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    • 12. 发明专利
    • Circuit connection adhesive, and circuit connection method and circuit connection structure using same
    • 电路连接胶及电路连接方法及电路连接结构
    • JP2007150324A
    • 2007-06-14
    • JP2006335487
    • 2006-12-13
    • Hitachi Chem Co Ltd日立化成工業株式会社
    • NOMURA MICHIYUKIFUJINAWA MITSUGIONO YUTAKAKANAZAWA TOMOKOYUSA MASAMI
    • H01L21/60C09J4/00C09J9/02C09J201/00H01B1/22H05K1/14H05K3/32H05K3/36
    • PROBLEM TO BE SOLVED: To provide a circuit connection adhesive capable of lowering the connection temperature and shortening the connection time, and a circuit connection method and a circuit connection structure using the same.
      SOLUTION: The circuit connection adhesive is interposed between substrates having circuit electrodes in opposition to each other to electrically connect the electrodes in the direction of the application of pressure by applying pressure to the substrates having circuit electrodes in opposition to each other, wherein the adhesive has a first adhesive layer and a second adhesive layer, and a glass transition temperature Tg of the first adhesive layer after pressure connection is set higher than the glass transition temperature Tg of the second adhesive layer after pressure connection. The circuit connection method and the circuit connection structure using the circuit connection adhesive are provided.
      COPYRIGHT: (C)2007,JPO&INPIT
    • 要解决的问题:提供能够降低连接温度并缩短连接时间的电路连接胶粘剂,以及使用其的电路连接方法和电路连接结构。 解决方案:电路连接粘合剂介于具有彼此相对的电路电极的基板之间,以通过相对于具有电路电极的基板施加压力来在施加压力的方向上电连接电极,其中 粘合剂具有第一粘合剂层和第二粘合剂层,并且压力连接之后的第一粘合剂层的玻璃化转变温度Tg被设定为高于压力连接后第二粘合剂层的玻璃化转变温度Tg。 提供了使用电路连接粘合剂的电路连接方法和电路连接结构。 版权所有(C)2007,JPO&INPIT
    • 19. 发明专利
    • Measuring method of hardening rate of dimming film, manufacturing method for dimming film, and dimming film
    • 调色膜硬化速度的测量方法,调制膜的制造方法和调色膜
    • JP2012242224A
    • 2012-12-10
    • JP2011111828
    • 2011-05-18
    • Hitachi Chem Co Ltd日立化成工業株式会社
    • NOMURA MICHIYUKIMORISHITA YOSHIIKAMIYA YUKIO
    • G02F1/17G01N21/3559G01N21/3563G01N21/359G02F1/19
    • PROBLEM TO BE SOLVED: To provide a measuring method of a hardening rate of a resin matrix in a dimming film having excellent swiftness and simplicity.SOLUTION: A method for measuring a hardening rate of a resin matrix by near-infrared spectroscopy in a dimming film is provided. The dimming film is formed by clamping a dimming layer between two transparent conductive resin substrates, the dimming layer including the resin matrix which is a hardened material of a polymer medium, and a light adjusting suspension dispersed in the resin matrix. When interference fringes are formed by transmitting the near-infrared light to the dimming film, the near-infrared spectrum is measured using a second dimming film including two transparent conductive resin substrates satisfying the following expression (I). The expression (I): (Ry)≥λ×1/2, where (Ry) is the maximum height of the surface roughness in the irradiation area of the near-infrared light and λ is the wavelength of the interference fringe.
    • 要解决的问题:提供一种具有优异的快速性和简单性的调光膜中的树脂基体的硬化率的测量方法。 解决方案:提供了一种在调光膜中通过近红外光谱测量树脂基质的硬化率的方法。 调光膜通过在两个透明导电树脂基板之间夹持调光层而形成,该调光层包括作为聚合物介质的硬化材料的树脂基体的调光层和分散在树脂基体中的调光悬浮液。 当通过将近红外光透射到调光膜形成干涉条纹时,使用包括满足以下表达式(I)的两个透明导电树脂基板的第二调光膜来测量近红外光谱。 表达式(I):(Ry)≥λ×1/2,其中(Ry)是近红外光的照射区域中的表面粗糙度的最大高度,λ是干涉条纹的波长。 版权所有(C)2013,JPO&INPIT