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    • 12. 发明申请
    • DESIGN TOOL FOR THE TYPE AND FORM OF A CIRCUIT PRODUCTION
    • 电路生产类型和形式的设计工具
    • US20110167399A1
    • 2011-07-07
    • US12599115
    • 2008-05-07
    • Michael SchroederKarl-Heinz KueferDmitry-David Polityko
    • Michael SchroederKarl-Heinz KueferDmitry-David Polityko
    • G06F17/50
    • G06F17/5045
    • The invention relates to a method for influencing a selecting a “type and form of a circuit implementation” in at least one layer (L1,L2) in a given integration task for an integrated circuit or many thereof aggregated in a wafer composite, a module on a 2-dimensional carrier substrate, or a compact module. A plurality of electric or electronic components is spatially arranged and electrically conductively to be connected. To this end a plurality of completed solutions x (5;5a,5b) are stored and available in a database (10), and each of the completed solutions includes a set of properties, wherein each set includes at least one of the following properties for the given integration task: a technology for integration, a package or installation size, a number of layers (physical layers) for conductors or line in a vertical direction and a line length or conductor length. The completed solutions (5) stored in the database (10) of the given integration task define a destination space (40), from which a solution (5b) is selectable by means of operating elements (21,22), which solution determines type & form of the circuit implementation as a result of the given integration task, and aggregates the plurality of electric and electronic components in one of a plurality of integration technologies. In this way, the design time can be reduced.
    • 本发明涉及一种用于影响集成在晶片复合体中的集成电路或其中许多集合在给定的集成任务中的至少一层(L1,L2)中的“电路实现的类型和形式”的方法,模块 在二维载体基板上,或紧凑模块。 多个电气或电子部件在空间上布置并导电地连接。 为此,多个完成的解决方案x(5; 5a,5b)被存储并在数据库(10)中可用,并且每个完成的解决方案包括一组属性,其中每个集合包括以下属性中的至少一个 对于给定的集成任务:集成技术,封装或安装尺寸,导体的多个层(物理层)或垂直方向的线和线长度或导体长度。 存储在给定集成任务的数据库(10)中的完成的解决方案(5)定义目的地空间(40),借助于操作元素(21,22)可以选择解(5b),该解决方案确定类型 并且作为给定的集成任务的结果的电路实现的形式,并且以多种集成技术之一聚合多个电气和电子部件。 以这种方式,可以减少设计时间。
    • 15. 发明申请
    • Package System
    • 包装系统
    • US20070193913A1
    • 2007-08-23
    • US11739720
    • 2007-04-25
    • Michael Schroeder
    • Michael Schroeder
    • B65D21/00B65D85/62
    • B65D21/0237B65B61/202B65D21/0231B65D23/12
    • A package system which combines an article and a container in an integrated package with the article secured in nested relationship within a recess of the container. The recess has sufficient depth such that portions of the side walls of the container extend outwardly effectively beyond an exposed surface of the article so as to protect the article against damage. Alternatively, the package system includes a pair of spaced columns which are integrally formed with the side wall of the container and which extend outwardly from the side wall. A recess is formed between the column members which is configured to receive an article in nested relationship within the recess. Methods for securing the article in nested relationship within the recess of the container are also disclosed.
    • 一种包装系统,其将物品与集成包装中的容器结合,所述物品以嵌套的关系固定在容器的凹部内。 凹部具有足够的深度,使得容器的侧壁的一部分有效地向外延伸超出制品的暴露表面,以便保护制品免受损坏。 或者,包装系统包括与容器的侧壁一体形成并且从侧壁向外延伸的一对间隔开的列。 在柱构件之间形成凹陷,所述柱构件构造成在凹部内以嵌套的关系接收物品。 还公开了在容器的凹部内将嵌套关系固定在一起的方法。
    • 18. 发明授权
    • Tool for the type and form of a circuit production
    • 电路生产的类型和形式的工具
    • US08645900B2
    • 2014-02-04
    • US12599115
    • 2008-05-07
    • Michael SchroederKarl-Heinz KueferDmitry-David Polityko
    • Michael SchroederKarl-Heinz KueferDmitry-David Polityko
    • G06F17/50
    • G06F17/5045
    • The invention relates to a method for influencing the selection of a type and form of a circuit implementation in at least one layer in a given integration task for at least one integrated circuit in a wafer composite, a module on a 2-dimensional carrier substrate, or a compact module. In one embodiment, a plurality of electric or electronic components are spatially arranged and to be electrically connected. Completed solutions x are stored in a database, and each of the completed solutions includes properties for the given integration task. The completed solutions define a destination space from which a solution is selectable by operating elements and determines a type and form of circuit implementation as a result of the given integration task, and aggregates the plurality of electric and electronic components in one of a plurality of integration technologies.
    • 本发明涉及一种用于影响在晶片复合材料中的至少一个集成电路的给定的集成任务中的至少一个层中的电路实现的类型和形式的选择的方法,二维载体衬底上的模块, 或紧凑型模块。 在一个实施例中,多个电气或电子部件在空间上布置并且被电连接。 完成的解决方案x存储在数据库中,并且每个完成的解决方案都包括给定集成任务的属性。 完成的解决方案定义目的地空间,通过操作元素可以从中选择解决方案,并且通过给定的集成任务确定电路实现的类型和形式,并将多个电气和电子组件聚合成多个集成 技术。