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    • 14. 发明授权
    • Temperature insensitive capacitor load memory cell
    • 温度不敏感电容负载存储单元
    • US06272039B1
    • 2001-08-07
    • US09498543
    • 2000-02-04
    • James T. ClemensPhilip W. DiodatoYiu-Huen Wong
    • James T. ClemensPhilip W. DiodatoYiu-Huen Wong
    • G11C1100
    • G11C11/412
    • An apparatus and method for constructing a temperature insensitive memory cell. This temperature insensitive memory cell operates as a static random access memory (SRAM) cell if a particular capacitor and transistor configuration is used. The temperature insensitive memory cell apparatus includes at least one transistor having a current leakage, and at least one capacitor electrically connected to the transistor. The capacitor acts as a load element for the memory cell. The capacitor has a temperature dependent capacitor leakage that tracks the current leakage of transistor as said at least one transistor as the transistor varies with temperature.
    • 一种用于构建温度不敏感的存储单元的装置和方法。 如果使用特定的电容器和晶体管配置,该温度不敏感的存储器单元作为静态随机存取存储器(SRAM)单元工作。 温度不敏感的存储单元装置包括至少一个具有电流泄漏的晶体管,以及电连接到该晶体管的至少一个电容器。 电容器用作存储单元的负载元件。 电容器具有依赖于温度的电容器泄漏,其随着晶体管随着温度变化而跟踪晶体管的电流泄漏作为所述至少一个晶体管。
    • 18. 发明授权
    • Method of forming a silicon-based semiconductor optical device mount
    • 形成硅基半导体光学器件安装件的方法
    • US5024966A
    • 1991-06-18
    • US510338
    • 1990-04-16
    • Norman R. DietrichRalph S. MoyerYiu-Huen Wong
    • Norman R. DietrichRalph S. MoyerYiu-Huen Wong
    • H01S5/02H01S5/022H01S5/026H01S5/042H01S5/062
    • H01S5/02276H01L2224/48464H01L2924/01013H01L2924/01014H01L2924/01078H01L2924/01079H01L2924/04941H01L2924/10253H01L2924/12041H01L2924/30107H01L2924/3011H01S5/0427H01S5/06226Y10S148/099Y10S148/168Y10S438/928
    • A silicon-based laser mounting structure is disclosed which provides improved interconnection between a semiconductor optical device, such as a laser, and an external high frequency modulation current source, by reducing the presence of parasitic inductive elements in the interconnecting network. The structure includes a stripline transmission path formed by depositing metal conductive strips on the top and bottom surfaces of a silicon substrate. The conductive strips are coupled at one end to the external modulation current source. A thin film resistor is deposited between the second end of the top conductive strip and the semiconductor optical device. This thin film resistor is utilized to provide impedance matching between the optical device and the stripline. That is, for a laser with an impedance Z.sub.L, and a stripline designed to have an impedance Z.sub.S, the resistance R is chosen such that R+Z.sub.L =Z.sub.S. Utilizing silicon processing techniques, the thin film resistor may be placed adjacent to the laser, reducing the parasitics associated with their interconnection. A conductive via is formed through the substrate to provide a top-side bonding location for connecting the optical device to the bottom metal conductor by providing the top-side site, the parasitic inductance associated with this interconnection is considerably reduced.
    • 公开了一种硅基激光器安装结构,其通过减少互连网络中的寄生电感元件的存在来提供诸如激光器的半导体光学器件与外部高频调制电流源之间的改进的互连。 该结构包括通过在硅衬底的顶表面和底表面上沉积金属导电条而形成的带状线传输路径。 导电条在一端耦合到外部调制电流源。 在顶部导电带的第二端和半导体光学器件之间沉积薄膜电阻器。 该薄膜电阻用于提供光学装置与带状线之间的阻抗匹配。 也就是说,对于具有阻抗ZL的激光器和设计成具有阻抗ZS的带状线,选择电阻R使得R + ZL = ZS。 利用硅处理技术,可以将薄膜电阻器放置在与激光器相邻的位置,从而减少与其互连相关联的寄生效应。 通过衬底形成导电通孔,以提供通过提供顶侧部位将光学器件连接到底部金属导体的顶侧接合位置,与该互连相关联的寄生电感显着降低。
    • 20. 发明授权
    • Acoustic mirror materials for acoustic devices
    • 用于声学设备的声镜材料
    • US06603241B1
    • 2003-08-05
    • US09576807
    • 2000-05-23
    • Bradley Paul BarberHarold Alexis HugginsRonald Eugene MillerDonald Winslow MurphyYiu-Huen Wong
    • Bradley Paul BarberHarold Alexis HugginsRonald Eugene MillerDonald Winslow MurphyYiu-Huen Wong
    • H03H925
    • H03H9/175
    • A reflector stack or acoustic mirror arrangement for an acoustic device is described which may attain the highest possible impedance mismatch between alternating higher and lower impedance reflecting layers of the stack, so as to maximize bandwidth. The arrangement may also reduce manufacturing costs by requiring fewer layers for the device, as compared to conventional acoustic mirrors. The thinner reflecting stack is accordingly fabricated in reduced time to lower cost, by incorporating materials providing a larger acoustic impedance mismatch than those currently obtainable. The bandwidth of the resulting acoustic resonator device may be widened, particularly when a low density material such as aerogel, CVD SiO2 and/or sputter deposited SiO2 is applied as topmost layer in the reflector stack/acoustic mirror arrangement of the device.
    • 描述了用于声学装置的反射器叠层或声镜装置,其可以在堆叠的交替的较高和较低阻抗反射层之间达到最高可能的阻抗失配,从而最大化带宽。 与传统的声反射镜相比,该装置还可以通过要求较少的器件层来降低制造成本。 因此,通过结合提供比目前可获得的更大的声阻抗失配的材料,减少了较薄的反射叠层,从而降低了成本。 特别是当诸如气凝胶,CVD SiO 2和/或溅射沉积的SiO 2之类的低密度材料作为装置的反射器叠层/声镜装置中的最顶层被施加时,所得到的声共振器装置的带宽可能变宽。