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    • 1. 发明申请
    • Bulk acoustic wave filter with reduced nonlinear signal distortion
    • 具有降低的非线性信号失真的体声波滤波器
    • US20080007369A1
    • 2008-01-10
    • US11484042
    • 2006-07-10
    • Bradley BarberSahana KenchappaRuss Reisner
    • Bradley BarberSahana KenchappaRuss Reisner
    • H03H9/58
    • H03H9/605H03H9/02086
    • A filter circuit includes at least one series resonator having a first terminal and a second terminal, where the first and second terminals of the at least one series resonator are coupled to an input and an output of the filter circuit, respectively. The filter circuit further includes at least one shunt resonator having a first terminal and a second terminal, where the first terminal of the at least one shunt resonator is coupled to the input of the filter circuit and the second terminal of the at least one shunt resonator is coupled to ground. A polarity of the first terminal of the at least one series resonator and a polarity of the first terminal of the at least one shunt resonator are selected so as to reduce harmonic signal generation and other types of distortion in the filter circuit.
    • 滤波器电路包括至少一个具有第一端子和第二端子的串联谐振器,其中至少一个串联谐振器的第一和第二端子分别耦合到滤波器电路的输入端和输出端。 滤波器电路还包括具有第一端子和第二端子的至少一个并联谐振器,其中至少一个并联谐振器的第一端子耦合到滤波器电路的输入端并且至少一个并联谐振器的第二端子 耦合到地面。 选择至少一个串联谐振器的第一端子的极性和至少一个并联谐振器的第一端子的极性,以便减少滤波器电路中的谐波信号产生和其它类型的失真。
    • 2. 发明申请
    • Semiconductor seal ring
    • 半导体密封环
    • US20070284762A1
    • 2007-12-13
    • US11442096
    • 2006-05-25
    • Bradley BarberTony LoBiancoDavid T. Young
    • Bradley BarberTony LoBiancoDavid T. Young
    • H01L23/544
    • H01L21/78
    • An improved semiconductor seal ring and method therefore is described. The seal ring comprises a thick layer wherein at least a portion of the thick layer is removed from a singulation street prior to singulation, thereby avoiding damage to the thick layer during the singulation process. A thin moisture-proof barrier layer is preferably deposited over at least a portion of the thick layer to seal at least an edge of the thick layer. A thick nonmetallic layer preferably used for fabrication of active circuit elements may advantageously be employed as the thick layer (for example, an aluminum nitride (AlN) layer in, for example, a bulk acoustic wave (BAW) filter device). A thin amorphous nonmetallic layer (e.g., a silicon nitride (SiN) layer) may preferably be deposited over the thick layer. Alternatively, other materials may be used.
    • 因此,描述了改进的半导体密封环和方法。 密封环包括厚层,其中在切割之前,从切割街道中去除厚层的至少一部分,从而避免在切割过程中损坏厚层。 优选在厚层的至少一部分上沉积薄的防湿屏障层,以密封厚层的至少一个边缘。 优选用于制造有源电路元件的厚非金属层可以有利地用作厚层(例如,例如在体声波(BAW)滤波器装置中的氮化铝(AlN)层)。 薄的非晶非金属层(例如,氮化硅(SiN)层)可优选沉积在厚层上。 或者,也可以使用其他材料。
    • 3. 发明授权
    • Semiconductor seal ring and method of manufacture thereof
    • 半导体密封圈及其制造方法
    • US08143105B2
    • 2012-03-27
    • US12466064
    • 2009-05-14
    • Bradley BarberTony LoBiancoDavid T. Young
    • Bradley BarberTony LoBiancoDavid T. Young
    • H01L21/44H01L21/48H01L21/50
    • H01L21/78
    • An improved semiconductor seal ring and method therefore is described. The seal ring comprises a thick layer wherein at least a portion of the thick layer is removed from a singulation street prior to singulation, thereby avoiding damage to the thick layer during the singulation process. A thin moisture-proof barrier layer is preferably deposited over at least a portion of the thick layer to seal at least an edge of the thick layer. A thick nonmetallic layer preferably used for fabrication of active circuit elements may advantageously be employed as the thick layer (for example, an aluminum nitride (AlN) layer in, for example, a bulk acoustic wave (BAW) filter device). A thin amorphous nonmetallic layer (e.g., a silicon nitride (SiN) layer) may preferably be deposited over the thick layer. Alternatively, other materials may be used.
    • 因此,描述了改进的半导体密封环和方法。 密封环包括厚层,其中在切割之前,从切割街道中去除厚层的至少一部分,从而避免在切割过程中损坏厚层。 优选在厚层的至少一部分上沉积薄的防湿屏障层,以密封厚层的至少一个边缘。 优选用于制造有源电路元件的厚非金属层可以有利地用作厚层(例如,例如在体声波(BAW)滤波器装置中的氮化铝(AlN)层)。 薄的非晶非金属层(例如,氮化硅(SiN)层)可优选沉积在厚层上。 或者,也可以使用其他材料。
    • 4. 发明申请
    • SEMICONDUCTOR SEAL RING AND METHOD OF MANUFACTURE THEREOF
    • 半导体密封圈及其制造方法
    • US20090221129A1
    • 2009-09-03
    • US12466064
    • 2009-05-14
    • Bradley BarberTony LoBiancoDavid T. Young
    • Bradley BarberTony LoBiancoDavid T. Young
    • H01L21/78
    • H01L21/78
    • An improved semiconductor seal ring and method therefore is described. The seal ring comprises a thick layer wherein at least a portion of the thick layer is removed from a singulation street prior to singulation, thereby avoiding damage to the thick layer during the singulation process. A thin moisture-proof barrier layer is preferably deposited over at least a portion of the thick layer to seal at least an edge of the thick layer. A thick nonmetallic layer preferably used for fabrication of active circuit elements may advantageously be employed as the thick layer (for example, an aluminum nitride (AlN) layer in, for example, a bulk acoustic wave (BAW) filter device). A thin amorphous nonmetallic layer (e.g., a silicon nitride (SiN) layer) may preferably be deposited over the thick layer. Alternatively, other materials may be used.
    • 因此,描述了改进的半导体密封环和方法。 密封环包括厚层,其中在切割之前,从切割街道中去除厚层的至少一部分,从而避免在切割过程中损坏厚层。 优选在厚层的至少一部分上沉积薄的防湿屏障层,以密封厚层的至少一个边缘。 优选用于制造有源电路元件的厚非金属层可以有利地用作厚层(例如,例如在体声波(BAW)滤波器装置中的氮化铝(AlN)层)。 薄的非晶非金属层(例如,氮化硅(SiN)层)可优选沉积在厚层上。 或者,也可以使用其他材料。
    • 5. 发明授权
    • Semiconductor seal ring
    • 半导体密封环
    • US07557430B2
    • 2009-07-07
    • US11442096
    • 2006-05-25
    • Bradley BarberTony LoBiancoDavid T. Young
    • Bradley BarberTony LoBiancoDavid T. Young
    • H01L23/544
    • H01L21/78
    • An improved semiconductor seal ring and method therefore is described. The seal ring comprises a thick layer wherein at least a portion of the thick layer is removed from a singulation street prior to singulation, thereby avoiding damage to the thick layer during the singulation process. A thin moisture-proof barrier layer is preferably deposited over at least a portion of the thick layer to seal at least an edge of the thick layer. A thick nonmetallic layer preferably used for fabrication of active circuit elements may advantageously be employed as the thick layer (for example, an aluminum nitride (AlN) layer in, for example, a bulk acoustic wave (BAW) filter device). A thin amorphous nonmetallic layer (e.g., a silicon nitride (SiN) layer) may preferably be deposited over the thick layer. Alternatively, other materials may be used.
    • 因此,描述了改进的半导体密封环和方法。 密封环包括厚层,其中在切割之前,从切割街道中去除厚层的至少一部分,从而避免在切割过程中损坏厚层。 优选在厚层的至少一部分上沉积薄的防湿屏障层,以密封厚层的至少一个边缘。 优选用于制造有源电路元件的厚非金属层可以有利地用作厚层(例如,例如在体声波(BAW)滤波器装置中的氮化铝(AlN)层)。 薄的非晶非金属层(例如,氮化硅(SiN)层)可优选沉积在厚层上。 或者,也可以使用其他材料。
    • 6. 发明授权
    • Bulk acoustic wave filter with reduced nonlinear signal distortion
    • 具有降低的非线性信号失真的体声波滤波器
    • US07535323B2
    • 2009-05-19
    • US11484042
    • 2006-07-10
    • Bradley BarberSahana KenchappaRuss Reisner
    • Bradley BarberSahana KenchappaRuss Reisner
    • H03H9/54
    • H03H9/605H03H9/02086
    • A filter circuit includes at least one series resonator having a first terminal and a second terminal, where the first and second terminals of the at least one series resonator are coupled to an input and an output of the filter circuit, respectively. The filter circuit further includes at least one shunt resonator having a first terminal and a second terminal, where the first terminal of the at least one shunt resonator is coupled to the input of the filter circuit and the second terminal of the at least one shunt resonator is coupled to ground. A polarity of the first terminal of the at least one series resonator and a polarity of the first terminal of the at least one shunt resonator are selected so as to reduce harmonic signal generation and other types of distortion in the filter circuit.
    • 滤波器电路包括至少一个具有第一端子和第二端子的串联谐振器,其中至少一个串联谐振器的第一和第二端子分别耦合到滤波器电路的输入端和输出端。 滤波器电路还包括具有第一端子和第二端子的至少一个并联谐振器,其中至少一个并联谐振器的第一端子耦合到滤波器电路的输入端并且至少一个并联谐振器的第二端子 耦合到地面。 选择至少一个串联谐振器的第一端子的极性和至少一个并联谐振器的第一端子的极性,以便减少滤波器电路中的谐波信号产生和其它类型的失真。
    • 7. 发明授权
    • Acoustic mirror structure for a bulk acoustic wave structure and method for fabricating same
    • 用于体声波结构的声镜结构及其制造方法
    • US07414350B1
    • 2008-08-19
    • US11367559
    • 2006-03-03
    • Bradley BarberPaul P. GehlertSahana KenchappaChristopher F. Shepard
    • Bradley BarberPaul P. GehlertSahana KenchappaChristopher F. Shepard
    • H01L41/08
    • H03H9/175Y10T29/42
    • According to one embodiment of the invention, an acoustic mirror structure situated in a bulk acoustic wave structure includes a number of alternating low acoustic impedance and high acoustic impedance layers situated on a substrate. Each high acoustic impedance layer includes a first mole percent of a primary metal and a second mole percent of a secondary metal, where the first mole percent of the primary metal is greater than the second mole percent of the secondary metal, and where the secondary metal causes each high acoustic impedance layer to have increased resistivity. According to this exemplary embodiment, the second mole percent of the secondary metal can cause only a minimal decrease in density of each high acoustic impedance layer. The increased resistivity of each high acoustic impedance layer can cause a reduction in electrical loss in the bulk acoustic wave structure.
    • 根据本发明的一个实施例,位于体声波结构中的声镜结构包括位于衬底上的多个交替的低声阻抗和高声阻抗层。 每个高声阻抗层包括第一摩尔百分数的第一金属和第二摩尔百分比的二次金属,其中第一摩尔百分比的主金属大于第二摩尔百分比的二次金属,并且其中二次金属 导致每个高声阻抗层具有增加的电阻率。 根据该示例性实施方案,二次金属的第二摩尔百分数可以仅导致每个高声阻抗层的密度的最小降低。 每个高声阻抗层的电阻率增加可能导致体声波结构中的电损耗减小。
    • 9. 发明授权
    • Method and structure for reducing the effect of vertical steps in patterned layers in semiconductor structures
    • 用于减小半导体结构中图案化层中的垂直台阶的影响的方法和结构
    • US07544612B1
    • 2009-06-09
    • US11336239
    • 2006-01-20
    • Bradley Barber
    • Bradley Barber
    • H01L21/302
    • H01L49/02H03H3/0072H03H9/02133H03H2009/0248
    • According to an exemplary embodiment, a method for fabricating a multilayer semiconductor structure includes forming first and second patterned segments, where a first patterned segment sidewall is separated from a second patterned segment sidewall by a first gap; forming a first conformal layer over first and second patterned segments and first gap, where the first conformal layer forms a depression over the first gap; forming a third patterned segment in the depression such that a third patterned segment sidewall is separated from the first patterned segment sidewall by a distance, where the third patterned segment sidewall is separated from a depression sidewall by a second gap; and forming a second conformal layer over the first conformal layer, third patterned segment, and second gap, where a dip is formed in the second conformal layer over the second gap. The distance is controlled so as to reduce a size of the dip.
    • 根据示例性实施例,制造多层半导体结构的方法包括形成第一和第二图案化区段,其中第一图案化区段侧壁与第二图案化区段侧壁与第一间隙分离; 在第一和第二图案化区段和第一间隙上形成第一共形层,其中第一共形层在第一间隙上形成凹陷; 在所述凹陷中形成第三图案化区段,使得第三图案化区段侧壁与所述第一图案化区段侧壁分开一段距离,其中所述第三图案化区段侧壁与凹陷侧壁隔开第二间隙; 以及在第一共形层,第三图案化段和第二间隙上形成第二共形层,其中在第二间隙上在第二共形层中形成浸渍。 控制距离以减小浸渍的尺寸。