for connecting the circuit member is an adhesive for connecting an IC chip and a printed circuit board, the adhesive includes polyfunctional epoxy resin with three or more functions and/or epoxy resin having a naphthalene skeleton, the polyfunctional epoxy resin with three or more functions is at least one of compound selected from a group consisting of tris-(hydroxyphenyl)methane type epoxy resin, tetra phenylolethane type epoxy resin, and dicyclopentadiene phenol type epoxy resin, the adhesive does not contain a conductive particle, and an average coefficient of thermal expansion at 120-140°C after curing of the adhesive is ≤200 ppm.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于制造电路板的粘合剂，其显着地改善连接可靠性，而不增加连接电阻或在连接部分中剥离粘合剂。解决方案：一种用于连接放置在彼此面对的电路电极之间的电路构件的粘合剂，并且对彼此面对的电路电极施加压力，以在施加压力的方向上电连接两个电极，其中用于连接电路的粘合剂构件是用于连接IC芯片和印刷电路板的粘合剂，该粘合剂包括具有三个或更多个功能的多官能环氧树脂和/或具有萘骨架的环氧树脂，具有三个或更多个功能的多官能环氧树脂是至少一种选自三 - （羟基苯基）甲烷型环氧树脂，四苯基戊烷型环氧树脂和二环戊二烯苯酚型环氧树脂的化合物，该粘合剂不含导电颗粒，平均热膨胀系数为120-140 粘合剂固化后°C≤200ppm。版权所有（C）2009，JPO＆INPIT

15. 发明专利

JP2009164596A Adhesive film for circuit connection, and method of recognizing mark for position identification of circuit member 有权
标题翻译：用于电路连接的粘合膜和用于识别电路部件的位置识别的标记的方法
公开(公告)号：JP2009164596A
公开(公告)日：2009-07-23
申请号：JP2008317241
申请日：2008-12-12
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： SHINOHARA KENGO , NAGAI AKIRA , TAKEMURA KENZO , WATANABE OSAMU , KAWABATA YASUNORI
IPC分类号： H05K3/32 , C09J7/02 , C09J201/00 , H01L23/00 , H05K1/14 , H05K3/36
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an adhesive film for circuit connection which enables a mark for position identification of a circuit member to be sufficiently recognized by an electromagnetic wave transmitted through an adhesive layer stuck to the circuit member. SOLUTION: An adhesive film 1 for circuit connection includes a film-like support body 2 and an insulating adhesive layer 3, provided in contact with the principal surface 2a of the support body 2, and the principal surface 2a on the side of the adhesive layer 3 of the support body 2 has a center line average roughness Ra of 0.3 μm or smaller. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于电路连接的粘合剂膜，其能够通过通过粘附到电路部件的粘合剂层传输的电磁波来充分地识别电路部件的位置识别标记。解决方案：用于电路连接的粘合膜1包括膜状支撑体2和与支撑体2的主表面2a接触设置的绝缘粘合剂层3和主表面2a 支撑体2的粘合层3的中心线平均粗糙度Ra为0.3μm以下。版权所有（C）2009，JPO＆INPIT

16. 发明专利

JP2008060084A Connecting member, and connection structure and connecting method of electrode using the connecting member 有权
标题翻译：连接构件，连接构件和使用连接构件的电极的连接方法
公开(公告)号：JP2008060084A
公开(公告)日：2008-03-13
申请号：JP2007260094
申请日：2007-10-03
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TSUKAGOSHI ISAO , HIROZAWA YUKIHISA , KOBAYASHI KOJI , OTA TOMOHISA , MATSUOKA HIROSHI , WATANABE ITSUO , TAKEMURA KENZO , SHIOZAWA NAOYUKI , WATANABE OSAMU , KOJIMA KAZUYOSHI
IPC分类号： H01R11/01
摘要： PROBLEM TO BE SOLVED: To obtain a connecting member which is superior in long time connecting reliability, which requires no precise positioning of conductive particles in relation to an electrode, which is superior in workability and which has high resolution, and obtain a structure of connecting electrodes using this connecting member. SOLUTION: The structure of connecting the electrodes is a connection structure between electrode rows facing each other. Connection between the electrode rows is made via the connecting member, the connecting member is a multi-layer connecting member obtained by forming an insulating adhesive layer on at least one surface of an adhesive layer which is formed of a conductive material and a binder and which has conductivity in the pressurizing direction, and melt viscosity at connection of binder components is equal to or smaller than that of the insulating adhesive layer. By covering a part of wiring with an insulating layer, at least one of the electrode rows is an electrode row composed of a recessed electrode formed from the part of the wiring which is not covered with the insulating layer. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了获得长时间连接可靠性优异的连接构件，其不需要相对于电极的导电颗粒相对于电极的精确定位，其可加工性优异且分辨率高，并且获得使用该连接部件的连接电极的结构。解决方案：连接电极的结构是彼此面对的电极列之间的连接结构。电极列之间的连接通过连接构件制成，连接构件是通过在由导电材料和粘合剂形成的粘合剂层的至少一个表面上形成绝缘粘合剂层而获得的多层连接构件，在加压方向上具有导电性，粘合剂组分的连接时的熔融粘度等于或小于绝缘粘合剂层的熔融粘度。通过用绝缘层覆盖一部分布线，至少一个电极列是由未被绝缘层覆盖的布线部分形成的凹陷电极组成的电极列。版权所有（C）2008，JPO＆INPIT

17. 发明专利

JP2008022037A Connection member, connection structure of electrode using the same, and connection method 有权
标题翻译：连接构件，使用其的电极的连接结构和连接方法
公开(公告)号：JP2008022037A
公开(公告)日：2008-01-31
申请号：JP2007260097
申请日：2007-10-03
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TSUKAGOSHI ISAO , HIROZAWA YUKIHISA , KOBAYASHI KOJI , OTA TOMOHISA , MATSUOKA HIROSHI , WATANABE ITSUO , TAKEMURA KENZO , SHIOZAWA NAOYUKI , WATANABE OSAMU , KOJIMA KAZUYOSHI
IPC分类号： H01L21/60
摘要： PROBLEM TO BE SOLVED: To obtain a high-resolution connection member that has superior long connection reliability, dispenses with the precise alignment between a conductive particle and an electrode, and has excellent workability; and to obtain the connection structure of the electrode using the connection member.
SOLUTION: At least one of the electrode rows standing face to face projects in the connection structure between electrode rows. In this case, one electrode row is connected to the other via the connection member. The connection member is a multilayer connection member, where an insulating adhesive layer is formed on at least one side of an adhesive layer that is made of a conductive material and a binder, and has conductivity in the direction of pressurization. Melting viscosity is not more than that as compared with the insulating adhesive layer, when a binder component is connected. The conductive material is a conductive particle, or an insulating coating particle, where an insulating cover is formed on the surface of the conductive particle. In this case, the number of effective particles contributing to the connection of the electrode of 50 μmϕ is not less than 10, and the insulating adhesive layer covers the periphery of at least substrate side of a projected electrode.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题为了获得具有优异的长连接可靠性的高分辨率连接构件，省去了导电颗粒和电极之间的精确对准，并且具有优异的可加工性; 并且使用连接构件获得电极的连接结构。解决方案：电极列之间的连接结构中的面对面突出的电极列中的至少一个突出。在这种情况下，一个电极列经由连接构件而彼此连接。连接构件是多层连接构件，其中在由导电材料和粘合剂制成的粘合剂层的至少一侧上形成绝缘粘合剂层，并且在加压方向上具有导电性。当粘合剂组分连接时，熔融粘度不超过绝缘粘合剂层的粘度。导电材料是在导电颗粒的表面上形成绝缘盖的导电颗粒或绝缘涂层颗粒。在这种情况下，有助于连接50μm的电极的有效粒子的数量不小于10，并且绝缘粘合剂层覆盖突出电极的至少衬底侧的周边。版权所有（C）2008，JPO＆INPIT

18. 发明专利

JP2007335889A Adhesive for circuit member connection 有权
标题翻译：用于电路会议连接
公开(公告)号：JP2007335889A
公开(公告)日：2007-12-27
申请号：JP2007204553
申请日：2007-08-06
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： WATANABE ITSUO , TAKEMURA KENZO , NAGAI AKIRA , ISAKA KAZUHIRO , WATANABE OSAMU , KOJIMA KAZUYOSHI
IPC分类号： H01L21/60 , C09J7/00 , C09J9/02 , C09J11/04 , C09J133/00 , C09J163/00 , C09J201/00
摘要： PROBLEM TO BE SOLVED: To provide an adhesive for manufacturing a circuit board whose connection reliability is increased, without increasing the connection resistance at the connecting part and without delamination of the adhesive.
SOLUTION: A solution is prepared by dissolving a phenoxy resin and an acrylic rubber in ethyl acetate. A liquid epoxy containing a microcapsule type latent curing agent is added to the solution and stirred for preparing a fused silica and nickel particle film coating solution, and an adhesive film is prepared from the solution. The adhesive film is adhered to a Ni/Au plated Cu circuit printed board; a chip is placed facing to the circuit board; and the bump of the chip and the Ni/Au plated Cu circuit printed board are positioned, heated, pressed and connected.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于制造连接可靠性增加的电路板的粘合剂，而不增加连接部分处的连接电阻并且不会使粘合剂分层。解决方案：通过将苯氧基树脂和丙烯酸橡胶溶解在乙酸乙酯中制备溶液。将含有微胶囊型潜在性固化剂的液态环氧树脂加入到溶液中并搅拌以制备熔融二氧化硅和镍颗粒膜涂布溶液，并从溶液中制备粘合剂膜。将粘合膜粘附到镀Ni / Au的Cu电路印刷电路板上; 面向电路板放置芯片; 并且芯片的凸块和镀Ni / Au的Cu电路印刷电路板被定位，加热，按压和连接。版权所有（C）2008，JPO＆INPIT

19. 发明专利

JP2010010142A Thermosetting circuit connection member and connection structure of electrode using it and connecting method of electrode 审中-公开
标题翻译：使用电极的电热连接构件和电极的连接结构及电极的连接方法
公开(公告)号：JP2010010142A
公开(公告)日：2010-01-14
申请号：JP2009233793
申请日：2009-10-07
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TSUKAGOSHI ISAO , HIROZAWA YUKIHISA , KOBAYASHI KOJI , OTA TOMOHISA , MATSUOKA HIROSHI , WATANABE ITSUO , TAKEMURA KENZO , SHIOZAWA NAOYUKI , WATANABE OSAMU , KOJIMA KAZUYOSHI
IPC分类号： H01R11/01 , B32B7/02 , B32B27/00 , B32B27/38 , C09J5/06 , C09J7/00 , C09J9/02 , C09J11/00 , C09J163/00 , C09J171/10 , H01R43/00
摘要： PROBLEM TO BE SOLVED: To provide a high-resolution thermosetting circuit connection member capable of retaining conductive particles by preventing them from easily flowing out from the surfaces of electrodes at the time of connection, capable of easily providing contact between the electrodes and the conductive particles, hardly containing bubbles in a connection part, excelling in long-time connection reliability, excelling in workability without needing correct positioning between the conductive particles and the electrodes, and useful for connection between the electrodes, as well as a connection structure and a connection method of electrodes using it. SOLUTION: Of the thermosetting circuit connection member, a multilayer connection member is composed by forming a layer containing epoxy resin, phenoxy resin and a curing agent as an insulating adhesion layer on at least one surface of a conductive adhesion layer comprising epoxy resin, phenoxy resin and curing agent as a binder and a conductive material, and having conductivity in a pressing direction, melting viscosity of a binder constituent at the time of connection is 500 poise or less, and the insulating adhesion layer has a melting viscosity equivalent to that of the conductive adhesion layer. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：解决问题：为了提供一种能够通过防止在连接时从电极表面容易地从电极表面流出而能够保持导电粒子的高分辨率的热固性电路连接部件，能够容易地提供电极与电极之间的接触在连接部中几乎不含气泡的导电性粒子，长时间的连接可靠性优异，加工性优异，不需要导电粒子与电极之间的正确定位，也可用于电极之间的连接，以及连接结构和使用它的电极的连接方法。解决方案：在热固性电路连接构件中，多层连接构件通过在包含环氧树脂的导电粘合层的至少一个表面上形成包含环氧树脂，苯氧基树脂和固化剂作为绝缘粘合层的层，苯氧基树脂和固化剂作为粘合剂和导电材料，并且在挤压方向上具有导电性，连接时粘合剂成分的熔融粘度为500泊以下，绝缘粘合层的熔融粘度等于导电粘合层的。版权所有（C）2010，JPO＆INPIT

20. 发明专利

JP2008147681A Adhesive film for connecting circuit member 有权
标题翻译：用于连接电路组件的粘合膜
公开(公告)号：JP2008147681A
公开(公告)日：2008-06-26
申请号：JP2007325187
申请日：2007-12-17
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： WATANABE ITSUO , TAKEMURA KENZO , NAGAI AKIRA , ISAKA KAZUHIRO , WATANABE OSAMU , KOJIMA KAZUYOSHI
IPC分类号： H01L21/60 , C09J7/00 , C09J9/02 , C09J11/04 , C09J133/00 , C09J163/00 , H01R11/01
摘要： PROBLEM TO BE SOLVED: To provide an adhesive film free from increase in connecting resistance and exfoliation of adhesive in a connecting portion, and capable of manufacturing a circuit board extremely improving a connection reliability.
SOLUTION: A liquid solution is obtained by dissolving a phenoxy resin and an acrylic rubber into an ethyl acetate. A liquid epoxy containing microcapsule latent hardener is added to the liquid solution and agitated to obtain a liquid solution for application to molten silica and nickel-particle film, resulting in manufacturing an adhesive film from the liquid solution. The adhesive film is applied to an Ni/Au-plating Cu-circuit printed board, and chips are set thereon. The bump of the chip is aligned with the Ni/Au-plating Cu-circuit printed board, heated and pressed for connection.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种粘合剂膜不会增加连接部分中的粘合剂的连接电阻和剥离，并且能够制造极大地提高连接可靠性的电路板。解决方案：通过将苯氧基树脂和丙烯酸橡胶溶解在乙酸乙酯中而获得液体溶液。将液体环氧化的微胶囊潜在硬化剂加入到液体溶液中并搅拌，得到用于熔融二氧化硅和镍 - 微粒膜的液体溶液，从液体溶液制造粘合剂膜。将粘合膜施加到Ni / Au电镀Cu电路印刷电路板上，并在其上设置芯片。芯片的凸块与Ni / Au电镀Cu电路印刷电路板对准，加热并按压连接。版权所有（C）2008，JPO＆INPIT

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