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11. 发明专利

JPS5928348A Detecting device for product containable quantity 失效
标题翻译：检测产品含量的设备
公开(公告)号：JPS5928348A
公开(公告)日：1984-02-15
申请号：JP13726682
申请日：1982-08-09
申请人： Hitachi Ltd , Hitachi Tobu Semiconductor Ltd , Hitachi Tokyo Electronics Co Ltd
发明人： WAKIYAMA FUMITOSHI , KAWAGUCHI ISAO , OSAKABE SUSUMU , MIYATA SHIYUNICHI , KANAMARU HITOSHI
IPC分类号： H05K13/08 , H01L21/50 , H01L23/48
CPC分类号： H01L21/50
摘要： PURPOSE:To automatically detect excess and shortage of the number of leads in a magazine by a method wherein the magazine is divided into many portions by partition plates, many leads are contained therein, a detection plate having excess electrodes in the upper stage and shortage electrodes in the lower stage is put thereon, and then the current flowing between the electrodes is detected by forming those into an integral body and swinging them in inclination. CONSTITUTION:The inside of the magazine 9 placed on a table 26 is divided by the partition plates 10, thus forming each containing hole 11, and many leads 7 desired for counting are contained therein. ON the other hand, a detection device for the quantity of leads 25 is composed of a vibration mechanism 29, an elevator 30 disposed in upright thereon, an elevation arm 31, and a supporting piece 28, and the detection plate 27 having clamping claws 32 which clamp the magazine 9 is installed on the lower end of the supporting piece 28. Thereat, the excess electrodes 34 in the upper stage and the shortage electrodes 35 in the lower stage are provided in the detection plate 27 by corresponding to each of the containing holes 11; the leads 7 are vibrated by vibrating the detection plate 27 in inclination and then made to abut against the electrodes 34 and 35, and accordingly the number of the leads 7 is detected according to the flowing current.
摘要翻译：目的：为了通过一种方法自动检测杂志中引线数量的过剩和不足，其中通过分隔板将盒子分成许多部分，其中包含许多引线，在上部具有过量电极的检测板和不足的电极放置在下层，然后通过将它们形成为整体并且倾斜摆动来检测在电极之间流动的电流。构成：放置在工作台26上的杂志9的内部由分隔板10分隔，从而形成每个容纳孔11，并且包含许多需要计数的引线7。另一方面，用于引线数量25的检测装置由振动机构29，直立设置的升降机30，升降臂31和支撑件28构成，检测板27具有夹紧爪32 夹具9被安装在支撑件28的下端。在上部的过剩电极34和下部的不足电极35中，通过对应于每个包含孔11; 引线7通过使检测板27倾斜振动而振动，然后与电极34和35抵接，因此根据流动电流检测引线7的数量。

12. 发明专利

JPS5927533A Lead supply apparatus 失效
标题翻译：铅供应设备
公开(公告)号：JPS5927533A
公开(公告)日：1984-02-14
申请号：JP13726282
申请日：1982-08-09
申请人： Hitachi Ltd , Hitachi Tobu Semiconductor Ltd , Hitachi Tokyo Electronics Co Ltd
发明人： MIYATA SHIYUNICHI , KANAMARU HITOSHI , WAKIYAMA FUMITOSHI , OSAKABE SUSUMU , KAWAGUCHI ISAO
IPC分类号： H05K13/02 , H01L21/50 , H01L23/48
CPC分类号： H01L21/50
摘要： PURPOSE:To certainly and automatically eliminate mischarge lead by the process that a charge head stops temporarily, while it is moving upward, just before the reverse lead and bending lead is removed and a mischarge lead removing bar passes under the magnetized condition. CONSTITUTION:When a lead jig 8 stops at the lead charge station, a charge head 9 holding lead 7 moves downward, causing a receiving hole 20 to be placed, in the proximity, face to face with a supporting hole 16 corresponding to lead jig 8. The vacuum condition is destroyed and internal pressure is reduced to a normal pressure. The lead 7 drops by its own weight, inserting the small diameter part 12 into the supporting hole 16 of lead jig 8. The charge head 9 moves upward and stops after moving the distance l above the lead jig 8. The moving mechanism 25 operates, an removing bar 25 consisting of an electromagnet moves under the magnetized condition, a bending lead 13 and a reverse lead 11 which is held and extended by the charge head 9 are sent out and held by absorption. When the removing bar 25 is sufficiently separated from the lead jig 8, it is non-magnetized.
摘要翻译：目的：为了确保并自动消除充电头临时停止的过程中，当反向引线和弯曲引线被去除之前，并且放电导线移除棒在磁化条件下通过时向上移动的过程中的漏电引线。构成：当引线夹具8在引线充电站停止时，保持引线7的充电头9向下移动，使接收孔20相对于与引线夹具8对应的支撑孔16面对面地放置真空条件被破坏，内部压力降低到正常压力。引线7自身重量下降，将小直径部分12插入引线夹具8的支撑孔16中。充电头9向上移动并在引导夹具8上方移动距离l后停止。移动机构25操作，由电磁铁组成的移除杆25在磁化条件下移动，由充电头9保持和延伸的弯曲引线13和反向引线11被送出并通过吸收保持。当去除棒25与引线夹具8充分分离时，其不被磁化。

13. 发明专利

JPH11121583A SEMICONDUCTOR WAFER TRANSFER SYSTEM 失效
公开(公告)号：JPH11121583A
公开(公告)日：1999-04-30
申请号：JP28339097
申请日：1997-10-16
申请人： HITACHI LTD
发明人： SAKURADA TADAHIRO , NUMATA SHIGEO , OKABE TSUTOMU , SHIMAMURA HIDEAKI , SHIMIZU MICHIYUKI , WAKIYAMA FUMITOSHI , TSUBOI RYUNOSUKE
IPC分类号： B65G49/00 , B65G49/07 , H01L21/677 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To prevent a semiconductor wafer from increasing in transfer time by a method, wherein high stokers where semiconductor wafers in production process are housed are arranged at each of semiconductor treating processes, semiconductor wafers required to be subjected to semiconductor treating processes are supplied to the high stokers, and the semiconductor wafers subjected to a semiconductor treatment are housed in the high stocker. SOLUTION: A semiconductor wafer transfer system is equipped with loop- type transfer lines 1a and 1b provided in a clean room 4a and loop-type transfer lines 1c and 1d provided on the ceiling 4b of the clean room 4a making right angles with the transfer lines 1a and 1b, whereby delays in the transfer of the semiconductor wafers can be lessened reducing a transfer lead time for any transfer carried out between loop lines to an irreducible minimum. Furthermore, even if three or more loop-type transfer lines are provided inside the clean room 4a on a request for a higher transfer capacity, one or more loop-type transfer lines are provided on the ceiling 4b of the clean room 4a, making right angles with the transfer lines which have been previously provided inside the clean room 4a, whereby delays in transfer of the semiconductor wafers between any loop-type transfer lines can be lessened.

14. 发明专利

JPH0319754A METHOD AND DEVICE FOR PRODUCTION CONTROL 失效
公开(公告)号：JPH0319754A
公开(公告)日：1991-01-28
申请号：JP15329989
申请日：1989-06-15
申请人： HITACHI LTD
发明人： SAKAMOTO YUZABURO , OYAMA YUICHI , SUZUKI HIROO , SHIMOSHA SADAO , WAKIYAMA FUMITOSHI , HANAJIMA SHUICHI
IPC分类号： B23Q41/08 , G05B15/02 , G05B19/418
摘要： PURPOSE:To suppress generation of an unnecessary unfinished product so as to improve investment efficiency with a production control simplified and cleared by virtually creating a production line of flow shop type. CONSTITUTION:By aiming at a kind and order of an equipment group in use, a product group is grouped in virtual kinds (a) to (c) with the number of kinds smaller than the true number of kinds. Next in accordance with the virtual kind, a plurality of virtual production systems are virtually set, and virtual processes A1 to A4... are virtually set in each plural quantity by uniformly dividing in the timing the inside of each virtual production system. Next following an input of each virtual kind into each virtual process, each virtual kind respectively corresponding to each virtual process is given by a display means, and the virtual kind respectively corresponding to these virtual processes is divided into a plurality of groups following the progress of production. Thereafter, data, related to a quantity of display means groups, are respectively applied in respective virtual processes and by recognizing a quantity of the unfinished in each virtual process based on these data, an input of the virtual product group to each virtual process is controlled.

15. 发明专利

JPS6293943A METHOD AND DEVICE FOR END POINT DETECTION 失效
公开(公告)号：JPS6293943A
公开(公告)日：1987-04-30
申请号：JP23323285
申请日：1985-10-21
申请人： HITACHI LTD
发明人： KAMIOKA TETSUYA , OKABE TSUTOMU , MAEJIMA HIROSHI , WAKIYAMA FUMITOSHI , SEKIGUCHI KOICHIRO , HANAJIMA SHUICHI
IPC分类号： H01L21/302 , H01L21/3065
摘要： PURPOSE:To improve the accuracy for detecting an end point of etching by a method wherein, when dry etching is performed on a thin film formed on the surface of a semiconductor wafer to form a prescribed pattern, different wavelengths of emission spectrums emitted from the thin film are combined and the peak position of this differential waveform is regarded as the end point of etching. CONSTITUTION:A parallel plate electrode 7 consisting of a lower electrode 5 whereon a semiconductor wafer 4 is placed and an upper electrode 6 is arranged over a substrate part 1 of a plasma etching device having an exhaust tube 9 and this electrode 7 is covered with a bell-jar 2 made of transparent quartz. Moreover, the electrode 5 is earthed, the electrode 6 is connected to an external high-frequency power source 8 and gas is fed in a treating chamber 3 in the interior of the bell-jar 2 from a reaction gas control mechanism 10 through a supply pipe 11. Thereafter, the gas is activated with plasma 12 generated, lights emitted from a thin film formed on the semiconductor wafer surface are processed in a combination circuit part 17 through BPFs 14a and 14b, photo diodes 13a and 13b, amplifying parts 15a and 15b and A/D converters 16a and 16b outside the bell-jar 2. Then, a differential calculation is executed in a decision part 18 and the power source 8 is stopped using the peak of the waveform.

16. 发明专利

JPS61168913A HEAT TREATING APPARATUS OF WAFER 失效
公开(公告)号：JPS61168913A
公开(公告)日：1986-07-30
申请号：JP902185
申请日：1985-01-23
申请人： HITACHI LTD
发明人： MURAYAMA TOSHIO , MAEJIMA HIROSHI , WAKIYAMA FUMITOSHI , TAKAGAKI TETSUYA , NONAKA TOSHIO
IPC分类号： H01L21/22
摘要： PURPOSE:To obtain an integrated automatic wafer treating process having a high operating rate, by providing treating chambers in a plurality of stages, and providing a transfer device, by which jigs are transferred among a conveying device, stocker, and a loader. CONSTITUTION:When a cartridge 15 is put into a transfer part 4, a transfer device 14 transfer a wafer 1 to a jig 13 for heat treatment one by one. The jig 13 is conveyed to a conveying part 3 and mounted on a stocker 19 from a guide 17 by a mounting device 20. When treatment is finished in one of a diffusing furnace 5, the jig 13, which accommodates the treated wafer 1, is conveyed to the conveying part 3 from the diffusing furnace 5 by a loader 9 under the state the jig is held by a fork 12. The jig is transferred on the guide 17. Then, the mounting device 20 mounts the jig before treatment, which is stocked in the stocker 19, on the fork 12, which has finished the conveying work, immediately. Meanwhile, the treated jig 13, which is mounted on the guide 17, is conveyed to the transfer part 4. The wafer 1 is transferred to the vacant cartridge 15 one by one.

17. 发明专利

JPS61152012A INSPECTION SYSTEM 失效
公开(公告)号：JPS61152012A
公开(公告)日：1986-07-10
申请号：JP27282284
申请日：1984-12-26
申请人： HITACHI LTD
发明人： MAEJIMA HIROSHI , KOMORIYA SUSUMU , NAITOU TAKAMASA , WAKIYAMA FUMITOSHI , CHIKAOKA RYOSAKU
IPC分类号： G01N21/88 , G01N21/94 , G01N21/956 , G03F1/84 , G03F7/20 , H01L21/027 , H01L21/30 , H01L21/66
摘要： PURPOSE:To contrive improvement in working efficiency, to improve the reliability of inspection as well as to contrive improvement in the yield of production by a method wherein all the transfer processes of pattern to be used for inspection using a dummy wafer and the like are abbreviated, and foreign matters are inspected by performing a direct inspection on a reticle pattern. CONSTITUTION:Before a projection and exposing process is performed on the pattern of reticle 4 on a wafer 6, an X-Y table 7 is shifted, and a CCD17 is positioned at a point directly below a projection optical system 5. Under the above-mentioned condition, the pattern of the reticle 4 is projected on the CCD17, and at the same time, the X-Y table 7 is shifted in the direction of X and Y, and the CCD17 is scanned on the projected pattern 4A. At this time, the shifting of the X-Y table 7 is performed by controlling the X-Y table 7 position detecting action of a laser optical system 13 and a laser controlling circuit 14, and the driving action of a Y-driving part 11 and a table controlling circuit 12 using a stepper control circuit 16 and a central controlling part 19.

18. 发明专利

JPS6143453A Connecting device 失效
标题翻译：连接设备
公开(公告)号：JPS6143453A
公开(公告)日：1986-03-03
申请号：JP16496184
申请日：1984-08-08
申请人： Hitachi Ltd
发明人： IKEDA YUJI , FUJIOKA SHUNICHIRO , KOMIYAMA MOTOAKI , WAKIYAMA FUMITOSHI , HAMAMOTO HIROMI
IPC分类号： H01L23/32 , H01R33/76 , H05K7/10
CPC分类号： H05K7/1007
摘要： PURPOSE:To realize either of the closing and the releasing of the cap body by one- touch operation by a method wherein an engaging tool, which energizes a force in a releasing direction to the cap body at all times and engages automatically with the cap body according to the closing and shift of the cap body, is provided. CONSTITUTION:When a cap body 3 is pushed down in the direction indicated by the full lines opposing against the energizing force of a torsion spring 5, the side at the lower end of the free end of the cap body 3 is made to abut with the slanting surface part 9 of an engaging tool 6, and when the slanting surface part 9 is energized a pushing-down force from the cap body 3, the engaging tool 6 bends in the estranging direction at a rising part 7 and the free end of the cap body 3 gets over an engaging part 8. Whereby the engaging part 8 is automatically engaged on the upper end of the free end of the cap body 3 and the closed state of the cap body 3 is maintained by the engaging and the bearing of an axis 4. Then, when an IC17 is reset from the IC socket, an external force in a direction to release the engaging is energized to the slanting surface part 9 of the engaging tool 6 and when the engaging part 8 comes off from the side at the upper end of the cap body 3, the cap body 3 is forcibly uplifted upward at the same time as the time when the engaging is released and is automatically released.
摘要翻译：目的：通过一次触摸操作来实现盖体的闭合和释放，其中，一种接合工具，其将所有时间的释放方向上的力激励到盖体，并自动地与盖体接合根据盖体的关闭和移动，提供。构成：当盖体3沿着与扭转弹簧5的激励力相反的全线所示的方向向下推压时，帽体3的自由端的下端侧与接合工具6的倾斜表面部分9，并且当倾斜表面部分9被从帽体3的推下力通电时，接合工具6在上升部分7处以脱离方向弯曲，并且自由端帽体3越过接合部分8.通过接合部分8自动地接合在帽体3的自由端的上端上，并且盖体3的关闭状态通过接合和轴承的保持然后，当IC17从IC插座复位时，沿接合工具6的倾斜表面部分9向接合工具6的倾斜表面部分9通电时，沿着解除接合的方向的外力被激励，并且当接合部8从侧面脱离时盖主体3的上端，盖主体3是forc 与被释放的时间同时自动上升并被自动释放。

19. 发明专利

JPS60152033A FLASH REMOVING DEVICE 失效
公开(公告)号：JPS60152033A
公开(公告)日：1985-08-10
申请号：JP714184
申请日：1984-01-20
申请人： HITACHI LTD
发明人： IKEDA YUUJI , WATANABE TAKEHIKO , KOJIMA AKIRA , WAKIYAMA FUMITOSHI , UENO TSUNEMI
IPC分类号： B29C37/02 , H01L21/56
摘要： PURPOSE:To rapidly and securely remove resin flashes being accompanied with a resin-sealed semiconductor device by a method wherein a liquid jetting means capable of jetting liquid to the resin flashes at high pressure from a direction over the device and a lower direction side to the device is provided. CONSTITUTION:Jet liquid is brought in a superhigh-pressure condition by a superhigh-pressure pump 4. Assuming that a lead frame 8 is being fed to right from left, jet liquid 7 is jetted to resin flashes in the dam of a semiconductor device 1 and outflow flashes being formed on the upper side of the lead frame 8 at superhigh pressure from a jet nozzle 6A being provided over the semiconductor device 1 at point A, and the resin flashes and the outflow flashes are removed. Then, a jet flow 7 is struck on the resin flashes remaining in the dum, which couldn't be removed at the point A, and outflow flashes being formed on the lower side of the lead frame 8 from a lower direction side to the semiconductor device 1 using a jet nozzle 6B being provided in the lower direction side to the semiconductor device 1 at point B, and the remaining flashes and the outflow flashes are removed.

20. 发明专利

JPS6099943A CLEAN ROOM 失效
公开(公告)号：JPS6099943A
公开(公告)日：1985-06-03
申请号：JP20481483
申请日：1983-11-02
申请人： HITACHI LTD
发明人： KOJIMA AKIRA , WAKIYAMA FUMITOSHI , ISHIKAWA KATSUHIKO , TANABE YOSHIKAZU
IPC分类号： F24F7/06 , F24F3/16
摘要： PURPOSE:To prevent introduction of air from worker's area into highly clean area and keep the highly clean area in a predetermined cleanness stably by a constitution wherein air, which flows from the highly clean area into the worker's area or equipment protecting area, is made to circulate and flow toward upper return suction ports. CONSTITUTION:The whole of a clean tunnel 20 is defined from outside by an outer bulkhead 21. The highly clean areas 23, 23 are isolated from respective equipment protecting areas 24, 24 and the worker's area 22 by inner bulkheads 25, 25, arranged at the outside thereof, and screens 26, 26, arranged at the insides thereof. Clean air enters downwardly from high performance filters 29, 29 as shown by arrow signs to fill up the high cleanness areas 23, 23 whereby the areas 23, 23 are purified. The clean air flows into the equipment protecting areas 24, 24 and the worker's area 22 respectively through gaps between equipments 28 and inner bulkheads 25 as well as between the equipments and the screens 26. Air in the worker's area 22 flows upwardly and returns to the high performance filter to circulate through a pre-filter 31 and a duct 30, therefore, introduction of air from the worker's area 22 into the high cleanness area 23 may be prevented.

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