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11. 发明授权

US4647852A Contact probe assembly 失效
标题翻译：接触探头组件
公开(公告)号：US4647852A
公开(公告)日：1987-03-03
申请号：US782949
申请日：1985-09-25
申请人： Grant M. Smith , George J. Sprenkle
发明人： Grant M. Smith , George J. Sprenkle
IPC分类号： G01R31/28 , G01R31/02 , G01R1/06
CPC分类号： H01R12/714 , G01R31/2808
摘要： The present disclosure describes an assembly which has particular application in the testing of printed circuit boards. More specifically, the assembly is comprised of an apertured holding plate which is registered with the board under test, and a probe subassembly. The latter includes a body member having a spring-actuated plunger type probe and a hook-like member. In operation, the body member is advanced toward the plate and the probe and hook-like member enter respective plate apertures. As electrical contact is made by the probe with a desired test location on the board, the hook-like member locks the body onto the plate. The body member is so formed that subsequent pressure applied thereto will release it from its locked condition.
摘要翻译：本公开描述了在印刷电路板的测试中具有特殊应用的组件。更具体地，该组件包括与被测试板配准的多孔保持板和探针子组件。后者包括具有弹簧致动柱塞型探针和钩状构件的主体构件。在操作中，主体部件朝向板前进，探针和钩状部件进入相应的板孔。由于通过探针在板上具有期望的测试位置进行电接触，钩状构件将身体锁定在板上。主体构件形成为随后施加的压力将其从其锁定状态释放。

12. 发明授权

US4447835A Method and apparatus for single frame recording on video tape 失效
标题翻译：在录像带上单帧录制的方法和装置
公开(公告)号：US4447835A
公开(公告)日：1984-05-08
申请号：US338360
申请日：1982-01-11
申请人： Grant M. Smith
发明人： Grant M. Smith
IPC分类号： H04N5/7826 , G11B5/588 , G11B27/024 , H04N5/783 , H04N5/92 , H04N5/78 , G11B21/02
CPC分类号： G11B5/588 , G11B27/024 , H04N5/783
摘要： A method and an apparatus for frame-by-frame recording of an RF signal on a magnetic tape uses a video tape recorder (VTR) having a dynamic tracking head. While the tape is stopped, the tracking control voltage generated by the VTR during the playback of a prerecorded tape segment is stored. The tape is then moved to the desired location and stopped. The stored tracking control voltage is then applied to the dynamic tracking head during the recording of a new set of RF signals representative of a video frame.
摘要翻译：用于在磁带上逐帧记录RF信号的方法和装置使用具有动态跟踪头的磁带录像机（VTR）。当磁带停止时，存储在预先记录的磁带段的重放期间由VTR产生的跟踪控制电压。然后将磁带移动到所需的位置并停止。在记录代表视频帧的一组新的RF信号期间，存储的跟踪控制电压被施加到动态跟踪头。

13. 发明授权

US07054155B1 Fan tray assembly 失效
标题翻译：风扇盘组件
公开(公告)号：US07054155B1
公开(公告)日：2006-05-30
申请号：US10390369
申请日：2003-03-17
申请人： Keith D. Mease , Grant M. Smith , John Ruscitelli
发明人： Keith D. Mease , Grant M. Smith , John Ruscitelli
IPC分类号： H05K7/20
CPC分类号： H05K7/20581
摘要： A fan tray assembly. The assembly comprises a module, housing electronic components that require cooling, and one or more fan trays having fans that direct a cooling air flow through the module. The assembly facilitates easy and fast removal and replacement of the fan trays with respect to the module. These desirable attributes are achieved by five main features of the assembly: (1) a retaining slot-and-tab engagement pivotally attaching each fan tray to one side of the module, (2) a channel-in-track automatically aligning each fan tray as it closes against the module, (3) a leaf spring releasably locking each fan tray into a closed position, (4) a floating power-and-signal connector on each fan tray electrically and mechanically engaging a corresponding receptacle on the module, and (5) a pull ring facilitating manipulation of each fan tray.
摘要翻译：风扇盘组件。组件包括模块，容纳需要冷却的电子部件，以及一个或多个风扇盘，其具有引导冷却空气流通过模块的风扇。该组件有助于相对于模块容易且快速地移除和更换风扇盘。这些所需的属性通过组件的五个主要特征来实现：（1）保持槽和接头接合枢转地将每个风扇盘连接到模块的一侧，（2）通道在轨道中自动对准每个风扇盘（3）可释放地将每个风扇盘片锁定到关闭位置的板簧，（4）每个风扇盘上的浮动电源和信号连接器电气和机械地接合模块上的相应插座，以及（5）拉环，便于操纵每个风扇盘。

14. 发明授权

US06970348B2 Modular packaging configuration and system and method of use for a computer system adapted for operating multiple operating systems in different partitions 失效
标题翻译：模块化封装配置以及适用于在不同分区中操作多个操作系统的计算机系统的系统和方法
公开(公告)号：US06970348B2
公开(公告)日：2005-11-29
申请号：US10242163
申请日：2002-09-12
申请人： Mark R. Treiber , Peter P. Klein , N. Kenneth Newman , Grant M. Smith
发明人： Mark R. Treiber , Peter P. Klein , N. Kenneth Newman , Grant M. Smith
IPC分类号： G06F1/18 , G06F1/16
CPC分类号： G06F1/185 , G06F1/181 , G06F1/183 , G06F1/184 , G06F1/186
摘要： A packaging configuration is provided for a computer system that is adapted for operating multiple operating systems in different partitions of the computer system. The packaging configuration includes a main chassis having a main circuit board. The packaging configuration also includes a processor assembly configured for insertion into the main chassis. The processor assembly has a circuit board for connection to the main circuit board upon insertion of the processor assembly. The packaging configuration also includes a processor subassembly configured for insertion into the processor assembly. The processor subassembly includes a circuit board and a processor and is configured for connection with a circuit board in the processor assembly upon insertion of the processor subassembly. The processor assembly is removable from the main chassis without powering down the computer system, and the processor subassembly is removable from the processor assembly without powering down the computer system.
摘要翻译：为适用于在计算机系统的不同分区中操作多个操作系统的计算机系统提供包装配置。封装结构包括具有主电路板的主机架。包装配置还包括配置成插入主机架的处理器组件。处理器组件具有用于在插入处理器组件时连接到主电路板的电路板。该包装配置还包括配置成插入到处理器组件中的处理器子组件。处理器子组件包括电路板和处理器，并且被配置为在插入处理器子组件时与处理器组件中的电路板连接。处理器组件可从主机架拆卸而不关闭计算机系统，并且处理器子组件可从处理器组件移除而不关闭计算机系统电源。

15. 发明授权

US06288899B1 Method and apparatus for heat dissipation in a multi-processor module 有权
标题翻译：多处理器模块中散热的方法和装置
公开(公告)号：US06288899B1
公开(公告)日：2001-09-11
申请号：US09500879
申请日：2000-02-09
申请人： Grant M. Smith
发明人： Grant M. Smith
IPC分类号： H05K720
CPC分类号： H05K7/20909
摘要： This invention provides a heat sink for dissipating heat from an electronic component to be cooled by air flow. The heat sink includes a base configured to be mounted to the electronic component to receive heat transferred from the electronic component. The base has a center extending along the direction of air flow. The heat sink also includes a plurality of fins projecting from the base. Each of two adjacent fins is positioned on opposite sides of the center of the base and is spaced laterally from the center of the base. The adjacent fins define a gap extending across the center of the base. The gap between the adjacent fins reduces the temperature increase of air flowing adjacent the center of the base. This invention also provides a circuit assembly and a method for cooling an electronic component.
摘要翻译：本发明提供一种用于从通过气流冷却的电子部件散热的散热器。散热器包括被配置为安装到电子部件以接收从电子部件传送的热量的基座。基座具有沿气流方向延伸的中心。散热器还包括从基座突出的多个翅片。两个相邻翅片中的每一个定位在基部的中心的相对侧上并且与基部的中心横向间隔开。相邻的翅片限定跨越基座的中心延伸的间隙。相邻翅片之间的间隙减小了靠近基座中心的空气的温度升高。本发明还提供一种用于冷却电子部件的电路组件和方法。

16. 发明授权

US06217440B1 Air mover system with reduced reverse air flow 失效
标题翻译：具有减少反向气流的气动系统
公开(公告)号：US06217440B1
公开(公告)日：2001-04-17
申请号：US09182273
申请日：1998-10-29
申请人： Mark William Wessel , Grant M. Smith
发明人： Mark William Wessel , Grant M. Smith
IPC分类号： H05K720
CPC分类号： H05K7/20172
摘要： An air mover system is provided having plural air movers each mounted along an air flow path. Each of the air movers includes means mounted for forward rotation to generate forward air flow. Each of the air movers also includes means for preventing reverse rotation of the air flow generating means, thereby reducing reverse air flow.
摘要翻译：提供具有多个沿空气流动路径安装的空气推动器的鼓风机系统。每个促动器包括安装成正向旋转以产生向前空气流的装置。每个升降机还包括用于防止气流发生装置的反向旋转的装置，从而减少反向气流。

17. 发明授权

US06987667B1 Computer system and method configured for improved cooling 失效
标题翻译：配置为改善冷却的计算机系统和方法
公开(公告)号：US06987667B1
公开(公告)日：2006-01-17
申请号：US10390370
申请日：2003-03-17
申请人： Keith D. Mease , Grant M. Smith
发明人： Keith D. Mease , Grant M. Smith
IPC分类号： G06F1/20
CPC分类号： H05K7/20727 , G06F1/183 , G06F1/20
摘要： A computer subassembly is configured to be mounted within a rack along an insertion axis. The computer subassembly includes a chassis configured for insertion into and removal from the rack along the insertion axis, wherein the chassis at least partially defines an interior. An interconnect assembly is mounted within or adjacent the interior of the chassis, and the interconnect assembly is oriented along a plane that is substantially parallel to the insertion axis. At lease one circuit assembly is positioned at least partially within the interior of the chassis and is connected to the interconnect assembly. The circuit assembly is oriented in a plane substantially parallel to the insertion axis. A source of cooling air is positioned to direct cooling air through the interior of the chassis along the insertion axis.
摘要翻译：计算机子组件被配置为沿着插入轴线安装在机架内。计算机子组件包括被配置为沿着插入轴线插入和移出齿条的底盘，其中底盘至少部分地限定内部。互连组件安装在底座内部或附近，并且互连组件沿着基本上平行于插入轴线的平面定向。至少一个电路组件至少部分地定位在机架的内部并且连接到互连组件。电路组件在基本上平行于插入轴线的平面中取向。冷却空气源被定位成沿着插入轴线引导冷却空气通过底盘的内部。

18. 发明授权

US5986887A Stacked circuit board assembly adapted for heat dissipation 有权
标题翻译：堆叠电路板组件适用于散热
公开(公告)号：US5986887A
公开(公告)日：1999-11-16
申请号：US181448
申请日：1998-10-28
申请人： Grant M. Smith , Vladimir K. Tamarkin
发明人： Grant M. Smith , Vladimir K. Tamarkin
IPC分类号： H01L23/36 , H01L23/40 , H05K1/14 , H05K7/20
CPC分类号： H05K7/20509 , H05K1/144
摘要： An apparatus is provided for dissipating heat from a stacked circuit board assembly. The apparatus includes circuit boards that are oriented in spaced planes that extend substantially parallel to one another. A heat transfer means connected to the circuit boards transfers heat between the circuit boards. A heat dissipation means connected to at least one of the circuit boards dissipates at least a portion of the transferred heat.
摘要翻译：提供了用于从堆叠的电路板组件散热的装置。该装置包括基本上彼此平行延伸的间隔开的平面定向的电路板。连接到电路板的传热装置在电路板之间传递热量。连接到至少一个电路板的散热装置耗散至少一部分转移的热量。

19. 发明授权

US5717572A Passively cooled display door 失效
标题翻译：被动冷却显示门
公开(公告)号：US5717572A
公开(公告)日：1998-02-10
申请号：US389110
申请日：1995-02-15
申请人： Grant M. Smith , Peter P. Klein
发明人： Grant M. Smith , Peter P. Klein
IPC分类号： G06F1/20 , H05K7/20
CPC分类号： G06F1/20
摘要： The cooling of a heat generating component mounted outside of the main portion of an enclosure that is cooled using an airstream created by an active air handler is disclosed. The invention is preferably used to cool components such as displays that generate heat, but which are mounted outside the enclosure that houses the main electronics package. The disclosed system, permits inlet air to enter via a vent, and a first duct formed by a baffle routes the inlet air along the back of the displays, removing excess heat. The air is then channeled by a second duct to an area adjacent the enclosure. Since the airstream within the enclosure has created a low pressure area, the passive air stream infiltrates the enclosure and mixes with the main airstream. The disclosed system thus cools the remotely mounted components passively, without requiring additional air handlers or diminishing the pressure and velocity within the enclosure.
摘要翻译：公开了使用由主动式空气处理器产生的气流来冷却的外壳主体部分外部的发热部件的冷却。本发明优选用于冷却诸如产生热量的显示器之类的组件，但是它们被安装在容纳主电子组件的外壳外部。所公开的系统允许入口空气经由通风口进入，并且由挡板形成的第一管道沿着显示器的背面路由入口空气，从而去除多余的热量。然后空气被第二管道引导到邻近外壳的区域。由于外壳内的气流产生了低压区域，被动空气流渗入外壳并与主气流混合。所公开的系统因此无源地冷却远程安装的部件，而不需要额外的空气处理器或减小外壳内的压力和速度。

20. 发明授权

US5574626A Add-on heat sink 失效
标题翻译：附加散热器
公开(公告)号：US5574626A
公开(公告)日：1996-11-12
申请号：US501479
申请日：1995-07-12
申请人： Grant M. Smith
发明人： Grant M. Smith
IPC分类号： H01L23/367 , H01L23/40 , H05K7/20
CPC分类号： H01L23/3672 , H01L23/367 , H01L23/4093 , H01L2924/0002
摘要： An add-on heat sink for increasing the thermal efficiency of an existing heat sink comprises a support base, a first plurality of fins extending from the support base for dissipating heat and a second plurality of spaced fins extending from the support base that are arranged to intermesh with the fins of the existing heat sink and to form an interference fit therewith, whereby the add-on heat sink can be removably attached to the existing heat sink.
摘要翻译：用于提高现有散热器的热效率的附加散热器包括支撑基座，从支撑基座延伸以散发热量的第一多个翅片以及从支撑基座延伸的第二多个隔开的翅片，其布置成与现有散热器的翅片相互啮合并与其形成过盈配合，由此附加散热器可拆卸地连接到现有散热器。

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